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MSP430F67641AIPN

Texas Instruments

MSP430F67641AIPN by Texas Instruments

MSP430F67641AIPN by Texas Instruments is an 80-terminal microprocessor circuit with 8192 bytes of RAM. It operates b/w -40 to 85°C, supporting I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring a low-profile package style with a max supply voltage of 3.6V.

Median Price

$8.339

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,260 parts In-Stock

1+ parts

$6.598

100+ parts

$5.379

1k+ parts

$3.586

10k+ parts

-

4,260

$6.598

$5.379

$3.586

-

Mouser Electronics

USA . 118 parts In-Stock

1+ parts

$10.080

100+ parts

$7.430

1k+ parts

$5.210

10k+ parts

$5.060

118

$10.080

$7.430

$5.210

$5.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,528 parts In-Stock

1+ parts

$6.268

100+ parts

-

1k+ parts

-

10k+ parts

-

2,528

$6.268

-

-

-

Vyrian

USA . 4,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,872

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,191 parts In-Stock

1+ parts

$5.938

100+ parts

-

1k+ parts

-

10k+ parts

-

1,191

$5.938

-

-

-

Corohmni

South Africa . 3,116 parts In-Stock

1+ parts

$44.859

100+ parts

-

1k+ parts

-

10k+ parts

-

3,116

$44.859

-

-

-

Parana Technologies

USA . 2,172 parts In-Stock

1+ parts

$59.940

100+ parts

-

1k+ parts

-

10k+ parts

-

2,172

$59.940

-

-

-

DigiPath Technology Company

USA . 1,491 parts In-Stock

1+ parts

$66.001

100+ parts

-

1k+ parts

-

10k+ parts

-

1,491

$66.001

-

-

-

ChromeModa Solutions

Germany . 4,321 parts In-Stock

1+ parts

$67.348

100+ parts

$55.225

1k+ parts

-

10k+ parts

-

4,321

$67.348

$55.225

-

-

IDEA Electronic Components Group

UK . 1,401 parts In-Stock

1+ parts

$67.348

100+ parts

$63.981

1k+ parts

$60.613

10k+ parts

-

1,401

$67.348

$63.981

$60.613

-

Overview

Unlock the power of the MSP430F67641AIPN by Texas Instruments, a cutting-edge microprocessor circuit designed to elevate your projects to new heights. With Texas Instruments' reputation for quality and innovation, this device offers unmatched reliability and performance. Ideal for a wide range of applications, this product boasts advanced features such as ADC channels and a generous RAM capacity, making it a versatile and valuable asset for any project. Experience seamless integration, efficient operation, and superior results with the MSP430F67641AIPN - your ultimate solution for all your microprocessing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and flexibility for various applications, making the product suitable for a wide range of environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort in production processes.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage ensures compatibility with a wide range of power sources, enhancing the product's versatility.

Package Shape: SQUARE

Square package shape enables efficient use of space on circuit boards, optimizing layout and design for compact electronic devices.

No. of Terminals: 80

High number of terminals provides ample connectivity options for interfacing with other components, enhancing the product's functionality and versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style allows for a compact design, enabling the product to be used in space-constrained applications.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage ensures efficient power consumption and operation, making the product suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in demanding environmental conditions, making the product suitable for industrial applications.

CPU Family: MSP430

MSP430 CPU family offers high performance and low power consumption, providing an optimal balance for various computing tasks in the product.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions, making the product suitable for outdoor or harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections for long-term use.

ADC Channels: YES

Presence of ADC channels allows for analog-to-digital conversion, enabling the product to interface with sensors and other analog devices for data acquisition.

Terminal Position: QUAD

Quad terminal position provides stable and secure mounting on circuit boards, reducing the risk of connection failures and ensuring long-term reliability.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables a slim and compact design for the product, making it suitable for applications with limited space constraints.

RAM Words: 8

8 RAM words provide sufficient memory for temporary data storage and processing, enhancing the product's computational capabilities.

Width: 12 mm

Compact width dimensions allow for efficient placement and integration of the product into various electronic devices, optimizing space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

Short duration of time at peak reflow temperature ensures reliable soldering and assembly processes, reducing the risk of component damage during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables secure solder joints and connections, ensuring the product's long-term reliability under thermal stress.

Length: 12 mm

Compact length dimensions allow for efficient integration of the product into electronic devices, optimizing space utilization for compact designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product's reliability and performance in harsh environmental conditions typically found in industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of microprocessor circuit peripheral IC type enhances the product's computational capabilities and functionality for a wide range of applications.

RAM Bytes: 8192

8192 RAM bytes provide ample memory for data storage and processing, enabling the product to handle complex computational tasks effectively.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, ensuring efficient performance and energy efficiency in the product.

Terminal Form: GULL WING

Gull wing terminal form facilitates secure and reliable soldering connections, ensuring stable electrical connections for the product's long-term functionality.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent and reliable operation, making the product suitable for a wide range of electronic applications.

Bus Compatibility: I2C, SPI, UART

Compatibility with I2C, SPI, and UART bus interfaces enables seamless communication with various devices and peripherals, enhancing the product's versatility.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting on circuit boards, optimizing space utilization and layout design for compact electronic devices.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and assembly, necessitating proper handling and storage procedures to maintain product quality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67641AIPN attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

8

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MSP430F67641AIPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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