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MCIMX6U8DVM10AD

NXP Semiconductors

MCIMX6U8DVM10AD by NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$47.025

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 300 parts In-Stock

1+ parts

$38.580

100+ parts

$29.980

1k+ parts

-

10k+ parts

-

300

$38.580

$29.980

-

-

Mouser Electronics

USA . 105 parts In-Stock

1+ parts

$65.820

100+ parts

$55.970

1k+ parts

-

10k+ parts

-

105

$65.820

$55.970

-

-

Element14

Singapore . 300 parts In-Stock

1+ parts

$68.980

100+ parts

$53.600

1k+ parts

-

10k+ parts

-

300

$68.980

$53.600

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-

Rochester

USA . 1,765 parts In-Stock

1+ parts

-

100+ parts

$37.620

1k+ parts

$33.660

10k+ parts

$31.680

1,765

-

$37.620

$33.660

$31.680

Verical

USA . 1,165 parts In-Stock

1+ parts

-

100+ parts

$47.025

1k+ parts

$42.075

10k+ parts

$39.600

1,165

-

$47.025

$42.075

$39.600

Flip Electronics (Authorized)

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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90

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,639 parts In-Stock

1+ parts

$33.098

100+ parts

-

1k+ parts

-

10k+ parts

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4,639

$33.098

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-

-

Vyrian

USA . 2,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,503

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-

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Anansix

USA . 1,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,663

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-

-

-

Chip Stock

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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440

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Flip Electronics

USA . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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75

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,768 parts In-Stock

1+ parts

$31.356

100+ parts

-

1k+ parts

-

10k+ parts

-

3,768

$31.356

-

-

-

Component Stockers USA

USA . 598 parts In-Stock

1+ parts

$46.850

100+ parts

$36.280

1k+ parts

-

10k+ parts

-

598

$46.850

$36.280

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-

Continental Prestige Electronics

USA . 300 parts In-Stock

1+ parts

$48.430

100+ parts

-

1k+ parts

-

10k+ parts

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300

$48.430

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Corohmni

South Africa . 2,941 parts In-Stock

1+ parts

$58.000

100+ parts

-

1k+ parts

-

10k+ parts

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2,941

$58.000

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-

Microchip USA

USA . 1,306 parts In-Stock

1+ parts

$87.837

100+ parts

-

1k+ parts

-

10k+ parts

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1,306

$87.837

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

-

-

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UNI Independent Distributors

Spain . 907 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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907

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6U8DVM10AD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6U8DVM10AD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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