Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.
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This material is known for its durability and resistance to heat, making it a reliable choice for electronic components that may be exposed to harsh conditions.
Surface mount technology allows for efficient assembly and compact design, making this product suitable for applications where space is limited.
The high maximum supply voltage allows for flexibility in power requirements, making this product versatile and compatible with various systems.
The square shape of the package provides a uniform and symmetrical layout, facilitating easier placement and alignment during assembly.
The high number of terminals allows for a greater degree of connectivity and functionality, making this product suitable for complex circuit designs.
This package style offers a compact and efficient design, enabling high-density mounting and enhancing overall performance.
The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources, making this product energy-efficient.
With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance or reliability.
The low minimum operating temperature allows this product to function in cold environments, expanding its range of applications and usability.
The terminal position at the bottom of the package ensures secure and reliable connections, enhancing the overall durability and performance of this product.
The low maximum seated height contributes to a compact and slim profile, making this product suitable for space-constrained applications.
The moderate width allows for efficient placement on circuit boards and facilitates streamlined assembly, enhancing the overall ease of integration.
The short time at peak reflow temperature ensures quick and reliable soldering during assembly, reducing the risk of thermal damage and ensuring high-quality connections.
The high peak reflow temperature enables secure and durable soldering, ensuring long-lasting performance and reliability under various operating conditions.
The moderate length of the package facilitates efficient layout and placement on circuit boards, allowing for optimized design and assembly processes.
The industrial temperature grade indicates that this product is designed to withstand harsh environmental conditions and temperature fluctuations, making it suitable for industrial applications.
The system-on-chip design integrates multiple functionalities into a single IC, enhancing efficiency, reducing component count, and simplifying system integration.
CMOS technology offers low power consumption, high speed, and reliability, making this product suitable for a wide range of applications requiring efficient and dependable operation.
The ball terminal form provides reliable connections and enables easy rework or replacement, enhancing the overall flexibility and longevity of this product.
The narrow terminal pitch allows for high-density mounting and compact design, making this product suitable for applications where space is limited.
The moderate moisture sensitivity level indicates that this product can withstand typical manufacturing and storage conditions without risk of damage, ensuring its reliability and longevity.
Other Function uPs,uCs & Peripheral ICs MCIMX6G2CVM05AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
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MCIMX6G2CVM05AA Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 9/Jun/2017
PCN Design/Specification - Mult Dev 26/May/2023
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3103F
Idec
ROTARY SWITCH;
SMBJ18CA
Diodes Incorporated
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
Meritek Electronics
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Rectron
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
XCZU11EG-2FFVF1517E
Xilinx
XCZU11EG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, measuring 40x40 mm. Operating b/w 0-100°C, it requires a supply voltage of 0.825-0.876 V and can withstand peak reflow at 245°C for up to 30s.
XC7Z035-1FFG900I
XC7Z035-1FFG900I by Xilinx is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
MPFS250T-FCG1152E
Microchip Technology
MPFS250T-FCG1152E by Microchip: Programmable SoC with 1152 terminals, CMOS tech, 1V nominal supply. Square GRID ARRAY package for surface mount applications. Operates b/w 0-100°C, ideal for various uP & uC functions.
TCI6630K2LDCMSA
Texas Instruments
Texas Instruments TCI6630K2LDCMSA is a CMOS MICROPROCESSOR CIRCUIT with 900 BALL terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, with a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.
XC7Z035-1FBG676I
XC7Z035-1FBG676I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance processing in compact spaces.
EFR32MG24B210F1536IM48-B
Silicon Labs
EFR32MG24B210F1536IM48-B by Silicon Labs is a SoC with 48 terminals, operating from -40 to 125°C. It has a supply voltage range of 1.71V to 3.8V and terminal pitch of 0.4mm. Ideal for IoT applications requiring low power consumption and compact design in a square chip carrier package style.
NT3H2211W0FTTJ
NXP Semiconductors
MICROPROCESSOR CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;
1433
Nihon Dempa Kogyo
Other uPs/uCs/Peripheral ICs;
D2-92633-LR
Renesas Electronics
D2-92633-LR by Renesas Electronics is a low-profile, fine-pitch SoC peripheral IC with 128 terminals. Operating b/w -10°C to 85°C, it has a supply voltage range of 1.7V to 1.9V and peak reflow temperature of 260°C. Ideal for applications requiring compact design and high performance in electronics manufacturing.
NRF9160-SIBA-R7
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SIBA-R7 is a CMOS MICROCONTROLLER with 127 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 3-5.5 V and is ideal for industrial applications requiring low power consumption and compact design.
AR1100T-I/SS
Microchip Technology's AR1100T-I/SS is a CMOS microprocessor circuit with 20 terminals in a small outline package. It operates at temperatures from -40 to 85 °C and has a supply voltage range of 3.135V to 3.465V, making it ideal for industrial applications requiring precise control and processing capabilities.
NHS3100/A1Z
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
CLRC66301HN,151
MFRC52202HN1,118
The NXP Semiconductors MFRC52202HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals and operates at 3/3.3V. It comes in a PLASTIC/EPOXY square chip carrier package style suitable for surface mount applications. With an operating temperature range of -25 to 85°C, it is ideal for various embedded systems requiring low power consumption.
XCZU4EV-2SFVC784E
XCZU4EV-2SFVC784E by Xilinx is a rectangular, surface mount microprocessor circuit with 784 terminals. It operates on a supply voltage range of 0.825 V to 0.876 V and has a max operating temperature of 100°C. This IC is commonly used in various applications requiring high-performance computing and advanced processing capabilities.
VCBU68WMCE30
VCBU68WMCE30 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 338 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for low-power applications requiring high processing capabilities. The PLASTIC/EPOXY body material and BALL terminal form ensure durability and reliability in various electronic devices.
14255R-100
SoC;
AS5134-ZSST
Ams Ag
SYSTEM ON CHIP;
MPXY8500DK016T1
The NXP Semiconductors MPXY8500DK016T1 is a CMOS microprocessor circuit with 32 terminals in a square chip carrier package. It operates b/w -40 to 125 °C and has a supply voltage range of 1.8V to 3.6V, making it ideal for automotive applications requiring high temperature tolerance and low power consumption.
NRF52832-QFAB-R
NRF52832-QFAB-R by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.7-3.6 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
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MCIMX287CVM4B
MCIMX287CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.35V to 1.55V. With a grid array package style, it's ideal for industrial applications requiring low profile and fine pitch components.
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX535DVV1C
MCIMX535DVV1C by NXP Semiconductors is a System on Chip with 529 terminals, operating at -20 to 85°C. It has a supply voltage range of 0.9/1.25-1.3V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact form factors.
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
MCIMX535DVV1CR2
MCIMX535DVV1CR2 by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -20 to 85 °C. It has a supply voltage range of 0.9/1.25-1.3 V and uses BALL terminal form for various applications in Other Function uPs,uCs & Peripheral ICs.
MCIMX7D5EVM10SD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q6AVT10AD
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
MCIMX6Q7CVT08AD
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
MCIMX6Q7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine-pitch grid array package style.
MCIMX6Q6AVT10ADR
MCIMX6Q6AVT10ADR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With 624 terminals in a GRID ARRAY package style, it has a low supply voltage range of 1.35-1.5 V for power efficiency.
MCIMX535DVV2C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.325V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Q5EYM10AD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM10AD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C, with a supply voltage range of 1.35V to 1.5V. This IC has a grid array package style, 624 terminals, and is suitable for various uP and uC applications.
MCIMX6Y2DVM09AB
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX7D3EVK10SD
MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
MCIMX6S7CVM08AC
MCIMX6S7CVM08AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.275V to 1.5V. This low-profile, fine-pitch IC with 624 terminals is ideal for industrial applications requiring high performance in a compact form factor.
MCIMX6Q7CVT08AE
MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.
MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
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