Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.
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Rochester
$10.780
$10.140
Digiode
$12.749
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$11.410
Corphita
$12.078
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$15.810
Microchip USA
$25.109
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$46.962
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Argo Parts USA
Perfect Parts
Kepictronics
Aranea Global
This material is known for its durability and resistance to heat, making it a reliable choice for electronic components that may be exposed to harsh conditions.
Surface mount technology allows for efficient assembly and compact design, making this product suitable for applications where space is limited.
The high maximum supply voltage allows for flexibility in power requirements, making this product versatile and compatible with various systems.
The square shape of the package provides a uniform and symmetrical layout, facilitating easier placement and alignment during assembly.
The high number of terminals allows for a greater degree of connectivity and functionality, making this product suitable for complex circuit designs.
This package style offers a compact and efficient design, enabling high-density mounting and enhancing overall performance.
The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources, making this product energy-efficient.
With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance or reliability.
The low minimum operating temperature allows this product to function in cold environments, expanding its range of applications and usability.
The terminal position at the bottom of the package ensures secure and reliable connections, enhancing the overall durability and performance of this product.
The low maximum seated height contributes to a compact and slim profile, making this product suitable for space-constrained applications.
The moderate width allows for efficient placement on circuit boards and facilitates streamlined assembly, enhancing the overall ease of integration.
The short time at peak reflow temperature ensures quick and reliable soldering during assembly, reducing the risk of thermal damage and ensuring high-quality connections.
The high peak reflow temperature enables secure and durable soldering, ensuring long-lasting performance and reliability under various operating conditions.
The moderate length of the package facilitates efficient layout and placement on circuit boards, allowing for optimized design and assembly processes.
The industrial temperature grade indicates that this product is designed to withstand harsh environmental conditions and temperature fluctuations, making it suitable for industrial applications.
The system-on-chip design integrates multiple functionalities into a single IC, enhancing efficiency, reducing component count, and simplifying system integration.
CMOS technology offers low power consumption, high speed, and reliability, making this product suitable for a wide range of applications requiring efficient and dependable operation.
The ball terminal form provides reliable connections and enables easy rework or replacement, enhancing the overall flexibility and longevity of this product.
The narrow terminal pitch allows for high-density mounting and compact design, making this product suitable for applications where space is limited.
The moderate moisture sensitivity level indicates that this product can withstand typical manufacturing and storage conditions without risk of damage, ensuring its reliability and longevity.
Other Function uPs,uCs & Peripheral ICs MCIMX6G2CVM05AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
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MCIMX6G2CVM05AA Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 9/Jun/2017
PCN Design/Specification - Mult Dev 26/May/2023
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
BAV99
Nexperia
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
1N4148WT
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
UCD3138ARJAT
UCD3138ARJAT by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 3-3.6 V. Ideal for automotive applications, it features ADC channels, quad terminal position, and nickel/palladium/gold/silver finish.
XC7Z045-2FBG676E
Xilinx
XC7Z045-2FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
FT230XQ-U
FTDI
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Technology: CMOS;
PN7150B0HN/C11006E
NXP Semiconductors
PN7150B0HN/C11006E by NXP Semiconductors is a NFC controller with a supply voltage range of 1.65V to 1.95V and operating temperature range of -30°C to 85°C. It comes in a square package with 40 terminals and is suitable for applications requiring contactless communication.
LTC4263CS#PBF
Linear Technology
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
AM6231ATGGHAALW
AM6231ATGGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-density integration and low-profile design.
MC-10105F1-821-FNA-M1-A
Renesas Electronics
MC-10105F1-821-FNA-M1-A by Renesas Electronics is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 0.9V to 3.3V, making it ideal for industrial applications requiring high performance in a compact GRID ARRAY package.
EFR32BG22C112F352GM32-C
Silicon Labs
SoC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2;
CY8C4247LQI-BL483
CY8C4247LQI-BL483 by Infineon is a PROGRAMMABLE SoC with NICKEL PALLADIUM GOLD finish. It can withstand peak reflow temp of 260°C for 30s, suitable for INDUSTRIAL applications. MSL level of 3 makes it ideal for Other Function uPs,uCs & Peripheral ICs.
STSPIN32F0TR
STMicroelectronics
STSPIN32F0TR by STMicroelectronics is a 48-terminal, CMOS technology microprocessor circuit with a supply voltage range of 8V to 45V. It operates in automotive-grade temperatures from -40°C to 125°C and features a square package style suitable for surface mount applications.
5CSEBA6U23I7SN
Intel
SoC;
SAM9X60D1G-I/LZB
Microchip Technology
SAM9X60D1G-I/LZB by Microchip offers a 3-5.5V supply range, -40 to 85°C operating temp, and 152 terminals in a square package. Ideal for microprocessor circuits, this CMOS technology-based IC is surface-mountable and features a compact 28x28mm size for various uC applications.
MCIMX6D7CVT08AD
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MCIMX6Y2CVM05AA
MCIMX6Y2CVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates in industrial temperature range (-40 to 105°C) and supports CMOS technology. With a supply voltage range of 1.275V to 1.5V, it is suitable for various applications requiring high-performance microcontrollers.
ATMXT224S-MAUR043
ATMXT224S-MAUR043 by Microchip Technology is a 56-terminal, surface mount IC with a square package shape. It operates at a voltage range of 3V to 3.47V and has a max seated height of 0.6mm. This capacitive touch screen controller is suitable for various applications requiring precise touch input.
FCM8531QY
Fairchild Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
SE050C2HQ1/Z01SDZ
NXP's SE050C2HQ1/Z01SDZ is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.62V to 3.6V. This quad-terminal chip carrier is ideal for industrial applications requiring secure authentication.
ESP32-WROOM-32UE
Espressif Systems (Shanghai)
ESP32-WROOM-32UE by Espressif Systems is a MICROPROCESSOR CIRCUIT with 38 terminals, operating at 3.3V, and industrial temperature grade. It is a CMOS technology chip suitable for IoT applications due to its low power consumption and compact size of 19.2mm x 18mm x 3.35mm.
MIMXRT1061CVJ5A
The NXP Semiconductors MIMXRT1061CVJ5A is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates in industrial temperatures from -40 to 105°C and has a supply voltage range of 1.15V to 1.26V. Ideal for applications requiring high-performance computing in compact spaces.
CY8C6137BZI-F34
CY8C6137BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a grid array package style, it's ideal for applications requiring fine pitch and thin profile designs.
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MCIMX287CVM4B
MCIMX287CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.35V to 1.55V. With a grid array package style, it's ideal for industrial applications requiring low profile and fine pitch components.
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX535DVV1C
MCIMX535DVV1C by NXP Semiconductors is a System on Chip with 529 terminals, operating at -20 to 85°C. It has a supply voltage range of 0.9/1.25-1.3V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact form factors.
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
MCIMX535DVV1CR2
MCIMX535DVV1CR2 by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -20 to 85 °C. It has a supply voltage range of 0.9/1.25-1.3 V and uses BALL terminal form for various applications in Other Function uPs,uCs & Peripheral ICs.
MCIMX7D5EVM10SD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q6AVT10AD
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
MCIMX6Q7CVT08AD
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
MCIMX6Q7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine-pitch grid array package style.
MCIMX6Q6AVT10ADR
MCIMX6Q6AVT10ADR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With 624 terminals in a GRID ARRAY package style, it has a low supply voltage range of 1.35-1.5 V for power efficiency.
MCIMX535DVV2C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.325V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Q5EYM10AD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM10AD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C, with a supply voltage range of 1.35V to 1.5V. This IC has a grid array package style, 624 terminals, and is suitable for various uP and uC applications.
MCIMX6Y2DVM09AB
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX7D3EVK10SD
MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
MCIMX6S7CVM08AC
MCIMX6S7CVM08AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.275V to 1.5V. This low-profile, fine-pitch IC with 624 terminals is ideal for industrial applications requiring high performance in a compact form factor.
MCIMX6Q7CVT08AE
MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.
MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
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