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MSP430F67641AIPZR

Texas Instruments

MSP430F67641AIPZR by Texas Instruments

MSP430F67641AIPZR by Texas Instruments is a 100-terminal microprocessor circuit with 8-word RAM and 8192-byte RAM. It operates b/w -40 to 85 °C, compatible with I2C, SPI, UART buses for industrial applications requiring low profile design in a square package.

Median Price

$4.767

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 74,745 parts In-Stock

1+ parts

$4.767

100+ parts

$3.887

1k+ parts

$2.591

10k+ parts

-

74,745

$4.767

$3.887

$2.591

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$3.993

100+ parts

-

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600

$3.993

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Digiode

USA . 1,589 parts In-Stock

1+ parts

$4.529

100+ parts

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1,589

$4.529

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Vyrian

USA . 7,677 parts In-Stock

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7,677

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ComSIT Distribution GmbH

Germany . 325 parts In-Stock

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-

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325

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,093 parts In-Stock

1+ parts

$3.993

100+ parts

-

1k+ parts

-

10k+ parts

$3.913

5,093

$3.993

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-

$3.913

Argo Parts USA

USA . 711 parts In-Stock

1+ parts

$3.993

100+ parts

-

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711

$3.993

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-

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Bastille Electronics

Australia . 3,651 parts In-Stock

1+ parts

$3.993

100+ parts

$3.793

1k+ parts

$3.604

10k+ parts

$3.554

3,651

$3.993

$3.793

$3.604

$3.554

Ampacity Inc.

Singapore . 74,691 parts In-Stock

1+ parts

$4.050

100+ parts

-

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-

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74,691

$4.050

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$4.073

100+ parts

$4.073

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$4.073

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70

$4.073

$4.073

$4.073

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Corphita

USA . 2,876 parts In-Stock

1+ parts

$4.290

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2,876

$4.290

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AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$13.840

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224

$13.840

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Corohmni

South Africa . 185 parts In-Stock

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$15.000

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185

$15.000

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Parana Technologies

USA . 628 parts In-Stock

1+ parts

$26.749

100+ parts

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1k+ parts

$28.127

10k+ parts

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628

$26.749

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$28.127

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Microchip USA

USA . 6,867 parts In-Stock

1+ parts

$28.084

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6,867

$28.084

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DigiPath Technology Company

USA . 1,993 parts In-Stock

1+ parts

$29.454

100+ parts

$27.098

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1,993

$29.454

$27.098

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ChromeModa Solutions

Germany . 6,633 parts In-Stock

1+ parts

$30.055

100+ parts

$24.645

1k+ parts

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6,633

$30.055

$24.645

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IDEA Electronic Components Group

UK . 2,143 parts In-Stock

1+ parts

$30.055

100+ parts

$28.552

1k+ parts

$27.050

10k+ parts

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2,143

$30.055

$28.552

$27.050

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Lixinc

USA . 16,136 parts In-Stock

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16,136

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Overview

Elevate your projects with the MSP430F67641AIPZR by Texas Instruments, a top-tier manufacturer known for delivering cutting-edge technology. This versatile microprocessor circuit offers unmatched performance and reliability, making it ideal for a wide range of applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, this innovative solution provides seamless integration and efficiency. Experience the value of superior quality and advanced features with the MSP430F67641AIPZR, setting you apart from the competition and taking your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easy and flexible integration of the product into various electronic circuits and systems.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, increasing the versatility of the product.

Package Shape: SQUARE

The square package shape helps in efficient utilization of PCB space and facilitates a neat and organized circuit layout.

No. of Terminals: 100

With a high number of terminals, the product can support complex connectivity requirements and interface with multiple external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables a compact design for the product, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power or battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product's reliability and performance in demanding industrial environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption, high performance, and versatility, making it a suitable choice for various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in extreme cold conditions or refrigerated environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and reliability for the product's connections.

ADC Channels: YES

The presence of ADC channels enables the product to convert analog signals into digital data, enhancing its capabilities in data acquisition and processing.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections and facilitates stable and secure mounting of the product on the PCB.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures a compact profile for the product, enabling installation in slim electronic devices or space-restricted enclosures.

RAM Words: 8

With 8 RAM words, the product can store and process a certain amount of data in real-time, which is beneficial for multitasking and memory-intensive applications.

Width: 14 mm

The 14mm width of the product allows for efficient placement on a PCB and contributes to a clean and organized circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow process during manufacturing, resulting in reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables the product to withstand the soldering process and ensures long-term reliability of the connections.

Length: 14 mm

The 14mm length of the product contributes to its compact form factor and allows for efficient PCB layout and space-saving integration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced processing capabilities, connectivity options, and peripheral interfaces for versatile applications.

RAM Bytes: 8192

With 8192 bytes of RAM, the product can efficiently store and manipulate data, providing ample memory capacity for complex algorithms and data processing tasks.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed, and reliable performance, making it suitable for various battery-operated or portable devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering, secure connections, and efficient PCB assembly, ensuring robust electrical performance of the product.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides a standard power input for the product, allowing compatibility with a wide range of electronic systems and power sources.

Bus Compatibility: I2C; SPI; UART

With I2C, SPI, and UART bus compatibility, the product can interface with various communication protocols and devices, enabling seamless connectivity and data exchange.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting of the product on a PCB, facilitating space-efficient designs and enabling miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during storage and handling, ensuring product integrity and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67641AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

8

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67641AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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