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UCD3138ARGCR

Texas Instruments

UCD3138ARGCR by Texas Instruments

UCD3138ARGCR by Texas Instruments is a 64-terminal microprocessor circuit with a max clock frequency of 2 MHz. It operates in automotive-grade temperatures from -40 to 125 °C and supports I2C and UART bus compatibility. This chip carrier package with a very thin profile is suitable for applications requiring high-performance control in harsh environments.

Median Price

$8.810

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,937 parts In-Stock

1+ parts

$8.810

100+ parts

$7.182

1k+ parts

$4.788

10k+ parts

-

9,937

$8.810

$7.182

$4.788

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$8.288

100+ parts

-

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-

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50

$8.288

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-

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Digiode

USA . 1,394 parts In-Stock

1+ parts

$8.370

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-

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1,394

$8.370

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Vyrian

USA . 7,884 parts In-Stock

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7,884

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Chip Stock

USA . 6,900 parts In-Stock

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6,900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 414 parts In-Stock

1+ parts

$6.766

100+ parts

-

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414

$6.766

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-

-

Ampacity Inc.

Singapore . 9,914 parts In-Stock

1+ parts

$7.490

100+ parts

-

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9,914

$7.490

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Corphita

USA . 2,160 parts In-Stock

1+ parts

$7.929

100+ parts

-

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2,160

$7.929

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Continental Prestige Electronics

USA . 1,500 parts In-Stock

1+ parts

$8.288

100+ parts

-

1k+ parts

-

10k+ parts

$8.122

1,500

$8.288

-

-

$8.122

Netroflash

USA . 500 parts In-Stock

1+ parts

$8.288

100+ parts

-

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500

$8.288

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AZTECH Wire

Italy . 162 parts In-Stock

1+ parts

$11.260

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-

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162

$11.260

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Parana Technologies

USA . 920 parts In-Stock

1+ parts

$74.028

100+ parts

$6,874.662

1k+ parts

$66.626

10k+ parts

-

920

$74.028

$6,874.662

$66.626

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DigiPath Technology Company

USA . 1,855 parts In-Stock

1+ parts

$81.514

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1,855

$81.514

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ChromeModa Solutions

Germany . 2,972 parts In-Stock

1+ parts

$83.178

100+ parts

$68.206

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2,972

$83.178

$68.206

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IDEA Electronic Components Group

UK . 2,262 parts In-Stock

1+ parts

$83.178

100+ parts

$79.019

1k+ parts

$74.860

10k+ parts

-

2,262

$83.178

$79.019

$74.860

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Lixinc

USA . 13,729 parts In-Stock

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13,729

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A-Z Elektronik GmbH

Germany . 6,717 parts In-Stock

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6,717

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Argo Parts USA

USA . 3,627 parts In-Stock

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3,627

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Futuretech Components

Singapore . 248 parts In-Stock

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248

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments UCD3138ARGCR. Crafted with precision and expertise, this microprocessor circuit offers unparalleled performance and reliability in a compact and versatile package. Ideal for automotive applications, this chip carrier is designed to maximize efficiency and functionality, ensuring seamless operation even in extreme conditions. Experience the next level of innovation with Texas Instruments and elevate your projects to new heights with the UCD3138ARGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount capability ensures easy and efficient assembly of the product onto circuit boards, saving time and effort in production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product is compatible with a wide range of power sources and can handle higher voltage requirements.

Package Shape: SQUARE

The square package shape provides a compact design, allowing for efficient use of space on the circuit board and easy integration into various systems.

No. of Terminals: 64

Having 64 terminals offers versatility and connectivity options for a range of input and output devices, making the product suitable for complex applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs UCD3138ARGCR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; UART

Maximum Clock Frequency:

2 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

UCD3138ARGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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