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XCZU9EG-1FFVC900E

Xilinx

XCZU9EG-1FFVC900E by Xilinx

XCZU9EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it requires a supply voltage of 0.825-0.876 V. Ideal for applications requiring high-performance processing capabilities.

Median Price

$3,311.680

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Mouser Electronics

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DigiKey

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Digiode

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Corohmni

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Kenton Components

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Overview

Discover the power and innovation of the XCZU9EG-1FFVC900E by Xilinx, a top-of-the-line microprocessor circuit that promises cutting-edge performance and reliability. With Xilinx's reputation for excellence in the industry, this product is designed to exceed expectations in a wide range of applications. From embedded systems to IoT devices, this versatile chip offers unmatched value and benefits to customers seeking advanced solutions for their projects. Experience the future of technology with the XCZU9EG-1FFVC900E - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage ensures stable and reliable operation of the product within specified limits, preventing damage or malfunctions.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space on circuit boards, allowing for compact designs and optimal layout.

No. of Terminals: 900

With a high number of terminals, this product offers a wide range of connection options for various components, enhancing flexibility in circuit design.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy and precise alignment during assembly, improving manufacturing accuracy and reducing the risk of errors.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance in a wide range of environments, from freezing cold to moderate heat.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures proper soldering of the product on circuit boards without overheating or damaging sensitive components.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of a microprocessor circuit enhances the functionality and processing capabilities of the product, making it suitable for advanced applications in computing and control systems.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that this product can withstand moderate exposure to moisture during storage and handling, ensuring reliable performance in humid conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU9EG-1FFVC900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU9EG-1FFVC900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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