Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.
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LH7A404N0E000B0A
NXP Semiconductors
Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;
S-XBGA-B324
324
70 Cel
0 Cel
CERAMIC
FBGA
BGA324,20X20,32
SQUARE
GRID ARRAY, FINE PITCH
1.8,3.3
Not Qualified
Other uPs/uCs/Peripheral ICs
YES
COMMERCIAL
BALL
.8 mm
BOTTOM
DM355SDZCE135
Texas Instruments
The Texas Instruments DM355SDZCE135 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.
IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O
32
FIXED POINT
S-PBGA-B337
e1
13 mm
3
337
85 Cel
PLASTIC/EPOXY
LFBGA
BGA337,19X19,25
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1.3,1.8,3.3
8192
1.3 mm
Digital Signal Processors
1.365 V
1.235 V
1.3 V
CMOS
OTHER
TIN SILVER COPPER
.65 mm
30
MICROPROCESSOR CIRCUIT
DM355SDZCE216
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;
DM355SDZCE270
The Texas Instruments DM355SDZCE270 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile, fine pitch package styles in surface mount configurations.
DM355SDZCEA216
DM355SDZCEA216 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.365V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.
I2C; SPI; UART; USB
100 Cel
-40 Cel
INDUSTRIAL
TMS320DM355CZCE216
TMS320DM355CZCEA21
TMS320DM355CZCEA21 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at -40 to 100 °C. It features a 1.3 V nominal voltage, I2C, SPI, UART, USB compatibility and is ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a SQUARE package with PLASTIC/EPOXY body material.
TMS320DM355DZCE216
TMS320DM355DZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at 1.3V nominal voltage and supports I2C, SPI, UART, and USB buses. Ideal for applications requiring low profile, fine pitch package style in the temperature range of 0-85°C.
TMS320DM355DZCE270
TMS320DM355DZCE270 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85 °C and supports I2C, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT has a package style of GRID ARRAY and is suitable for various applications requiring low profile and fine pitch components.
TMS320DM355DZCEA21
TMS320DM355DZCEA21 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 100°C and supports I2C, SPI, UART, and USB buses. This industrial-grade IC has a package style of grid array with low profile and fine pitch for various applications.
TMX320DM355ZCE216
NOT SPECIFIED
32768
TMX320DM355ZCE270
Texas Instruments TMX320DM355ZCE270 is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.365V and RAM words of 32768, suitable for MICROPROCESSOR CIRCUIT applications in various industries.
SM32DM355GCEM216EP
Texas Instruments SM32DM355GCEM216EP is a 32-bit microprocessor with 8192 RAM words. It operates b/w -55 to 125 °C and supports I2C, SPI, UART, USB buses. Ideal for military-grade applications due to its CMOS technology and low profile grid array package style.
e0
125 Cel
-55 Cel
MILITARY
TIN LEAD
TMS320DM6441AZWT
TMS320DM6441AZWT by Texas Instruments is a 32-bit microprocessor with 16384 RAM words, operating at temperatures from 0 to 85°C. It features a package style of grid array, low profile, fine pitch and supports bus compatibility with Ethernet, I2C, SPI, UART, and USB. Ideal for applications requiring high-performance processing in compact spaces.
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY
ETHERNET; I2C; SPI; UART; USB
48
S-PBGA-B361
16 mm
361
BGA361,19X19,32
1.2,1.8,3.3
16384
1.4 mm
1.1 V
1 V
1.05 V
XA7Z010-1CLG225Q
Xilinx
XA7Z010-1CLG225Q by Xilinx is a MICROPROCESSOR CIRCUIT with 225 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Featuring CMOS technology, it has a 0.8 mm terminal pitch and TIN SILVER COPPER finish.
S-PBGA-B225
225
BGA225,15X15,32
1,1.8
AEC-Q100
1.5 mm
AUTOMOTIVE
N
XA7Z010-1CLG400I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA400,20X20,32;
S-PBGA-B400
17 mm
400
BGA400,20X20,32
1.6 mm
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
XA7Z010-1CLG400Q
XA7Z010-1CLG400Q by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The CMOS technology, low profile design, and fine pitch make it ideal for compact electronic systems.
XA7Z020-1CLG400I
XA7Z020-1CLG400I by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates at 1-1.8V, CMOS technology, and has a terminal pitch of 0.8mm. Ideal for applications requiring low profile and fine pitch components in automotive electronics or industrial control systems.
XA7Z020-1CLG400Q
XA7Z020-1CLG400Q by Xilinx is an automotive-grade microprocessor circuit with 400 terminals in a low-profile grid array package. Operating b/w -40 to 125°C, it features power supplies of 1V and 1.8V, making it ideal for automotive applications requiring high-performance computing capabilities.
XA7Z020-1CLG484Q
XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.
S-PBGA-B484
19 mm
484
BGA484,22X22,32
XA7Z030-1FBG484I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Ultraviolet Erasable: N;
23 mm
4
BGA
BGA484,22X22,40
GRID ARRAY
250
2.54 mm
Tin/Silver/Copper (Sn/Ag/Cu)
1 mm
XA7Z030-1FBG484Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
TMS320DM6446BZWTA
TMS320DM6446BZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features a max operating temperature of 105°C and supports I2C, SPI, UART, and USB bus compatibility.
105 Cel
1.26 V
1.14 V
1.2 V
HTCM400/EAE,122
Other uPs/uCs/Peripheral ICs; Temperature Grade: OTHER; No. of Terminals: 27; Maximum Supply Current: 100 mA; Maximum Operating Temperature: 85 Cel; Package Body Material: PLASTIC/EPOXY;
27
-25 Cel
MODULE,27LEAD,1
MICROELECTRONIC ASSEMBLY
5
100 mA
5 V
P82B715TD,118
NXP Semiconductors P82B715TD,118 is an 8-terminal IC with a supply voltage range of 4.5V to 12V. Ideal for industrial applications, it operates b/w -40°C to 85°C and features a small outline package style. This bipolar technology peripheral IC is designed for microprocessor circuits in various electronic devices.
R-PDSO-G8
e4
4.9 mm
1
8
SOP
RECTANGULAR
SMALL OUTLINE
1.75 mm
12 V
4.5 V
BIPOLAR
NICKEL PALLADIUM GOLD
GULL WING
1.27 mm
DUAL
3.9 mm
PCA9504ADGG,112
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G56
14 mm
56
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.2 mm
3.6 V
3 V
3.3 V
.5 mm
6.1 mm
PCA9504ADGG,118
TDA8002CG/C1,518
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;
S-PQFP-G32
e3
5 mm
LFQFP
QFP32,.28SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
3.3/5
Other Microprocessor ICs
140 mA
6.5 V
TIN
QUAD
TDA8002CT/A/C1,512
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G28
17.9 mm
28
2.65 mm
7.5 mm
TDA8002CT/B/C1,512
TDA8002CT/C/C1,512
TDA8002CT/C/C1,518
TDA8007BHL/C2,118
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
S-PQFP-G48
7 mm
QFP48,.35SQ,20
3/5
315 mA
6 V
2.7 V
SILVER
TDA8007BHL/C3,118
3.3
Tin (Sn)
FT245BM
FTDI
FT245BM by FTDI is a 32-terminal peripheral IC with supply voltage range of 4.35V to 5.25V, operating temperature from 0°C to 70°C. It features GULL WING terminals, CMOS technology, and is ideal for MICROPROCESSOR CIRCUIT applications requiring low profile FLATPACK packaging.
LQFP
FLATPACK, LOW PROFILE
5.25 V
4.35 V
R3920-CFAB-E1T
Onsemi
R3920-CFAB-E1T by Onsemi is a CMOS microprocessor circuit with 25 terminals in a rectangular chip carrier package. It operates at temperatures from 0 to 40°C, with a clock frequency of up to 4.218 MHz. Ideal for applications requiring low power consumption and fixed-point processing in commercial-grade environments.
NO
4.218 MHz
R-PBCC-B25
5.59 mm
25
40 Cel
BCC
LGA25,3X8,27
CHIP CARRIER
1.781 mm
1.25 V
BUTT
.686 mm
3.18 mm
TCI6630K2LCMSA2
TCI6630K2LCMSA2 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and can withstand peak reflow temperature of 245°C for up to 30s. Ideal for high-performance computing applications requiring advanced processing capabilities.
S-PBGA-B900
900
245
.997 V
.902 V
.95 V
TCI6630K2LCMS
TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.
TCI6630K2LDCMSA2
TCI6630K2LDCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in electronic systems.
TCI6630K2LDCMSA
Texas Instruments TCI6630K2LDCMSA is a CMOS MICROPROCESSOR CIRCUIT with 900 BALL terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, with a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.
TCI6630K2LSCMSA2
TCI6630K2LSCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, suitable for surface mount applications. Operating b/w 0.902V to 0.997V, it offers high performance in various electronic systems.
TCI6630K2LSCMSA
TCI6630K2LSCMSA by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in compact electronic devices.
TCI6630K2LXCMS2
TCI6630K2LXCMS2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates on a supply voltage range of 0.902V to 0.997V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a peak reflow temperature of 245°C, this device offers reliable performance in demanding environments.
TCI6630K2LXCMSA2
Texas Instruments TCI6630K2LXCMSA2 is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages b/w 0.902V to 0.997V, utilizing CMOS technology. Ideal for applications requiring high-performance computing in compact form factors.
TCI6630K2LXCMSA
TCI6630K2LXCMSA by Texas Instruments is a microprocessor circuit with a max supply voltage of 0.997V and a min supply voltage of 0.902V. It is used in applications requiring high-performance processing capabilities.
TCI6630K2LXCMS
TCI6630K2LXCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.
MSP430F67491IPEUR
MSP430F67491IPEUR by Texas Instruments is a CMOS microprocessor circuit with 128 terminals. It operates b/w -40 to 85 °C and has a supply voltage range of 2.4V to 3.6V, making it ideal for industrial applications requiring low power consumption and high performance in a compact package.
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY
R-PQFP-G128
20 mm
128
2.4 V
MSP430F67491IPEU
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;
I2C; SPI; UART
MSP430
0
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