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MCIMX6G2CVM05AA

NXP Semiconductors

MCIMX6G2CVM05AA by NXP Semiconductors

MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.

Median Price

$12.050

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 6,400 parts In-Stock

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Rochester

USA . 1 parts In-Stock

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$12.050

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$10.780

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$10.140

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$10.780

$10.140

Distributors (In-Stock)

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Digiode

USA . 453 parts In-Stock

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$12.749

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Flip Electronics

USA . 6,400 parts In-Stock

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Vyrian

USA . 6,242 parts In-Stock

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Anansix

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Nova Conductors

Japan . 15 parts In-Stock

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ComSIT Distribution GmbH

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Ampacity Inc.

Singapore . 3,124 parts In-Stock

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$11.410

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Corphita

USA . 2,059 parts In-Stock

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$12.078

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AZTECH Wire

Italy . 594 parts In-Stock

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$15.810

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Microchip USA

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Corohmni

South Africa . 2,661 parts In-Stock

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S.R.D Solutions

India . 8,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,677 parts In-Stock

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A-Z Elektronik GmbH

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Continental Prestige Electronics

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Argo Parts USA

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Perfect Parts

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Kepictronics

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Aranea Global

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Overview

Unlock the potential of your next project with the MCIMX6G2CVM05AA by NXP Semiconductors. Known for their unparalleled quality and innovation, NXP Semiconductors delivers cutting-edge solutions in the Other Function uPs, uCs & Peripheral ICs category. This versatile chip offers customers a wide range of applications and benefits, from its high-quality design to its industrial-grade performance. Experience the value and advantages that this product brings to the table and take your projects to new heights with the MCIMX6G2CVM05AA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making it a reliable choice for electronic components that may be exposed to harsh conditions.

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact design, making this product suitable for applications where space is limited.

Maximum Supply Voltage: 1.3 V

The high maximum supply voltage allows for flexibility in power requirements, making this product versatile and compatible with various systems.

Package Shape: SQUARE

The square shape of the package provides a uniform and symmetrical layout, facilitating easier placement and alignment during assembly.

No. of Terminals: 289

The high number of terminals allows for a greater degree of connectivity and functionality, making this product suitable for complex circuit designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and efficient design, enabling high-density mounting and enhancing overall performance.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources, making this product energy-efficient.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function in cold environments, expanding its range of applications and usability.

Terminal Position: BOTTOM

The terminal position at the bottom of the package ensures secure and reliable connections, enhancing the overall durability and performance of this product.

Maximum Seated Height: 1.32 mm

The low maximum seated height contributes to a compact and slim profile, making this product suitable for space-constrained applications.

Width: 14 mm

The moderate width allows for efficient placement on circuit boards and facilitates streamlined assembly, enhancing the overall ease of integration.

Maximum Time At Peak Reflow Temperature (s): 40

The short time at peak reflow temperature ensures quick and reliable soldering during assembly, reducing the risk of thermal damage and ensuring high-quality connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables secure and durable soldering, ensuring long-lasting performance and reliability under various operating conditions.

Length: 14 mm

The moderate length of the package facilitates efficient layout and placement on circuit boards, allowing for optimized design and assembly processes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to withstand harsh environmental conditions and temperature fluctuations, making it suitable for industrial applications.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functionalities into a single IC, enhancing efficiency, reducing component count, and simplifying system integration.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making this product suitable for a wide range of applications requiring efficient and dependable operation.

Terminal Form: BALL

The ball terminal form provides reliable connections and enables easy rework or replacement, enhancing the overall flexibility and longevity of this product.

Terminal Pitch: 0.8 mm

The narrow terminal pitch allows for high-density mounting and compact design, making this product suitable for applications where space is limited.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level indicates that this product can withstand typical manufacturing and storage conditions without risk of damage, ensuring its reliability and longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6G2CVM05AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX6G2CVM05AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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