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MCIMX6X4CVM08AC

NXP Semiconductors

MCIMX6X4CVM08AC by NXP Semiconductors

MCIMX6X4CVM08AC by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 529 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high-performance computing in compact spaces.

Median Price

$29.298

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Arrow

USA . 194 parts In-Stock

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$29.298

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Verical

USA . 194 parts In-Stock

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Chip1Stop

Japan . 246 parts In-Stock

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$29.990

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Mouser Electronics

USA . 194 parts In-Stock

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$51.890

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$37.380

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194

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DigiKey

USA . 412 parts In-Stock

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$26.420

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Flip Electronics (Authorized)

USA . 412 parts In-Stock

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Digiode

USA . 2,892 parts In-Stock

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$22.116

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

USA . 5,572 parts In-Stock

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Chip Stock

USA . 2,760 parts In-Stock

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Anansix

USA . 2,198 parts In-Stock

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Flip Electronics

USA . 412 parts In-Stock

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Cyclops Electronics Ltd

UK . 163 parts In-Stock

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Martec Srl

Italy . 101 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 289 parts In-Stock

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$19.700

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Corphita

USA . 3,153 parts In-Stock

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$20.952

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Corohmni

South Africa . 891 parts In-Stock

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$33.118

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Microchip USA

USA . 1,008 parts In-Stock

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UNI Independent Distributors

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Netroflash

USA . 2,000 parts In-Stock

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$30.980

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$30.032

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$29.400

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$29.400

Formix International (Excess)

India . 152 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 101 parts In-Stock

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Overview

Unleash the power of innovation with the MCIMX6X4CVM08AC by NXP Semiconductors. This cutting-edge product belongs to the category of Other Function uPs, uCs & Peripheral ICs, offering unparalleled quality and performance. With a maximum supply voltage of 1.5V and a temperature grade of industrial, this SoC technology marvel is designed to excel in a wide range of applications. Experience seamless integration, reliability, and efficiency like never before with the MCIMX6X4CVM08AC. Elevate your projects to new heights with this exceptional solution from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement on circuit boards.

Maximum Supply Voltage: 1.5 V

Low maximum supply voltage helps minimize power consumption and heat generation.

Package Shape: SQUARE

Square package shape enables efficient use of space on the circuit board.

No. of Terminals: 529

High number of terminals allow for connectivity with various external components.

Minimum Supply Voltage: 1.275 V

Low minimum supply voltage supports energy efficiency and battery-powered applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering onto the circuit board.

Maximum Seated Height: 1.52 mm

Low seated height enables slim and compact design of the product.

Width: 19 mm

Compact width facilitates flexibility in the placement of the product on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 40

Short time at peak reflow temperature helps prevent damage to the product during soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and connection reliability.

Length: 19 mm

Compact length allows for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments.

Peripheral IC Type: SoC

System-on-Chip (SoC) integration reduces the need for external components and simplifies circuit design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections on the circuit board.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density packaging and efficient use of space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6X4CVM08AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6X4CVM08AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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