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Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z035-1FFG900I by Xilinx

XC7Z035-1FFG900I

Xilinx

XC7Z035-1FFG900I by Xilinx is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-2FBG676E by Xilinx

XC7Z035-2FBG676E

Xilinx

The Xilinx XC7Z035-2FBG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FBG676I by Xilinx

XC7Z035-2FBG676I

Xilinx

The Xilinx XC7Z035-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG676E by Xilinx

XC7Z035-2FFG676E

Xilinx

XC7Z035-2FFG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG676I by Xilinx

XC7Z035-2FFG676I

Xilinx

The Xilinx XC7Z035-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG900E by Xilinx

XC7Z035-2FFG900E

Xilinx

XC7Z035-2FFG900E by Xilinx is a programmable system on chip with CMOS technology. It operates b/w 0 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With a grid array package style, it's ideal for various applications in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B900

31 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-2FFG900I by Xilinx

XC7Z035-2FFG900I

Xilinx

The Xilinx XC7Z035-2FFG900I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-3FBG676E by Xilinx

XC7Z035-3FBG676E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-3FFG676E by Xilinx

XC7Z035-3FFG676E

Xilinx

XC7Z035-3FFG676E by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-100 °C with supply voltage range of 0.95-1.05 V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-3FFG900E by Xilinx

XC7Z035-3FFG900E

Xilinx

XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B900

31 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-L2FBG676I by Xilinx

XC7Z035-L2FBG676I

Xilinx

The Xilinx XC7Z035-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-L2FFG676I by Xilinx

XC7Z035-L2FFG676I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-L2FFG900I by Xilinx

XC7Z035-L2FFG900I

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z045-L2FBG676I by Xilinx

XC7Z045-L2FBG676I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA676,26X26,40;

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-L2FFG676I by Xilinx

XC7Z045-L2FFG676I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-L2FFG900I by Xilinx

XC7Z045-L2FFG900I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-L2FFG1156I by Xilinx

XC7Z100-L2FFG1156I

Xilinx

XC7Z100-L2FFG1156I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 1156 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B1156

35 mm

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

GRID ARRAY

3.1 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

SYSTEM ON CHIP

XC7Z100-L2FFG900I by Xilinx

XC7Z100-L2FFG900I

Xilinx

XC7Z100-L2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

AM4376BZDNA100 by Texas Instruments

AM4376BZDNA100

Texas Instruments

AM4376BZDNA100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.272V to 1.378V. Ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4376BZDN100 by Texas Instruments

AM4376BZDN100

Texas Instruments

AM4376BZDN100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, has 491 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.272-1.378 V. Ideal for applications requiring low profile, fine pitch ICs in surface mount packages.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4376BZDN80 by Texas Instruments

AM4376BZDN80

Texas Instruments

AM4376BZDN80 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326V. Ideal for applications requiring high performance and compact design.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4376BZDNA80 by Texas Instruments

AM4376BZDNA80

Texas Instruments

AM4376BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring high performance and reliability.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4376BZDND100 by Texas Instruments

AM4376BZDND100

Texas Instruments

AM4376BZDND100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 90°C, with supply voltage ranging from 1.272V to 1.378V. Ideal for industrial applications requiring high performance and compact design.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4376BZDND30 by Texas Instruments

AM4376BZDND30

Texas Instruments

The Texas Instruments AM4376BZDND30 is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates at -40 to 90°C, with supply voltage ranging from 0.912V to 1V. Ideal for industrial applications requiring CMOS technology and bottom terminal position.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1 V

.912 V

.95 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4376BZDND80 by Texas Instruments

AM4376BZDND80

Texas Instruments

AM4376BZDND80 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 90°C and has a supply voltage range of 1.21V to 1.326V. Ideal for industrial applications requiring high performance and compact design.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4377BZDNA80 by Texas Instruments

AM4377BZDNA80

Texas Instruments

AM4377BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring a supply voltage range of 1.21-1.326V and peak reflow temperature of 260°C.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4377BZDND100 by Texas Instruments

AM4377BZDND100

Texas Instruments

AM4377BZDND100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package style, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance computing in compact spaces.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4377BZDND80 by Texas Instruments

AM4377BZDND80

Texas Instruments

AM4377BZDND80 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package style, 0.65mm terminal pitch, and 1.21-1.326V supply voltage range. Ideal for industrial applications requiring high-performance computing in compact spaces.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDN100 by Texas Instruments

AM4378BZDN100

Texas Instruments

AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDN80 by Texas Instruments

AM4378BZDN80

Texas Instruments

AM4378BZDN80 by Texas Instruments is a CMOS system-on-chip with a max supply voltage of 1.326V and a min operating temperature of 0°C. It is used in applications requiring low-profile, fine-pitch grid array packages with 491 terminals.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDNA100 by Texas Instruments

AM4378BZDNA100

Texas Instruments

AM4378BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDNA80 by Texas Instruments

AM4378BZDNA80

Texas Instruments

AM4378BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. Ideal for applications requiring low profile and fine pitch package style in industrial settings.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDND100 by Texas Instruments

AM4378BZDND100

Texas Instruments

AM4378BZDND100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDND80 by Texas Instruments

AM4378BZDND80

Texas Instruments

AM4378BZDND80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 90 °C and has a supply voltage range of 1.21V to 1.326V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4379BZDNA100 by Texas Instruments

AM4379BZDNA100

Texas Instruments

AM4379BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance uPs/uCs & peripheral ICs in compact form factors.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4379BZDNA80 by Texas Instruments

AM4379BZDNA80

Texas Instruments

AM4379BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

CC3000MODT by Texas Instruments

CC3000MODT

Texas Instruments

CC3000MODT by Texas Instruments is a surface-mount microprocessor circuit with 46 terminals. It operates b/w -20°C to 70°C, with a supply voltage range of 2.7V to 4.8V. This CMOS technology-based IC is ideal for applications requiring low power consumption and compact design.

SEATED HGT-NOM

R-XQMA-N46

16.3 mm

46

70 Cel

-20 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

4.8 V

2.7 V

3.6 V

YES

CMOS

OTHER

NO LEAD

QUAD

13.5 mm

MICROPROCESSOR CIRCUIT

STWBCTR by STMicroelectronics

STWBCTR

STMicroelectronics

STWBCTR by STMicroelectronics is a 32-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 105 °C, suitable for INDUSTRIAL applications. This SQUARE chip carrier has a very thin profile, no lead terminal form, and nominal voltage of 5 V.

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

5 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

STWBC by STMicroelectronics

STWBC

STMicroelectronics

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

5 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

CC1310F32RHBR by Texas Instruments

CC1310F32RHBR

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

CC1310F64RGZR by Texas Instruments

CC1310F64RGZR

Texas Instruments

CC1310F64RGZR by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a compact, surface-mountable package.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

ADUCM330WDCPZ-RL by Analog Devices

ADUCM330WDCPZ-RL

Analog Devices

ADUCM330WDCPZ-RL by Analog Devices is a CMOS microprocessor circuit with 32 terminals, operating from -40 to 115 °C. It has a supply voltage range of 3.6V to 18V and is suitable for industrial applications requiring a compact square chip carrier package style.

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

ADUCM331WDCPZ-RL by Analog Devices

ADUCM331WDCPZ-RL

Analog Devices

ADUCM331WDCPZ-RL by Analog Devices is a CMOS microprocessor circuit with 32 terminals in a square chip carrier package. It operates b/w -40 to 115 °C, with supply voltage range of 3.6V to 18V. Ideal for industrial applications requiring high performance and compact design.

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

CMX7341Q3 by Cml Microcircuits

CMX7341Q3

Cml Microcircuits

CMX7341Q3 by Cml Microcircuits is a 48-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for industrial applications, it comes in a square chip carrier package style suitable for surface mount assembly.

S-XQCC-N48

6 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPNR by Texas Instruments

MSP430F67621AIPNR

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPN by Texas Instruments

MSP430F67621AIPN

Texas Instruments

MSP430F67621AIPN by Texas Instruments is an 80-terminal microprocessor circuit with 4096 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications. With a supply voltage range of 1.8-3.6V, this CMOS technology-based IC is suitable for low-profile designs requiring ADC channels and a compact form factor.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPZR by Texas Instruments

MSP430F67621AIPZR

Texas Instruments

MSP430F67621AIPZR by Texas Instruments is a 100-terminal microprocessor circuit with 4096 bytes of RAM. It operates b/w -40 to 85°C, compatible with I2C, SPI, and UART buses. This CMOS technology chip has a low profile package style suitable for industrial applications.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPZ by Texas Instruments

MSP430F67621AIPZ

Texas Instruments

MSP430F67621AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, supporting I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring low profile design and 3.3V nominal voltage.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT