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UCD3138ARJAR

Texas Instruments

UCD3138ARJAR by Texas Instruments

UCD3138ARJAR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3-3.6V and ADC channels, it's ideal for various peripheral IC functions in compact designs.

Median Price

$6.992

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,159 parts In-Stock

1+ parts

$6.992

100+ parts

$5.700

1k+ parts

$3.800

10k+ parts

-

8,159

$6.992

$5.700

$3.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,386 parts In-Stock

1+ parts

$6.642

100+ parts

-

1k+ parts

-

10k+ parts

-

3,386

$6.642

-

-

-

Chip Stock

USA . 4,600 parts In-Stock

1+ parts

-

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4,600

-

-

-

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Vyrian

USA . 3,878 parts In-Stock

1+ parts

-

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-

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3,878

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-

-

-

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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600

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,771 parts In-Stock

1+ parts

$5.940

100+ parts

-

1k+ parts

-

10k+ parts

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7,771

$5.940

-

-

-

Corphita

USA . 4,139 parts In-Stock

1+ parts

$6.293

100+ parts

-

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4,139

$6.293

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-

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AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$8.320

100+ parts

-

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397

$8.320

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-

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Corohmni

South Africa . 866 parts In-Stock

1+ parts

$41.248

100+ parts

-

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866

$41.248

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-

-

Parana Technologies

USA . 1,074 parts In-Stock

1+ parts

$42.344

100+ parts

-

1k+ parts

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1,074

$42.344

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-

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DigiPath Technology Company

USA . 1,997 parts In-Stock

1+ parts

$46.625

100+ parts

-

1k+ parts

-

10k+ parts

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1,997

$46.625

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-

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IDEA Electronic Components Group

UK . 1,840 parts In-Stock

1+ parts

$47.577

100+ parts

$45.198

1k+ parts

$42.819

10k+ parts

-

1,840

$47.577

$45.198

$42.819

-

ChromeModa Solutions

Germany . 1,432 parts In-Stock

1+ parts

$47.577

100+ parts

$39.013

1k+ parts

-

10k+ parts

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1,432

$47.577

$39.013

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Kepictronics

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Netroflash

USA . 500 parts In-Stock

1+ parts

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500

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Lixinc

USA . 279 parts In-Stock

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279

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Overview

Discover the cutting-edge UCD3138ARJAR by Texas Instruments, a top-tier manufacturer renowned for its exceptional quality and reliability. This innovative product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. With a package body material made of PLASTIC/EPOXY and a terminal finish of Nickel/Palladium/Gold/Silver, this chip carrier boasts a very thin profile and quad terminal position. Experience seamless performance with a minimum supply voltage of 3V and a maximum operating temperature of 125°C. Elevate your projects with the UCD3138ARJAR's advanced technology and automotive-grade design, providing unmatched value and benefits to customers seeking top-notch solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and cost-effective assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows for flexibility in power requirements for the IC.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on circuit boards.

No. of Terminals: 40

Having 40 terminals enables connectivity to various external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style ensures effective heat dissipation and compact design.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3V allows for operation in low-power scenarios.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in harsh environmental conditions.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of nickel, palladium, gold, and silver terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, expanding the IC's functionality.

Terminal Position: QUAD

The quad terminal position enhances connectivity options and ease of integration in circuit designs.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables compact and slim device designs.

Width: 6 mm

The 6mm width contributes to the IC's compact form factor, suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable and consistent soldering during assembly.

Length: 6 mm

The 6mm length contributes to the overall compact size of the IC, ideal for space-sensitive applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade signifies that the IC can withstand harsh temperature conditions typically encountered in automotive applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type provides high computational capabilities and processing power for various applications.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed operation for efficient performance.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and enhances reliability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V offers stable and consistent power input for the IC.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables high-density mounting and efficient use of space on circuit boards.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that the IC has a moderate level of sensitivity to moisture, suitable for standard handling and storage practices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs UCD3138ARJAR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

UCD3138ARJAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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