Loading...

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
CY8C21434-24LFXI by Cypress Semiconductor

CY8C21434-24LFXI

Cypress Semiconductor

CY8C21434-24LFXI by Cypress Semiconductor is a 32-terminal, CMOS technology-based Programmable SoC with a supply voltage range of 4.75V to 5.25V. It operates in industrial temperature range (-40°C to 85°C) and has a compact square package suitable for surface mount applications.

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

S-XQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/5

Not Qualified

.93 mm

Microcontrollers

5.25 V

4.75 V

5 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

40

5 mm

PROGRAMMABLE SoC

TMS320DM355ZCEA135 by Texas Instruments

TMS320DM355ZCEA135

Texas Instruments

TMS320DM355ZCEA135 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at -40 to 100°C. It features a max supply voltage of 1.365V and RAM of 32768 words. Ideal for industrial applications requiring a low-profile, fine-pitch package style.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

SM320DM6446AZWTA by Texas Instruments

SM320DM6446AZWTA

Texas Instruments

Texas Instruments SM320DM6446AZWTA is a 32-bit microprocessor with 20480 RAM words, operating at max 27 MHz clock frequency. Ideal for industrial applications, it supports I2C, SPI, UART, and USB bus compatibility in a low-profile grid array package.

ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY

32

I2C; SPI; UART; USB

27 MHz

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TIR1000IPWG4 by Texas Instruments

TIR1000IPWG4

Texas Instruments

TIR1000IPWG4 by Texas Instruments is an 8-terminal IC with a supply voltage range of 2.7V to 3.3V, suitable for industrial applications. It features a CMOS technology microprocessor circuit compatible with UART bus communication. The package style is small outline, thin profile, and shrink pitch, making it ideal for compact electronic devices.

CAN ALSO OPERATE AT 5V SUPPLY

UART

R-PDSO-G8

e4

4.4 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3/5

Not Qualified

1.2 mm

Serial IO/Communication Controllers

3.3 V

2.7 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

3 mm

MICROPROCESSOR CIRCUIT

TIR1000IPWRG4 by Texas Instruments

TIR1000IPWRG4

Texas Instruments

TIR1000IPWRG4 by Texas Instruments is an 8-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 2.7V to 3.3V. Ideal for industrial applications requiring UART bus compatibility in a small outline package style.

CAN ALSO OPERATE AT 5V SUPPLY

UART

R-PDSO-G8

e4

4.4 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3/5

Not Qualified

1.2 mm

Serial IO/Communication Controllers

3.3 V

2.7 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

3 mm

MICROPROCESSOR CIRCUIT

TIR1000PSRG4 by Texas Instruments

TIR1000PSRG4

Texas Instruments

TIR1000PSRG4 by Texas Instruments is a CMOS microprocessor circuit with 8 terminals, operating b/w 0-70°C. It has a supply voltage range of 2.7-3.3V and is surface mountable in a small outline package style. Ideal for commercial applications requiring compact and efficient processing capabilities.

CAN ALSO OPERATE AT 5V SUPPLY

R-PDSO-G8

e4

6.2 mm

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

2 mm

3.3 V

2.7 V

3 V

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

30

5.3 mm

MICROPROCESSOR CIRCUIT

STA2058EXATR by STMicroelectronics

STA2058EXATR

STMicroelectronics

STA2058EXATR by STMicroelectronics is a low-profile microprocessor circuit designed for industrial applications. It operates b/w 2.97V and 3.63V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

S-PBGA-B144

10 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.7 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR CIRCUIT

STA2058EXA by STMicroelectronics

STA2058EXA

STMicroelectronics

STA2058EXA by STMicroelectronics is a low-profile microprocessor circuit designed for industrial applications. It operates b/w 2.97V and 3.63V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

S-PBGA-B144

10 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.7 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR CIRCUIT

STA2058EXTR by STMicroelectronics

STA2058EXTR

STMicroelectronics

STA2058EXTR by STMicroelectronics is a low-profile microprocessor circuit designed for industrial applications. It operates b/w 2.97V and 3.63V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

S-PBGA-B144

10 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.7 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR CIRCUIT

STA2058EX by STMicroelectronics

STA2058EX

STMicroelectronics

STA2058EX by STMicroelectronics is a low-profile microprocessor circuit with a supply voltage range of 2.97V to 3.63V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 10mm x 10mm grid array package with 144 terminals. Ideal for industrial applications, it ensures reliable performance in demanding environments.

S-PBGA-B144

e1

10 mm

3

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.7 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

MICROPROCESSOR CIRCUIT

STA2058 by STMicroelectronics

STA2058

STMicroelectronics

STA2058 by STMicroelectronics is a low-profile microprocessor circuit with a supply voltage range of 2.97V to 3.63V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 64-terminal flatpack design, ideal for industrial applications. Its CMOS technology ensures efficient performance in space-constrained environments.

S-PQFP-G64

e4

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

Not Qualified

1.6 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

10 mm

MICROPROCESSOR CIRCUIT

STMPE16M31QTR by STMicroelectronics

STMPE16M31QTR

STMicroelectronics

STMPE16M31QTR by STMicroelectronics is a CMOS microprocessor circuit with a supply voltage range of 1.65V to 1.95V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 32-terminal, very thin profile package ideal for space-constrained applications. This versatile IC is perfect for industrial use, ensuring reliable performance in demanding environments.

S-XQCC-N32

e3

4 mm

3

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

40

4 mm

MICROPROCESSOR CIRCUIT

STMPE24M31QTR by STMicroelectronics

STMPE24M31QTR

STMicroelectronics

STMPE24M31QTR by STMicroelectronics is a CMOS microprocessor circuit with a supply voltage range of 1.65V to 1.95V and operates in extreme temperatures from -40 °C to 85 °C. Its compact 5mm x 5mm square package features no lead terminals, ideal for space-constrained applications. This industrial-grade IC is perfect for various peripheral functions in advanced electronic systems.

S-XQCC-N40

e3

5 mm

3

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

HCTL-2017 by Broadcom

HCTL-2017

Broadcom

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

R-XDMA-P16

e3

16

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

Not Qualified

5.5 V

4.5 V

5 V

NO

CMOS

INDUSTRIAL

MATTE TIN

PIN/PEG

DUAL

MICROPROCESSOR CIRCUIT

DS2413P by Maxim Integrated

DS2413P

Maxim Integrated

DS2413P by Maxim Integrated is a small outline peripheral IC with 6 terminals, operating at 0-70°C. It has a supply voltage range of 2.8-5.25V and uses CMOS technology for microprocessor circuits. Ideal for applications requiring dual terminal position and surface mount packaging in commercial temperature grades.

R-PDSO-C6

e0

3.94 mm

1

6

70 Cel

0 Cel

PLASTIC/EPOXY

SOC

RECTANGULAR

SMALL OUTLINE

245

Not Qualified

1.5 mm

5.25 V

2.8 V

3.3 V

YES

CMOS

COMMERCIAL

TIN LEAD

C BEND

1.27 mm

DUAL

3.76 mm

MICROPROCESSOR CIRCUIT

FT245RQ-TRAY by FTDI

FT245RQ-TRAY

FTDI

FT245RQ-TRAY by FTDI is a 32-terminal chip carrier with a square package shape. It operates b/w -40 to 85 °C, suitable for industrial use. With a terminal pitch of 0.5 mm, it is ideal for microprocessor circuits requiring supply voltage b/w 3.3 V to 5.25 V.

S-XQCC-N32

5 mm

3

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

1 mm

5.25 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

5 mm

MICROPROCESSOR CIRCUIT

LS1088ASE7PTA by NXP Semiconductors

LS1088ASE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASE7Q1A by NXP Semiconductors

LS1088ASE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.025 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASN7MQA by NXP Semiconductors

LS1088ASN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.025 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088ASN7PTA by NXP Semiconductors

LS1088ASN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7MQA by NXP Semiconductors

LS1088AXE7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7PTA by NXP Semiconductors

LS1088AXE7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXE7Q1A by NXP Semiconductors

LS1088AXE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7MQA by NXP Semiconductors

LS1088AXN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7PTA by NXP Semiconductors

LS1088AXN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1088AXN7Q1A by NXP Semiconductors

LS1088AXN7Q1A

NXP Semiconductors

LS1088AXN7Q1A by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 0.995V to 1.055V. Ideal for applications requiring high performance and compact design.

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MCIMX6D7CVT08AE by NXP Semiconductors

MCIMX6D7CVT08AE

NXP Semiconductors

MCIMX6D7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V, making it ideal for industrial applications requiring high performance and reliability in a compact square package.

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP5EYM1AB by NXP Semiconductors

MCIMX6DP5EYM1AB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP7CVT8AB by NXP Semiconductors

MCIMX6DP7CVT8AB

NXP Semiconductors

MCIMX6DP7CVT8AB by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package style.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6G2CVK05AB by NXP Semiconductors

MCIMX6G2CVK05AB

NXP Semiconductors

MCIMX6G2CVK05AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15V to 1.3V. This IC has 272 terminals and is ideal for industrial applications requiring low profile, fine pitch components.

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6G3CVK05AB by NXP Semiconductors

MCIMX6G3CVK05AB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6Q7CVT08AE by NXP Semiconductors

MCIMX6Q7CVT08AE

NXP Semiconductors

MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP5EYM1AB by NXP Semiconductors

MCIMX6QP5EYM1AB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP7CVT8AB by NXP Semiconductors

MCIMX6QP7CVT8AB

NXP Semiconductors

MCIMX6QP7CVT8AB by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high performance in compact form factors.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6S5DVM10AD by NXP Semiconductors

MCIMX6S5DVM10AD

NXP Semiconductors

MCIMX6S5DVM10AD by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates on a supply voltage range of 1.35V to 1.5V and has a max operating temperature of 95°C. This IC is commonly used in applications requiring high-performance computing and advanced connectivity capabilities.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6S5EVM10AD by NXP Semiconductors

MCIMX6S5EVM10AD

NXP Semiconductors

MCIMX6S5EVM10AD by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a low profile grid array package. It operates b/w -20 to 105 °C and has a supply voltage range of 1.35V to 1.5V. Ideal for applications requiring high performance and compact design.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6S8DVM10AD by NXP Semiconductors

MCIMX6S8DVM10AD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U5DVM10AD by NXP Semiconductors

MCIMX6U5DVM10AD

NXP Semiconductors

MCIMX6U5DVM10AD by NXP Semiconductors is a System on Chip with 624 terminals, operating at 0-95°C. It features a low profile grid array package style, 0.8mm terminal pitch, and tin silver copper finish. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U8DVM10AD by NXP Semiconductors

MCIMX6U8DVM10AD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6X1CVO08AC by NXP Semiconductors

MCIMX6X1CVO08AC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

24MHZ NOMINAL FREQUENCY AVAILABLE

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.275 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MCIMX6X3CVK08AC by NXP Semiconductors

MCIMX6X3CVK08AC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

24MHZ NOMINAL FREQUENCY AVAILABLE

S-PBGA-B400

e1

14 mm

3

400

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.5 V

1.275 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6X4CVM08AC by NXP Semiconductors

MCIMX6X4CVM08AC

NXP Semiconductors

MCIMX6X4CVM08AC by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 529 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high-performance computing in compact spaces.

S-PBGA-B529

e1

19 mm

3

529

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

SoC

66AK2G12ABY100 by Texas Instruments

66AK2G12ABY100

Texas Instruments

The Texas Instruments 66AK2G12ABY100 is a System on Chip with CMOS technology. It operates b/w 0-70°C, with supply voltage range of 0.95-1.05V. With 625 terminals in a low profile grid array package, it's ideal for various commercial applications requiring high performance and integration capabilities.

S-PBGA-B625

e1

21 mm

3

625

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABY60 by Texas Instruments

66AK2G12ABY60

Texas Instruments

The Texas Instruments 66AK2G12ABY60 is a System on Chip with CMOS technology. It operates b/w 0-70°C, has a supply voltage range of 0.855-0.945V, and features a grid array package with 625 terminals. Ideal for applications requiring low profile, fine pitch ICs in commercial-grade environments.

S-PBGA-B625

e1

21 mm

3

625

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA100E by Texas Instruments

66AK2G12ABYA100E

Texas Instruments

The Texas Instruments 66AK2G12ABYA100E is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.95V to 1.05V. With 625 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA100 by Texas Instruments

66AK2G12ABYA100

Texas Instruments

The Texas Instruments 66AK2G12ABYA100 is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.95V to 1.05V. With 625 terminals in a low profile grid array package, it's ideal for industrial applications requiring high performance and compact design.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA60E by Texas Instruments

66AK2G12ABYA60E

Texas Instruments

The Texas Instruments 66AK2G12ABYA60E is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.855V to 0.945V. With 625 terminals in a low profile grid array package, it's ideal for industrial applications requiring high performance and compact design.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA60 by Texas Instruments

66AK2G12ABYA60

Texas Instruments

The Texas Instruments 66AK2G12ABYA60 is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.855V to 0.945V. With 625 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP