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STMPE24M31PXQTR

STMicroelectronics

STMPE24M31PXQTR by STMicroelectronics

STMPE24M31PXQTR by STMicroelectronics is a CMOS microprocessor circuit designed for industrial applications. It operates b/w 1.65V and 1.95V, with a max temp of 85 °C and features a compact 5mm x 5mm square package with no lead terminals. Ideal for space-constrained environments, it ensures reliable performance in harsh conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,844 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,844

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-

-

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Vyrian

USA . 1,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,409

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Digiode

USA . 951 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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951

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 740 parts In-Stock

1+ parts

$16.773

100+ parts

-

1k+ parts

$15.095

10k+ parts

-

740

$16.773

-

$15.095

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MKK Technologies

India . 1,693 parts In-Stock

1+ parts

$31.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,693

$31.540

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DigiPath Technology Company

USA . 1,693 parts In-Stock

1+ parts

$31.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,693

$31.540

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-

-

Corohmni

South Africa . 2,149 parts In-Stock

1+ parts

$57.888

100+ parts

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10k+ parts

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2,149

$57.888

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Corphita

USA . 4,941 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,941

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Parana Technologies

USA . 1,752 parts In-Stock

1+ parts

-

100+ parts

$20.054

1k+ parts

-

10k+ parts

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1,752

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$20.054

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Overview

Unlock unparalleled performance with the STMPE24M31PXQTR from STMicroelectronics, a trusted leader in innovative solutions. This cutting-edge peripheral IC is designed for reliability in demanding environments, making it ideal for industrial applications where quality and precision matter. With its compact, heat-efficient design and exceptional power efficiency, this microprocessor circuit delivers superior functionality while minimizing energy consumption—perfect for your next breakthrough project!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact assembly, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.95 V

Supports a high voltage range for versatile integration in various power supply systems.

Package Shape: SQUARE

The square package shape optimizes PCB layout for better space utilization and thermal performance.

No. of Terminals: 40

A higher number of terminals facilitates extensive connectivity options for complex applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink capability enhance thermal management and allow for high-density mounting.

Minimum Supply Voltage: 1.65 V

Lower voltage operation improves power efficiency, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high operating temperature rating ensures reliable performance in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

This wide temperature range allows for use in extreme conditions, suitable for industrial applications.

Terminal Position: QUAD

The quad terminal arrangement simplifies PCB routing and enhances signal integrity.

Maximum Seated Height: 0.9 mm

A low seated height is advantageous for low-profile designs, contributing to overall device compactness.

Width: 5 mm

A 5 mm width helps optimize the design footprint while maintaining necessary functionality.

Length: 5 mm

The compact length is ideal for applications where space savings are critical without sacrificing performance.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure durability and performance consistency in harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor, it supports complex processing tasks, suitable for advanced applications.

Technology: CMOS

CMOS technology delivers low power consumption, making it ideal for energy-efficient designs.

Terminal Form: NO LEAD

No lead design enhances solderability and is environmentally friendly, adhering to modern manufacturing standards.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage aligns well with contemporary low-voltage digital circuits for optimal performance.

Terminal Pitch: 0.4 mm

A fine terminal pitch enables high-density designs, affording greater flexibility in layout options.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STMPE24M31PXQTR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N40

Length:

5 mm

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STMPE24M31PXQTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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