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UCD3138A64PFCR

Texas Instruments

UCD3138A64PFCR by Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: TFQFP; Package Shape: SQUARE;

Median Price

$16.052

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,865 parts In-Stock

1+ parts

$16.052

100+ parts

$14.022

1k+ parts

$9.670

10k+ parts

-

3,865

$16.052

$14.022

$9.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$11.458

100+ parts

-

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-

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50

$11.458

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-

-

Digiode

USA . 995 parts In-Stock

1+ parts

$15.249

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-

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995

$15.249

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-

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Vyrian

USA . 9,640 parts In-Stock

1+ parts

-

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9,640

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,340 parts In-Stock

1+ parts

$11.458

100+ parts

-

1k+ parts

-

10k+ parts

$11.229

4,340

$11.458

-

-

$11.229

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$11.458

100+ parts

-

1k+ parts

$10.886

10k+ parts

$10.656

1,000

$11.458

-

$10.886

$10.656

Corohmni

South Africa . 255 parts In-Stock

1+ parts

$12.571

100+ parts

-

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255

$12.571

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Ampacity Inc.

Singapore . 3,711 parts In-Stock

1+ parts

$13.640

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-

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3,711

$13.640

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Corphita

USA . 1,990 parts In-Stock

1+ parts

$14.447

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1,990

$14.447

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$18.670

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570

$18.670

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Parana Technologies

USA . 473 parts In-Stock

1+ parts

$55.658

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473

$55.658

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ChromeModa Solutions

Germany . 6,271 parts In-Stock

1+ parts

$62.537

100+ parts

$51.280

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6,271

$62.537

$51.280

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IDEA Electronic Components Group

UK . 2,311 parts In-Stock

1+ parts

$62.537

100+ parts

$59.410

1k+ parts

$56.283

10k+ parts

-

2,311

$62.537

$59.410

$56.283

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Lixinc

USA . 12,758 parts In-Stock

1+ parts

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12,758

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A-Z Elektronik GmbH

Germany . 5,382 parts In-Stock

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5,382

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Argo Parts USA

USA . 3,967 parts In-Stock

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3,967

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 1,027 parts In-Stock

1+ parts

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100+ parts

$56.383

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1,027

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$56.383

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Kepictronics

USA . 952 parts In-Stock

1+ parts

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952

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs UCD3138A64PFCR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

2 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Words:

65536

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Peripherals:

COMPARATOR(7)

Trade Compliance

UCD3138A64PFCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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