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STMPE24M31QTR

STMicroelectronics

STMPE24M31QTR by STMicroelectronics

STMPE24M31QTR by STMicroelectronics is a CMOS microprocessor circuit with a supply voltage range of 1.65V to 1.95V and operates in extreme temperatures from -40 °C to 85 °C. Its compact 5mm x 5mm square package features no lead terminals, ideal for space-constrained applications. This industrial-grade IC is perfect for various peripheral functions in advanced electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,322 parts In-Stock

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8,322

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Digiode

USA . 2,691 parts In-Stock

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2,691

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Anansix

USA . 1,449 parts In-Stock

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1,449

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 160 parts In-Stock

1+ parts

$7.357

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160

$7.357

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AZTECH Wire

Italy . 1,008 parts In-Stock

1+ parts

$12.440

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1,008

$12.440

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Corohmni

South Africa . 979 parts In-Stock

1+ parts

$22.304

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979

$22.304

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IDEA Electronic Components Group

UK . 1,330 parts In-Stock

1+ parts

$65.495

100+ parts

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$58.945

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1,330

$65.495

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$58.945

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MKK Technologies

India . 841 parts In-Stock

1+ parts

$123.159

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841

$123.159

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DigiPath Technology Company

USA . 841 parts In-Stock

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$123.159

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841

$123.159

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Corphita

USA . 3,107 parts In-Stock

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3,107

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Parana Technologies

USA . 2,116 parts In-Stock

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$78.309

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2,116

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$78.309

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unlock unparalleled performance with the STMPE24M31QTR from STMicroelectronics, a leader in innovative technology. This cutting-edge microprocessor circuit offers exceptional reliability across diverse applications, from industrial automation to consumer electronics. With its compact design and robust temperature range, it ensures seamless integration and durability, empowering your projects with efficiency and precision. Experience the transformative advantage of quality that only STMicroelectronics can deliver!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design facilitates compact PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.95 V

The low maximum supply voltage ensures compatibility with battery-operated devices, enhancing efficiency.

Package Shape: SQUARE

The square package shape optimizes layout density on PCBs, allowing for efficient use of space.

No. of Terminals: 40

A higher number of terminals allows for more functionalities and connections, making it versatile for complex applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile enhances airflow and heat dissipation, making it suitable for high-performance applications.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage extends battery life in portable devices, offering greater efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in harsh environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability, ensuring reliable connections during assembly.

Terminal Position: QUAD

The quad terminal position enhances routing flexibility on PCBs, simplifying design layouts.

Maximum Seated Height: 0.9 mm

A low seated height contributes to a thinner overall design profile, beneficial in compact devices.

Width: 5 mm

The compact width allows integration into smaller devices while maintaining functionality.

Maximum Time At Peak Reflow Temperature: 30 s

This optimal reflow time helps to reduce the risk of thermal damage during soldering processes.

Peak Reflow Temperature: 260 °C

High peak reflow temperature indicates compatibility with lead-free soldering standards, promoting environmental sustainability.

Length: 5 mm

The consistent dimensions support efficient space management in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable operation under tough conditions, ideal for harsh applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuits provide advanced processing capabilities, making the product suitable for a wide range of applications.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, enhancing efficiency.

Terminal Form: NO LEAD

No lead design simplifies assembly and provides greater layout flexibility, promoting modern manufacturing techniques.

Nominal Supply Voltage: 1.8 V

The nominal voltage aligns with modern low-voltage requirements, making it energy efficient for various applications.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for more compact designs while enabling high-density packaging.

Moisture Sensitivity Level (MSL): 3

MSL 3 provides a moderate level of moisture sensitivity, ensuring adequate handling and storage guidelines are followed.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STMPE24M31QTR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STMPE24M31QTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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