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STMPE1218QTR

STMicroelectronics

STMPE1218QTR by STMicroelectronics

STMPE1218QTR by STMicroelectronics is a CMOS microprocessor circuit designed for industrial applications. It operates b/w 1.65V and 1.95V, with a max temp of 85 °C and features a compact 40-terminal no-lead package. Ideal for space-constrained environments, it ensures reliable performance in harsh conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,187 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,187

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Digiode

USA . 1,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,995

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Vyrian

USA . 755 parts In-Stock

1+ parts

-

100+ parts

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755

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 12 parts In-Stock

1+ parts

$15.587

100+ parts

-

1k+ parts

-

10k+ parts

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12

$15.587

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IDEA Electronic Components Group

UK . 260 parts In-Stock

1+ parts

$42.195

100+ parts

-

1k+ parts

$37.975

10k+ parts

-

260

$42.195

-

$37.975

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MKK Technologies

India . 1,182 parts In-Stock

1+ parts

$79.345

100+ parts

-

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10k+ parts

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1,182

$79.345

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DigiPath Technology Company

USA . 1,182 parts In-Stock

1+ parts

$79.345

100+ parts

-

1k+ parts

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10k+ parts

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1,182

$79.345

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Corphita

USA . 3,867 parts In-Stock

1+ parts

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100+ parts

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3,867

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Parana Technologies

USA . 382 parts In-Stock

1+ parts

-

100+ parts

$50.450

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382

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$50.450

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Overview

Unlock innovation with the STMPE1218QTR from STMicroelectronics—a leader in high-quality semiconductor solutions. This versatile peripheral IC empowers your applications with exceptional reliability, operating seamlessly in harsh environments from -40 °C to 85 °C. Ideal for advanced industrial systems, it delivers robust performance with a compact design, ensuring energy efficiency and space optimization. Elevate your projects and maximize results with this cutting-edge component!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of PCB space and enables automated assembly processes, making it suitable for high-density applications.

Maximum Supply Voltage: 1.95 V

A maximum supply voltage of 1.95 V ensures compatibility with modern low-power circuits, reducing energy consumption.

Package Shape: SQUARE

The square package shape facilitates easier layout and assembly on PCBs, optimizing space usage and heat dissipation.

No. of Terminals: 40

With 40 terminals, the device offers extensive I/O capabilities, making it suitable for complex applications requiring multiple connections.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

This package style provides enhanced thermal management, ensuring reliable operation even under high-load conditions.

Minimum Supply Voltage: 1.65 V

The minimum supply voltage of 1.65 V permits operation in low-power environments, making it ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in various industrial applications, even in elevated thermal conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product suitable for harsh environments, enhancing its versatility in different applications.

Terminal Position: QUAD

The quad terminal position provides a stable connection and facilitates easier routing on the PCB, improving overall design flexibility.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robust performance and reliability, suitable for long-term deployment in demanding applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product can manage complex processing tasks, making it ideal for advanced control and automation applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making it efficient for modern electronic systems.

Terminal Form: NO LEAD

The no-lead terminal form enhances performance and allows for a smaller package size, contributing to overall design compactness.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V strikes a good balance between performance and power efficiency, making it suitable for various applications.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4 mm, this product is ideal for modern compact designs, allowing for denser layouts on PCBs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STMPE1218QTR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N40

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

STMPE1218QTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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