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CC1310F32RHBR

Texas Instruments

CC1310F32RHBR by Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$3.798

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 46,219 parts In-Stock

1+ parts

$3.798

100+ parts

$3.328

1k+ parts

$1.880

10k+ parts

-

46,219

$3.798

$3.328

$1.880

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,562 parts In-Stock

1+ parts

$3.608

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-

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2,562

$3.608

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Chip Stock

USA . 9,249 parts In-Stock

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9,249

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Vyrian

USA . 4,995 parts In-Stock

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4,995

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Distributors (Availability)

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Native Components

USA . 110 parts In-Stock

1+ parts

$0.451

100+ parts

-

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$0.433

110

$0.451

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$0.433

Northwest PG Solutions

USA . 1,889 parts In-Stock

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$0.496

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$0.438

1,889

$0.496

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$0.438

Corphita

USA . 3,802 parts In-Stock

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$3.418

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3,802

$3.418

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AZTECH Wire

Italy . 300 parts In-Stock

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$21.610

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300

$21.610

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Corohmni

South Africa . 5,115 parts In-Stock

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$24.809

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Parana Technologies

USA . 2,344 parts In-Stock

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$75.004

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2,344

$75.004

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DigiPath Technology Company

USA . 787 parts In-Stock

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$82.589

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787

$82.589

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ChromeModa Solutions

Germany . 6,202 parts In-Stock

1+ parts

$84.274

100+ parts

$69.105

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6,202

$84.274

$69.105

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IDEA Electronic Components Group

UK . 1,490 parts In-Stock

1+ parts

$84.274

100+ parts

$80.060

1k+ parts

$75.847

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1,490

$84.274

$80.060

$75.847

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Component Stockers USA

USA . 38,311 parts In-Stock

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Lixinc

USA . 19,648 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,772 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,181 parts In-Stock

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1,181

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1310F32RHBR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CC1310F32RHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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