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MIMX8MN2DVTJZAA

NXP Semiconductors

MIMX8MN2DVTJZAA by NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$23.000

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$28.370

100+ parts

$19.110

1k+ parts

-

10k+ parts

-

1

$28.370

$19.110

-

-

Newark

USA . 152 parts In-Stock

1+ parts

$28.610

100+ parts

$20.410

1k+ parts

$19.790

10k+ parts

-

152

$28.610

$20.410

$19.790

-

Chip1Stop

Japan . 37 parts In-Stock

1+ parts

$31.500

100+ parts

$23.900

1k+ parts

-

10k+ parts

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37

$31.500

$23.900

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-

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$15.315

10k+ parts

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9,880

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-

$15.315

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Rochester

USA . 139 parts In-Stock

1+ parts

-

100+ parts

$13.400

1k+ parts

$11.990

10k+ parts

$11.280

139

-

$13.400

$11.990

$11.280

DigiKey

USA . 139 parts In-Stock

1+ parts

-

100+ parts

$17.630

1k+ parts

-

10k+ parts

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139

-

$17.630

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,102 parts In-Stock

1+ parts

$14.146

100+ parts

-

1k+ parts

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10k+ parts

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2,102

$14.146

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Vyrian

USA . 8,034 parts In-Stock

1+ parts

-

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8,034

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-

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Anansix

USA . 2,688 parts In-Stock

1+ parts

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2,688

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Flip Electronics

USA . 279 parts In-Stock

1+ parts

-

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279

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DigiKey Marketplace

USA . 250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 126 parts In-Stock

1+ parts

$12.660

100+ parts

-

1k+ parts

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10k+ parts

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126

$12.660

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-

-

Corphita

USA . 1,765 parts In-Stock

1+ parts

$13.401

100+ parts

-

1k+ parts

-

10k+ parts

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1,765

$13.401

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-

-

Component Stockers USA

USA . 587 parts In-Stock

1+ parts

$20.980

100+ parts

$19.710

1k+ parts

-

10k+ parts

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587

$20.980

$19.710

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-

Corohmni

South Africa . 88 parts In-Stock

1+ parts

$62.079

100+ parts

-

1k+ parts

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10k+ parts

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88

$62.079

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Microchip USA

USA . 2,722 parts In-Stock

1+ parts

$70.219

100+ parts

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2,722

$70.219

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UNI Independent Distributors

Spain . 7,108 parts In-Stock

1+ parts

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7,108

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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500

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-

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MN2DVTJZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B486

JESD-609 Code:

e2

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

486

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA486,27X27,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MN2DVTJZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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