Loading...

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MSP430F67641AIPNR by Texas Instruments

MSP430F67641AIPNR

Texas Instruments

MSP430F67641AIPNR by Texas Instruments is a 80-terminal microprocessor circuit with 8192 bytes of RAM. Operating at temperatures from -40 to 85°C, it supports I2C, SPI, and UART bus compatibility. This CMOS technology device has a low profile package style suitable for industrial applications.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPN by Texas Instruments

MSP430F67641AIPN

Texas Instruments

MSP430F67641AIPN by Texas Instruments is an 80-terminal microprocessor circuit with 8192 bytes of RAM. It operates b/w -40 to 85°C, supporting I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring a low-profile package style with a max supply voltage of 3.6V.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPZR by Texas Instruments

MSP430F67641AIPZR

Texas Instruments

MSP430F67641AIPZR by Texas Instruments is a 100-terminal microprocessor circuit with 8-word RAM and 8192-byte RAM. It operates b/w -40 to 85 °C, compatible with I2C, SPI, UART buses for industrial applications requiring low profile design in a square package.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPZ by Texas Instruments

MSP430F67641AIPZ

Texas Instruments

MSP430F67641AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications requiring a low-profile package style with a max seated height of 1.6mm.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMS2 by Texas Instruments

66AK2L06XCMS2

Texas Instruments

The Texas Instruments 66AK2L06XCMS2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.1V. Ideal for applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA2 by Texas Instruments

66AK2L06XCMSA2

Texas Instruments

The Texas Instruments 66AK2L06XCMSA2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.1V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA by Texas Instruments

66AK2L06XCMSA

Texas Instruments

The Texas Instruments 66AK2L06XCMSA is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.1V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMS by Texas Instruments

66AK2L06XCMS

Texas Instruments

The Texas Instruments 66AK2L06XCMS is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.95-1.1 V. This IC, in GRID ARRAY package style, is ideal for applications requiring high processing power in compact designs.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

DLPC3439ZEZ by Texas Instruments

DLPC3439ZEZ

Texas Instruments

DLPC3439ZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 201 terminals in a GRID ARRAY package style, suitable for applications requiring low power consumption and operating temperatures b/w -30 to 85 °C. The IC operates at supply voltages ranging from 1.045V to 1.155V, making it ideal for compact electronic devices.

S-PBGA-B201

13 mm

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

13 mm

MICROPROCESSOR CIRCUIT

DLPC410ZYR by Texas Instruments

DLPC410ZYR

Texas Instruments

DLPC410ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

3 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROPROCESSOR CIRCUIT

UCD3138ARGCR by Texas Instruments

UCD3138ARGCR

Texas Instruments

UCD3138ARGCR by Texas Instruments is a 64-terminal microprocessor circuit with a max clock frequency of 2 MHz. It operates in automotive-grade temperatures from -40 to 125 °C and supports I2C and UART bus compatibility. This chip carrier package with a very thin profile is suitable for applications requiring high-performance control in harsh environments.

YES

I2C; UART

2 MHz

0

S-PQCC-N64

e4

9 mm

2

64

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

9 mm

MICROPROCESSOR CIRCUIT

X430FRL152HCRGER by Texas Instruments

X430FRL152HCRGER

Texas Instruments

X430FRL152HCRGER by Texas Instruments is a CMOS microprocessor circuit with 24 terminals in a square chip carrier package. It operates b/w 0 to 70 °C and has a supply voltage range of 1.45V to 1.65V, making it suitable for various commercial applications requiring low power consumption and compact design.

S-PQCC-N24

4 mm

24

70 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.65 V

1.45 V

1.5 V

YES

CMOS

COMMERCIAL

NO LEAD

.5 mm

QUAD

4 mm

MICROPROCESSOR CIRCUIT

SP1ML-915 by STMicroelectronics

SP1ML-915

STMicroelectronics

SP1ML-915 by STMicroelectronics is a CMOS microprocessor circuit with a supply voltage range of 1.8V to 3.6V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 16-terminal, no-lead design for industrial applications. Ideal for space-constrained environments, it measures just 13.4mm x 14mm with a max height of 2.5mm.

R-XDMA-N16

14 mm

16

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.5 mm

3.6 V

1.8 V

3 V

NO

CMOS

INDUSTRIAL

NO LEAD

1.5 mm

DUAL

NOT SPECIFIED

13.4 mm

MICROPROCESSOR CIRCUIT

UCD3138ARGCT by Texas Instruments

UCD3138ARGCT

Texas Instruments

UCD3138ARGCT by Texas Instruments is a 64-terminal microprocessor circuit with CMOS technology. It operates at 3-3.6V, -40 to 125°C, and supports I2C and UART bus compatibility. Ideal for automotive applications due to its compact square package style and low profile design.

YES

I2C; UART

2 MHz

0

S-PQCC-N64

e4

9 mm

2

64

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

9 mm

MICROPROCESSOR CIRCUIT

UCD3138ARMHR by Texas Instruments

UCD3138ARMHR

Texas Instruments

UCD3138ARMHR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates at a max clock frequency of 2 MHz and supports I2C and UART bus compatibility. Ideal for automotive applications, it has a temperature range from -40 to 125 °C and a supply voltage of 3-3.6 V.

YES

I2C; UART

2 MHz

0

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

UCD3138ARMHT by Texas Instruments

UCD3138ARMHT

Texas Instruments

UCD3138ARMHT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 40 terminals, operating at -40 to 125 °C. It has a max clock frequency of 2 MHz and supports I2C and UART bus compatibility. Ideal for automotive applications due to its low profile CHIP CARRIER package style.

YES

I2C; UART

2 MHz

0

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

CC1310F32RGZT by Texas Instruments

CC1310F32RGZT

Texas Instruments

CC1310F32RGZT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates at -40 to 85 °C, with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a compact, surface-mountable package style.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

CC1310F32RHBT by Texas Instruments

CC1310F32RHBT

Texas Instruments

CC1310F32RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes. It operates b/w -40 to 85 °C, with supply voltage range of 1.8-3.8 V. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

CC1310F32RSMT by Texas Instruments

CC1310F32RSMT

Texas Instruments

CC1310F32RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C, with a supply voltage range of 1.8-3.8 V. This MICROPROCESSOR CIRCUIT is ideal for industrial applications requiring low power consumption and compact design.

CORTEX-M3

S-PQCC-N32

e4

4 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

4 mm

MICROPROCESSOR CIRCUIT

CC1310F64RGZT by Texas Instruments

CC1310F64RGZT

Texas Instruments

CC1310F64RGZT by Texas Instruments is a 48-terminal microprocessor circuit with a Cortex-M3 CPU, operating at -40 to 85°C. It features 28,672 RAM bytes and a CMOS technology with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

CC1310F64RHBT by Texas Instruments

CC1310F64RHBT

Texas Instruments

CC1310F64RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes, operating at -40 to 85 °C. It features a CORTEX-M3 CPU Family, 32 terminals in a SQUARE package style, and supports supply voltages from 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

CC1310F64RSMT by Texas Instruments

CC1310F64RSMT

Texas Instruments

CC1310F64RSMT by Texas Instruments is a microprocessor circuit with a Cortex-M3 CPU family. It has 32 terminals and operates at temperatures ranging from -40 to 85°C. With a max supply voltage of 3.8V, it is suitable for industrial applications requiring a very thin profile.

CORTEX-M3

S-PQCC-N32

e4

4 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

4 mm

MICROPROCESSOR CIRCUIT

DLPC910ZYR by Texas Instruments

DLPC910ZYR

Texas Instruments

DLPC910ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring I2C and USB bus compatibility in a compact 27x27mm grid array package.

I2C; USB

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

3 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

MSP430F6749IPZR by Texas Instruments

MSP430F6749IPZR

Texas Instruments

MSP430F6749IPZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 100 terminals, operating at up to 25 MHz. It has a supply voltage range of 1.8V to 3.6V and is ideal for industrial applications requiring I2C, SPI, and UART bus compatibility. The package style is FLATPACK with low profile and fine pitch design, suitable for compact electronic devices.

I2C; SPI; UART

25 MHz

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

DLPC3438CZEZ by Texas Instruments

DLPC3438CZEZ

Texas Instruments

DLPC3438CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage ranging from 1.045V to 1.155V. Ideal for applications requiring high performance and low power consumption.

S-PBGA-B201

e1

13 mm

3

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DLPC3439CZEZ by Texas Instruments

DLPC3439CZEZ

Texas Instruments

DLPC3439CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 1.045V to 1.155V, making it ideal for applications requiring high performance and low power consumption.

S-PBGA-B201

e1

13 mm

3

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

CYTMA525-49FNI25ZZT by Cypress Semiconductor

CYTMA525-49FNI25ZZT

Cypress Semiconductor

CYTMA525-49FNI25ZZT by Cypress Semiconductor is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 1.71V to 5.5V, featuring a GRID ARRAY package style with 49 terminals for surface mount applications in various electronic devices.

IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY

R-PBGA-B49

49

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

5.5 V

1.71 V

YES

CMOS

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

MCIMX6G0DVM05AA by NXP Semiconductors

MCIMX6G0DVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

DRA746APGABCQ1 by Texas Instruments

DRA746APGABCQ1

Texas Instruments

DRA746APGABCQ1 by Texas Instruments is an AEC-Q100 compliant microprocessor circuit with 760 terminals in a grid array package. It operates at a speed of 1500 rpm, suitable for automotive applications due to its CMOS technology and tin silver copper terminal finish. The device can withstand peak reflow temperatures up to 250°C for 30 seconds, making it ideal for automotive electronic systems.

X-PBGA-B760

e1

3

760

PLASTIC/EPOXY

BGA

UNSPECIFIED

GRID ARRAY

250

AEC-Q100

1500 rpm

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

MCIMX6DP4AVT8AA by NXP Semiconductors

MCIMX6DP4AVT8AA

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP5EYM1AA by NXP Semiconductors

MCIMX6DP5EYM1AA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AA by NXP Semiconductors

MCIMX6DP6AVT8AA

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP7CVT8AA by NXP Semiconductors

MCIMX6DP7CVT8AA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP5EYM1AA by NXP Semiconductors

MCIMX6QP5EYM1AA

NXP Semiconductors

MCIMX6QP5EYM1AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates b/w -20°C to 105°C, with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP7CVT8AA by NXP Semiconductors

MCIMX6QP7CVT8AA

NXP Semiconductors

MCIMX6QP7CVT8AA by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

EM341-RTR by Silicon Labs

EM341-RTR

Silicon Labs

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N48

e3

7 mm

2

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.9 V

1.18 V

1.25 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MICROPROCESSOR CIRCUIT

MCIMX6G1AVM05AA by NXP Semiconductors

MCIMX6G1AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1AVM07AA by NXP Semiconductors

MCIMX6G1AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM05AA by NXP Semiconductors

MCIMX6G2AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM07AA by NXP Semiconductors

MCIMX6G2AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1CVM05AA by NXP Semiconductors

MCIMX6G1CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

e2

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

Tin/Silver (Sn/Ag)

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2CVK05AA by NXP Semiconductors

MCIMX6G2CVK05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6G2CVM05AA by NXP Semiconductors

MCIMX6G2CVM05AA

NXP Semiconductors

MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G3CVM05AA by NXP Semiconductors

MCIMX6G3CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

XA7Z030-1FBV484Q by Xilinx

XA7Z030-1FBV484Q

Xilinx

The Xilinx XA7Z030-1FBV484Q is a CMOS microprocessor circuit with 484 ball terminals. It operates in automotive-grade temperatures (-40 to 125 °C) and is AEC-Q100 screened. This square grid array package is ideal for automotive applications requiring high-performance processing capabilities.

S-PBGA-B484

484

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

YES

CMOS

AUTOMOTIVE

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

XCZU9EG-1FFVC900E by Xilinx

XCZU9EG-1FFVC900E

Xilinx

XCZU9EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it requires a supply voltage of 0.825-0.876 V. Ideal for applications requiring high-performance processing capabilities.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

MCIMX7D3DVK10SC by NXP Semiconductors

MCIMX7D3DVK10SC

NXP Semiconductors

MCIMX7D3DVK10SC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage ranging from 1.045-1.25 V. With 488 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SC by NXP Semiconductors

MCIMX7D3EVK10SC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP