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STA2058EXATR

STMicroelectronics

STA2058EXATR by STMicroelectronics

STA2058EXATR by STMicroelectronics is a low-profile microprocessor circuit designed for industrial applications. It operates b/w 2.97V and 3.63V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,594 parts In-Stock

1+ parts

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3,594

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Digiode

USA . 2,195 parts In-Stock

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2,195

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Anansix

USA . 154 parts In-Stock

1+ parts

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154

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 2 parts In-Stock

1+ parts

$2.000

100+ parts

-

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-

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-

2

$2.000

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AZTECH Wire

Italy . 919 parts In-Stock

1+ parts

$11.480

100+ parts

-

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919

$11.480

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Microchip USA

USA . 2,458 parts In-Stock

1+ parts

$18.860

100+ parts

-

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2,458

$18.860

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IDEA Electronic Components Group

UK . 54 parts In-Stock

1+ parts

$24.718

100+ parts

-

1k+ parts

$22.246

10k+ parts

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54

$24.718

-

$22.246

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MKK Technologies

India . 384 parts In-Stock

1+ parts

$46.480

100+ parts

-

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384

$46.480

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DigiPath Technology Company

USA . 384 parts In-Stock

1+ parts

$46.480

100+ parts

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384

$46.480

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Corohmni

South Africa . 4,898 parts In-Stock

1+ parts

$77.937

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4,898

$77.937

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QUARKTWIN TECHNOLOGY LTD

USA . 16,209 parts In-Stock

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16,209

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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Corphita

USA . 4,177 parts In-Stock

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4,177

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Vigor

Singapore . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 1,238 parts In-Stock

1+ parts

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100+ parts

$29.554

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1,238

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$29.554

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Metaverse IC Inc.

Canada . 1,004 parts In-Stock

1+ parts

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1,004

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Overview

Unlock unparalleled performance with the STA2058EXATR from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile microprocessor combines durability and efficiency, making it perfect for industrial applications where reliability is paramount. With its compact design and low power consumption, the STA2058EXATR ensures seamless integration into your projects, delivering exceptional value and boosting productivity. Experience the advantage of quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount means easy integration into compact designs, saving space on the PCB and allowing for more efficient use of components.

Maximum Supply Voltage: 3.63 V

A maximum supply voltage of 3.63 V indicates compatibility with a wide range of power supply systems, enhancing versatility in applications.

Package Shape: SQUARE

The square package shape provides symmetry which helps in efficient layout design on PCBs, facilitating better thermal performance.

No. of Terminals: 144

With 144 terminals, this product offers ample connectivity options, making it suitable for complex designs and high-performance applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This low-profile fine pitch design allows for high-density board layouts and is ideal for applications where space is a premium.

Minimum Supply Voltage: 2.97 V

A minimum supply voltage of 2.97 V ensures that it can operate under varying conditions, making it reliable in diverse environments.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C allows for its use in industrial environments without the risk of overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 °C makes it suitable for applications in extreme conditions, ensuring robustness and reliability.

Terminal Position: BOTTOM

Bottom-terminated placement offers significant advantages for thermal management and minimizes inductance in high-speed applications.

Maximum Seated Height: 1.7 mm

A maximum seated height of 1.7 mm ensures a compact design, which is crucial for designs with limited vertical space.

Width: 10 mm

The 10 mm width provides a balance between footprint and functionality, allowing it to fit into various design layouts effectively.

Length: 10 mm

With a 10 mm length, this product maintains symmetry in design, which can simplify layout planning and routing on PCBs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, this product is built for resilience, ensuring long-lasting performance in harsh conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit enables extensive processing capabilities, making it suitable for various advanced applications.

Technology: CMOS

The CMOS technology ensures low power consumption, which is essential for battery-powered devices and energy-efficient applications.

Terminal Form: BALL

Ball terminal form provides enhanced connectivity and allows for reliable soldering to the PCB, ensuring longevity of the connection.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V makes it suitable for modern digital circuits, providing compatibility with typical logic levels.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch facilitates high-density connections while maintaining ease of soldering and minimizing short-circuit risks.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STA2058EXATR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STA2058EXATR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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