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MSP430F67621AIPZ

Texas Instruments

MSP430F67621AIPZ by Texas Instruments

MSP430F67621AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, supporting I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring low profile design and 3.3V nominal voltage.

Median Price

$6.626

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,370 parts In-Stock

1+ parts

$6.626

100+ parts

$5.402

1k+ parts

$3.601

10k+ parts

-

1,370

$6.626

$5.402

$3.601

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,439 parts In-Stock

1+ parts

$6.295

100+ parts

-

1k+ parts

-

10k+ parts

-

1,439

$6.295

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-

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Vyrian

USA . 8,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,632

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,297 parts In-Stock

1+ parts

$5.963

100+ parts

-

1k+ parts

-

10k+ parts

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3,297

$5.963

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-

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AZTECH Wire

Italy . 178 parts In-Stock

1+ parts

$10.790

100+ parts

-

1k+ parts

-

10k+ parts

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178

$10.790

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-

-

Microchip USA

USA . 1,130 parts In-Stock

1+ parts

$18.130

100+ parts

$17.870

1k+ parts

$17.740

10k+ parts

$17.610

1,130

$18.130

$17.870

$17.740

$17.610

Corohmni

South Africa . 1,964 parts In-Stock

1+ parts

$34.289

100+ parts

-

1k+ parts

-

10k+ parts

-

1,964

$34.289

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Parana Technologies

USA . 686 parts In-Stock

1+ parts

$55.311

100+ parts

-

1k+ parts

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686

$55.311

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DigiPath Technology Company

USA . 1,019 parts In-Stock

1+ parts

$60.904

100+ parts

$56.032

1k+ parts

-

10k+ parts

-

1,019

$60.904

$56.032

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ChromeModa Solutions

Germany . 1,170 parts In-Stock

1+ parts

$62.147

100+ parts

$50.961

1k+ parts

-

10k+ parts

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1,170

$62.147

$50.961

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IDEA Electronic Components Group

UK . 1,006 parts In-Stock

1+ parts

$62.147

100+ parts

$59.040

1k+ parts

$55.932

10k+ parts

-

1,006

$62.147

$59.040

$55.932

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Overview

Upgrade your electronics with the MSP430F67621AIPZ by Texas Instruments, a top-quality microprocessor circuit that brings unparalleled performance and reliability to a wide range of applications. With a compact square package style and versatile terminal pitch, this innovative product is perfect for industrial use. Experience the benefits of enhanced functionality, low power consumption, and seamless integration thanks to Texas Instruments' cutting-edge technology. Take your projects to the next level with the MSP430F67621AIPZ and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V allows for flexibility in power requirements and compatibility with a variety of systems.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board and ensures a compact design for the overall product.

No. of Terminals: 100

Having 100 terminals allows for multiple connections and interfaces, enabling the product to support various external peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures a sleek and modern design, making the product suitable for compact and space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8 V helps in reducing power consumption and ensuring compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions and maintain performance under elevated temperatures.

CPU Family: MSP430

Being part of the MSP430 CPU family indicates high-performance and energy-efficient operation, making it a reliable choice for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable functionality even in extremely cold environments, enhancing the product's versatility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67621AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

4

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67621AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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