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STA2058EXA

STMicroelectronics

STA2058EXA by STMicroelectronics

STA2058EXA by STMicroelectronics is a low-profile microprocessor circuit designed for industrial applications. It operates b/w 2.97V and 3.63V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,043 parts In-Stock

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3,043

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Anansix

USA . 656 parts In-Stock

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656

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Digiode

USA . 644 parts In-Stock

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644

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,116 parts In-Stock

1+ parts

$11.990

100+ parts

-

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1,116

$11.990

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Microchip USA

USA . 2,897 parts In-Stock

1+ parts

$21.763

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2,897

$21.763

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Corohmni

South Africa . 4 parts In-Stock

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$39.526

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4

$39.526

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IDEA Electronic Components Group

UK . 1,112 parts In-Stock

1+ parts

$42.603

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$38.343

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1,112

$42.603

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$38.343

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MKK Technologies

India . 952 parts In-Stock

1+ parts

$80.113

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952

$80.113

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DigiPath Technology Company

USA . 952 parts In-Stock

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$80.113

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952

$80.113

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Vigor

Singapore . 6,031 parts In-Stock

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6,031

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Assy Fe

Spain . 4,385 parts In-Stock

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Kepictronics

USA . 3,228 parts In-Stock

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3,228

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Parana Technologies

USA . 2,192 parts In-Stock

1+ parts

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$50.939

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2,192

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$50.939

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Corphita

USA . 1,918 parts In-Stock

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1,918

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Overview

Unlock the potential of your designs with the STA2058EXA from STMicroelectronics, a leader in innovation and quality. This compact, high-performance microprocessor circuit is designed for industrial applications, ensuring reliability in diverse environments. With its low-profile design and efficient power range, it enhances system performance while minimizing energy consumption. Choose STA2058EXA to elevate your projects with exceptional durability and unmatched support from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs, enhancing circuit density and performance in modern electronics.

Maximum Supply Voltage: 3.63 V

A maximum supply voltage of 3.63 V enables compatibility with a wide range of power supplies while ensuring efficient operation.

Package Shape: SQUARE

The square package shape facilitates easier layout and routing on circuit boards, optimizing space utilization.

No. of Terminals: 144

With 144 terminals, the IC can support complex applications requiring multiple connections, enhancing versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array configuration allows for high performance and efficient heat dissipation in compact assemblies.

Minimum Supply Voltage: 2.97 V

A minimum supply voltage of 2.97 V makes it suitable for low-voltage applications, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures reliable performance in demanding thermal environments.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40 °C allows for operation in harsh conditions, making it suitable for industrial applications.

Terminal Position: BOTTOM

Bottom-positioned terminals enhance the mounting stability and facilitate easier soldering in high-density layouts.

Maximum Seated Height: 1.7 mm

A low seated height of 1.7 mm contributes to a slim profile, making it ideal for space-constrained designs.

Width: 10 mm

A width of 10 mm supports compact design while maintaining sufficient space for effective heat dissipation.

Length: 10 mm

With a length of 10 mm, this IC is designed for optimal spacing in intricate electronic layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability over a wider temperature range, meeting the demands of rigorous environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit allows for advanced processing capabilities, suitable for various control and computational tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall chip performance and efficiency.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and electrical performance in surface-mounted applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is widely used in modern electronics, ensuring compatibility with many systems.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for fine-pitch designs, making the IC ideal for high-density and space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STA2058EXA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STA2058EXA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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