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Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
DLPC230TZDQRQ1 by Texas Instruments

DLPC230TZDQRQ1

Texas Instruments

DLPC230TZDQRQ1 by Texas Instruments is a CMOS microprocessor circuit with 324 terminals in a grid array package. It operates b/w -40 to 105 °C, suitable for industrial applications. With a supply voltage range of 1.045V to 1.155V, it is ideal for various functions in automotive electronics and other peripheral ICs.

S-PBGA-B324

23 mm

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

2.352 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT

MIMXRT1052CVL5A by NXP Semiconductors

MIMXRT1052CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1052CVL5A is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. This low-profile, fine-pitch chip is ideal for industrial applications requiring high performance in a compact form factor.

24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE

S-PBGA-B196

10 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

10 mm

SYSTEM ON CHIP

MIMXRT1052CVL5B by NXP Semiconductors

MIMXRT1052CVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT1052CVL5B is a System on Chip with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SYSTEM ON CHIP

AX8052F151-2-TX30 by Onsemi

AX8052F151-2-TX30

Onsemi

AX8052F151-2-TX30 by Onsemi is a 40-terminal IC with supply voltage range of 2.2V to 3.6V, operating temperature from -40 °C to 85°C. It features CMOS technology, no-lead terminal form, and is ideal for industrial applications requiring system-on-chip peripherals in a compact square package style.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F151-3-TX30 by Onsemi

AX8052F151-3-TX30

Onsemi

AX8052F151-3-TX30 by Onsemi is a 40-terminal chip carrier with CMOS technology, operating at -40 to 85 °C. It has a supply voltage range of 2.2V to 3.6V and is ideal for industrial applications requiring a system on chip peripheral IC in a compact square package style.

R-PQCC-N40

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

SYSTEM ON CHIP

MIMXRT1021CAF4A by NXP Semiconductors

MIMXRT1021CAF4A

NXP Semiconductors

NXP Semiconductors' MIMXRT1021CAF4A SoC offers peak reflow temp of 260°C, industrial grade temp, and 40s at peak reflow. Ideal for Other Function uPs & uCs applications due to its high performance and reliability in industrial settings.

e3

3

260

INDUSTRIAL

TIN

40

SoC

MIMXRT1061CVJ5A by NXP Semiconductors

MIMXRT1061CVJ5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1061CVJ5A is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates in industrial temperatures from -40 to 105°C and has a supply voltage range of 1.15V to 1.26V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B196

e2

12 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

12 mm

SoC

MIMXRT1062CVJ5A by NXP Semiconductors

MIMXRT1062CVJ5A

NXP Semiconductors

MIMXRT1062CVJ5A by NXP Semiconductors is a CMOS SoC with 196 terminals in a low profile, fine pitch grid array package. It operates in industrial temperature range (-40 to 105 °C) and has a max supply voltage of 1.26 V. This IC is suitable for various applications requiring high-performance microcontrollers.

S-PBGA-B196

e2

12 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

12 mm

SoC

MIMXRT1062CVL5A by NXP Semiconductors

MIMXRT1062CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1062CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance uPs/uCs & peripheral ICs in compact form factors.

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SoC

1SX280LN2F43I2VG by Intel

1SX280LN2F43I2VG

Intel

SoC FPGA;

SoC FPGA

MIMXRT1051CVJ5B by NXP Semiconductors

MIMXRT1051CVJ5B

NXP Semiconductors

NXP Semiconductors' MIMXRT1051CVJ5B is a System on Chip with CMOS technology, operating at -40 to 105 °C. It features 196 terminals in a low profile grid array package style. Ideal for industrial applications requiring uPs and uCs with a supply voltage range of 1.15V to 1.26V.

S-PBGA-B196

e2

12 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX280CVM4C by NXP Semiconductors

MCIMX280CVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX280DVM4C by NXP Semiconductors

MCIMX280DVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX281AVM4C by NXP Semiconductors

MCIMX281AVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

AEC-Q100

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283CVM4C by NXP Semiconductors

MCIMX283CVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283DVM4C by NXP Semiconductors

MCIMX283DVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX285AVM4C by NXP Semiconductors

MCIMX285AVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

AEC-Q100

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286CVM4C by NXP Semiconductors

MCIMX286CVM4C

NXP Semiconductors

MCIMX286CVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance and compact design.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286DVM4C by NXP Semiconductors

MCIMX286DVM4C

NXP Semiconductors

MCIMX286DVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35V to 1.55V. This low-profile, fine-pitch IC with 289 terminals is ideal for various applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX287CVM4C by NXP Semiconductors

MCIMX287CVM4C

NXP Semiconductors

MCIMX287CVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35V to 1.55V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MIMX8MD6DVAJZAB by NXP Semiconductors

MIMX8MD6DVAJZAB

NXP Semiconductors

SoC; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e2;

e2

3

260

TIN SILVER

40

SoC

MIMX8MQ6DVAJZAB by NXP Semiconductors

MIMX8MQ6DVAJZAB

NXP Semiconductors

SoC; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3;

e2

3

260

TIN SILVER

40

SoC

AWR1443FQIGABLQ1 by Texas Instruments

AWR1443FQIGABLQ1

Texas Instruments

AWR1443FQIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

589824

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

AWR1443FQIGABLRQ1 by Texas Instruments

AWR1443FQIGABLRQ1

Texas Instruments

AWR1443FQIGABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

589824

AEC-Q100

1.2 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

A7102CLTK2/T0BC2AJ by NXP Semiconductors

A7102CLTK2/T0BC2AJ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

S-PDSO-N8

4 mm

8

90 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.16,32

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.8 mm

DUAL

4 mm

CRYPTOGRAPHIC AUTHENTICATOR

A7102CLTK2/T0BC2XJ by NXP Semiconductors

A7102CLTK2/T0BC2XJ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

S-PDSO-N8

4 mm

8

90 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.16,32

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.8 mm

DUAL

4 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATWINC1500B-MU-Y by Microchip Technology

ATWINC1500B-MU-Y

Microchip Technology

Microchip Technology's ATWINC1500B-MU-Y is a 40-terminal chip carrier with a clock frequency of 48 MHz. Ideal for industrial applications, it operates b/w -40 to 85 °C and supports network controller technology. With a supply voltage range of 2.7V to 3.6V, this CMOS device is surface mountable and has a terminal pitch of 0.4 mm.

48 MHz

S-PQCC-N40

e3

5 mm

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

5 mm

NETWORK CONTROLLER

ATWINC1510B-MU-Y by Microchip Technology

ATWINC1510B-MU-Y

Microchip Technology

ATWINC1510B-MU-Y by Microchip operates at 48 MHz with a supply voltage range of 2.7V to 3.6V, suitable for industrial applications. It features a network controller in a compact chip carrier package with matte tin finish and quad terminals, ideal for surface mount assembly. This CMOS technology device has an operating temperature range from -40°C to 85°C, making it versatile for various electronic designs.

48 MHz

S-PQCC-N40

e3

5 mm

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.4 mm

QUAD

5 mm

NETWORK CONTROLLER

MIMX8MM1DVTLZAA by NXP Semiconductors

MIMX8MM1DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM1DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM2DVTLZAA by NXP Semiconductors

MIMX8MM2DVTLZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM3DVTLZAA by NXP Semiconductors

MIMX8MM3DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM3DVTLZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM4DVTLZAA by NXP Semiconductors

MIMX8MM4DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM4DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM5DVTLZAA by NXP Semiconductors

MIMX8MM5DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM5DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM1CVTKZAA by NXP Semiconductors

MIMX8MM1CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM1CVTKZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w -40 to 105°C, it has a supply voltage range of 0.9-1V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM3CVTKZAA by NXP Semiconductors

MIMX8MM3CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM3CVTKZAA is a SoC with 486 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 0.9V to 1V and uses CMOS technology. This low-profile, fine-pitch IC is suitable for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MCIMX7D5EVK10SD by NXP Semiconductors

MCIMX7D5EVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.2 V;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

ADUCM330WFSBCPZ-RL by Analog Devices

ADUCM330WFSBCPZ-RL

Analog Devices

ADUCM330WFSBCPZ-RL by Analog Devices is a CMOS microprocessor circuit with SPI bus compatibility. It operates b/w -40 to 115 °C and supports supply voltages from 3.6V to 18V, making it ideal for industrial applications requiring high performance in a compact chip carrier package.

SPI

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.24SQ,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

AEC-Q100

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

MICROPROCESSOR CIRCUIT

EFR32BG13P532F512GM48-DR by Silicon Labs

EFR32BG13P532F512GM48-DR

Silicon Labs

EFR32BG13P532F512GM48-DR by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.8V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in the Other Function uPs,uCs category.

S-XQCC-N48

7 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SoC

ATECC608A-TFLXTLSS by Microchip Technology

ATECC608A-TFLXTLSS

Microchip Technology

ATECC608A-TFLXTLSS by Microchip: Industrial-grade cryptographic authenticator with 2-5.5V supply, -40 to 85°C temp range, and small outline package. Ideal for secure IoT devices requiring high-level authentication and data protection.

R-PDSO-G8

e4

4.9 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP8,.23

RECTANGULAR

SMALL OUTLINE

1.75 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

3.9 mm

CRYPTOGRAPHIC AUTHENTICATOR

MIMX8MN1CVTIZAA by NXP Semiconductors

MIMX8MN1CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

e2

3

260

TIN SILVER

40

SYSTEM ON CHIP

MIMX8MN1DVTJZAA by NXP Semiconductors

MIMX8MN1DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN1DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN2CVTIZAA by NXP Semiconductors

MIMX8MN2CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2;

e2

3

260

TIN SILVER

40

SYSTEM ON CHIP

MIMX8MN2DVTJZAA by NXP Semiconductors

MIMX8MN2DVTJZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN3CVTIZAA by NXP Semiconductors

MIMX8MN3CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

e2

3

260

TIN SILVER

40

SYSTEM ON CHIP

MIMX8MN3DVTJZAA by NXP Semiconductors

MIMX8MN3DVTJZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN4CVTIZAA by NXP Semiconductors

MIMX8MN4CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40;

e2

3

260

TIN SILVER

40

SYSTEM ON CHIP

MIMX8MN4DVTJZAA by NXP Semiconductors

MIMX8MN4DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN4DVTJZAA is a SoC with 486 terminals in a low profile, fine pitch grid array package. It operates b/w 0-95°C with supply voltage range of 0.95-1.05 V. Ideal for applications requiring high performance and compact design in various electronic devices.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN5CVTIZAA by NXP Semiconductors

MIMX8MN5CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Terminal Finish: TIN SILVER;

e2

3

260

TIN SILVER

40

SYSTEM ON CHIP