Loading...

MCIMX6DP7CVT8AB

NXP Semiconductors

MCIMX6DP7CVT8AB by NXP Semiconductors

MCIMX6DP7CVT8AB by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package style.

Median Price

$89.790

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 200 parts In-Stock

1+ parts

$59.880

100+ parts

$53.480

1k+ parts

$53.140

10k+ parts

$53.140

200

$59.880

$53.480

$53.140

$53.140

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$60.000

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$60.000

-

-

-

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$106.140

100+ parts

$87.130

1k+ parts

-

10k+ parts

-

250

$106.140

$87.130

-

-

DigiKey

USA . 300 parts In-Stock

1+ parts

$113.600

100+ parts

$87.391

1k+ parts

-

10k+ parts

-

300

$113.600

$87.391

-

-

Verical

USA . 4,020 parts In-Stock

1+ parts

$113.941

100+ parts

$85.197

1k+ parts

-

10k+ parts

-

4,020

$113.941

$85.197

-

-

Rochester

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$73.440

1k+ parts

$65.710

10k+ parts

$61.840

300

-

$73.440

$65.710

$61.840

EBV Elektronik

Germany . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

240

-

-

-

-

Avnet

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

180

-

-

-

-

Flip Electronics (Authorized)

USA . 123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

123

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,214 parts In-Stock

1+ parts

$56.886

100+ parts

-

1k+ parts

-

10k+ parts

-

4,214

$56.886

-

-

-

TME

Poland . 6,240 parts In-Stock

1+ parts

-

100+ parts

$104.000

1k+ parts

-

10k+ parts

-

6,240

-

$104.000

-

-

Vyrian

USA . 5,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,900

-

-

-

-

Anansix

USA . 1,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,432

-

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

Flip Electronics

USA . 123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

123

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 230 parts In-Stock

1+ parts

$50.900

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$50.900

-

-

-

Semicontronic

India . 223 parts In-Stock

1+ parts

$50.900

100+ parts

$49.628

1k+ parts

$49.373

10k+ parts

-

223

$50.900

$49.628

$49.373

-

Corphita

USA . 1,796 parts In-Stock

1+ parts

$53.892

100+ parts

-

1k+ parts

-

10k+ parts

-

1,796

$53.892

-

-

-

Corohmni

South Africa . 2,539 parts In-Stock

1+ parts

$81.563

100+ parts

-

1k+ parts

-

10k+ parts

-

2,539

$81.563

-

-

-

Microchip USA

USA . 1,169 parts In-Stock

1+ parts

$217.534

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

$217.534

-

-

-

UNI Independent Distributors

Spain . 7,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,378

-

-

-

-

Continental Prestige Electronics

USA . 4,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,347

-

-

-

-

Argo Parts USA

USA . 1,158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,158

-

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Discover the cutting-edge MCIMX6DP7CVT8AB by NXP Semiconductors, a game-changer in the realm of Other Function uPs,uCs & Peripheral ICs. With a focus on quality and innovation, NXP Semiconductors delivers a product that exceeds expectations in performance and reliability. This versatile component offers unparalleled value to customers across various applications. Elevate your projects with the superior benefits and advantages that the MCIMX6DP7CVT8AB brings to the table. Choose NXP Semiconductors for a seamless integration and enhanced user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable packaging material, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.5 V

Supports a high supply voltage, ensuring compatibility with a wide range of power sources.

Package Shape: SQUARE

Facilitates a compact and space-efficient design, ideal for applications with limited board space.

No. of Terminals: 624

Offers a large number of terminals for connecting various components, increasing versatility and functionality.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Enhances thermal performance and heat dissipation, ensuring reliability and stability during operation.

Minimum Supply Voltage: 1.275 V

Supports a low supply voltage, enabling energy-efficient operation and extending battery life.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, suitable for industrial environments with demanding conditions.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making the product versatile for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance, ensuring reliable connections and signal transmission.

Width: 21 mm

Compact size allows for easy integration into small devices or applications with space constraints.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering processes, ensuring reliable and robust solder joints.

Temperature Grade: INDUSTRIAL

Meets industrial-grade standards for reliability and durability in harsh operating conditions.

Peripheral IC Type: SoC

Integration of multiple functions into a single chip reduces component count and saves space on the PCB.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and efficiency.

Terminal Pitch: 0.8 mm

Allows for high-density mounting, enabling more terminals in a smaller space for increased functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6DP7CVT8AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6DP7CVT8AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20