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MIMX8MM4DVTLZAA

NXP Semiconductors

MIMX8MM4DVTLZAA by NXP Semiconductors

The NXP Semiconductors MIMX8MM4DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.

Median Price

$19.974

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 52 parts In-Stock

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$18.039

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$18.039

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Verical

USA . 102 parts In-Stock

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$19.047

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Chip1Stop

Japan . 152 parts In-Stock

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$20.900

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Mouser Electronics

USA . 37 parts In-Stock

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$23.930

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$21.290

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$21.010

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37

$23.930

$21.290

$21.010

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EBV Elektronik

Germany . 152 parts In-Stock

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Digiode

USA . 2,712 parts In-Stock

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$19.000

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Nova Conductors

Japan . 550 parts In-Stock

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$30.815

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Vyrian

USA . 4,833 parts In-Stock

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Anansix

USA . 1,362 parts In-Stock

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Rebound Electronics

UK . 887 parts In-Stock

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TME

Poland . 304 parts In-Stock

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Flip Electronics

USA . 127 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 208 parts In-Stock

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$16.830

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Corphita

USA . 4,277 parts In-Stock

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$18.000

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Continental Prestige Electronics

USA . 6,209 parts In-Stock

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$30.815

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$30.199

6,209

$30.815

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$30.199

Netroflash

USA . 1,000 parts In-Stock

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$30.815

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$30.199

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$30.815

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Aztec Data Supply Inc.

USA . 1,525 parts In-Stock

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$37.552

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Microchip USA

USA . 1,415 parts In-Stock

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$66.217

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Corohmni

South Africa . 2,983 parts In-Stock

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$82.518

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QUARKTWIN TECHNOLOGY LTD

USA . 27,315 parts In-Stock

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UNI Independent Distributors

Spain . 8,362 parts In-Stock

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Argo Parts USA

USA . 3,034 parts In-Stock

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Overview

Discover the cutting-edge MIMX8MM4DVTLZAA by NXP Semiconductors, a top-quality product that boasts unparalleled value and benefits. This innovative device, belonging to the Other Function uPs,uCs & Peripheral ICs category, offers advanced technology and reliability. With a package style of GRID ARRAY, LOW PROFILE, FINE PITCH and a terminal finish of TIN SILVER, this SoC is perfect for a wide range of applications. Experience superior performance and efficiency with the MIMX8MM4DVTLZAA, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring its longevity.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto a circuit board, saving time and effort.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power input, accommodating different power sources.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures that the product can operate effectively even with lower power inputs, increasing its versatility.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature indicates that the product can withstand harsh environmental conditions, making it suitable for a variety of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function in cold environments without compromising its performance.

Terminal Finish: TIN SILVER

The tin silver finish on the terminals provides good conductivity and corrosion resistance, improving the overall reliability of the product.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single chip, reducing the overall size and complexity of the product while improving efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate exposure to moisture during storage or assembly, ensuring its durability in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MM4DVTLZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B486

JESD-609 Code:

e2

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

486

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA486,27X27,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MM4DVTLZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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