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STA2058EX

STMicroelectronics

STA2058EX by STMicroelectronics

STA2058EX by STMicroelectronics is a low-profile microprocessor circuit with a supply voltage range of 2.97V to 3.63V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 10mm x 10mm grid array package with 144 terminals. Ideal for industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,861 parts In-Stock

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2,861

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Anansix

USA . 777 parts In-Stock

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777

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Digiode

USA . 430 parts In-Stock

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430

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ComSIT Distribution GmbH

Germany . 80 parts In-Stock

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80

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Distributors (Availability)

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AZTECH Wire

Italy . 665 parts In-Stock

1+ parts

$19.270

100+ parts

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665

$19.270

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Microchip USA

USA . 1,902 parts In-Stock

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$24.238

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1,902

$24.238

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Corohmni

South Africa . 2,965 parts In-Stock

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$52.569

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2,965

$52.569

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IDEA Electronic Components Group

UK . 1,693 parts In-Stock

1+ parts

$74.376

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$66.938

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1,693

$74.376

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$66.938

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Component Stockers USA

USA . 574 parts In-Stock

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$99.990

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574

$99.990

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MKK Technologies

India . 672 parts In-Stock

1+ parts

$139.858

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672

$139.858

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DigiPath Technology Company

USA . 672 parts In-Stock

1+ parts

$139.858

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672

$139.858

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Corphita

USA . 3,056 parts In-Stock

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3,056

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Vigor

Singapore . 2,386 parts In-Stock

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2,386

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Parana Technologies

USA . 1,982 parts In-Stock

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$88.927

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1,982

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$88.927

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Overview

Experience unparalleled performance and reliability with the STA2058EX from STMicroelectronics, a leader in semiconductor innovation. This cutting-edge microprocessor circuit is designed for demanding applications, boasting robust temperature resilience and energy efficiency. Its compact low-profile design makes it perfect for space-constrained environments, ensuring you get maximum functionality without compromising on quality. Elevate your projects with STMicroelectronics' commitment to excellence and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental stress, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for easier and more compact PCB designs, optimizing space for multi-layered circuit boards.

Maximum Supply Voltage: 3.63 V

A maximum supply voltage of 3.63 V ensures compatibility with a wide range of power systems while protecting the device from over-voltage conditions.

Package Shape: SQUARE

The square package shape aids in efficient layout and design, especially for multi-chip modules.

No. of Terminals: 144

With 144 terminals, this microprocessor circuit offers extensive functionality and connectivity for various peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style enables effective heat dissipation and allows for denser layouts, which is essential in high-performance applications.

Minimum Supply Voltage: 2.97 V

A low minimum supply voltage ensures the device can operate efficiently in battery-powered or low-energy applications.

Maximum Operating Temperature: 85 °C

The capability to operate at up to 85 °C allows this product to function reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Operating from -40 °C makes this microprocessor suitable for industrial applications subject to extreme weather conditions.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish enhances solderability and reliability, ensuring robust connections during assembly.

Terminal Position: BOTTOM

Bottom terminal positioning helps in achieving a lower profile design, reducing the overall height of the assembly.

Maximum Seated Height: 1.7 mm

A maximum seated height of just 1.7 mm allows for compact designs, making it ideal for space-constrained applications.

Width: 10 mm

A standard width of 10 mm makes integration easy with existing PCB designs and layouts.

Maximum Time At Peak Reflow Temperature: 30 s

The specification for reflow time ensures that components meet stringent soldering process requirements without thermal damage.

Peak Reflow Temperature: 260 °C

Withstanding a peak reflow temperature of 260 °C ensures compatibility with automated soldering processes.

Length: 10 mm

The 10 mm length complements the square shape, making it easy to place in various design configurations.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this component meets rigorous reliability and performance standards.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it provides intelligent processing capabilities for complex applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high performance, ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal configuration enhances mechanical strength and provides superior thermal and electrical performance.

Nominal Supply Voltage: 3.3 V

The nominal voltage of 3.3 V is a standard in many digital systems, facilitating easy integration and compatibility.

Terminal Pitch: 0.8 mm

The fine pitch of 0.8 mm allows for a greater number of connections in a compact area, maximizing design flexibility.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, requiring careful handling to maintain performance, making it suitable for robust industrial applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STA2058EX attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STA2058EX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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