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UCD3138128APFC

Texas Instruments

UCD3138128APFC by Texas Instruments

UCD3138128APFC by Texas Instruments is an 80-terminal microprocessor circuit with a clock frequency of 2MHz. It operates in automotive-grade temperatures (-40 to 125°C) and supports I2C, SPI, and UART bus compatibility. The package style is flatpack with a thin profile and fine pitch, making it suitable for various applications requiring high-performance processing in compact spaces.

Median Price

$26.594

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,247 parts In-Stock

1+ parts

$21.298

100+ parts

$18.604

1k+ parts

$12.830

10k+ parts

-

4,247

$21.298

$18.604

$12.830

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DigiKey

USA . 141 parts In-Stock

1+ parts

$31.890

100+ parts

$24.180

1k+ parts

-

10k+ parts

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141

$31.890

$24.180

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$18.237

100+ parts

-

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50

$18.237

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Digiode

USA . 3,777 parts In-Stock

1+ parts

$20.130

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-

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3,777

$20.130

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Vyrian

USA . 6,987 parts In-Stock

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-

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6,987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,896 parts In-Stock

1+ parts

$18.010

100+ parts

-

1k+ parts

-

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1,896

$18.010

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Continental Prestige Electronics

USA . 2,127 parts In-Stock

1+ parts

$18.237

100+ parts

-

1k+ parts

-

10k+ parts

$17.872

2,127

$18.237

-

-

$17.872

Corphita

USA . 3,876 parts In-Stock

1+ parts

$19.071

100+ parts

-

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3,876

$19.071

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Corohmni

South Africa . 1,895 parts In-Stock

1+ parts

$20.528

100+ parts

-

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10k+ parts

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1,895

$20.528

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Microchip USA

USA . 2,399 parts In-Stock

1+ parts

$57.520

100+ parts

$56.520

1k+ parts

$56.020

10k+ parts

$55.520

2,399

$57.520

$56.520

$56.020

$55.520

Parana Technologies

USA . 2,184 parts In-Stock

1+ parts

$66.819

100+ parts

-

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2,184

$66.819

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DigiPath Technology Company

USA . 924 parts In-Stock

1+ parts

$73.575

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924

$73.575

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ChromeModa Solutions

Germany . 2,776 parts In-Stock

1+ parts

$75.077

100+ parts

$61.563

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10k+ parts

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2,776

$75.077

$61.563

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IDEA Electronic Components Group

UK . 2,048 parts In-Stock

1+ parts

$75.077

100+ parts

$71.323

1k+ parts

$67.569

10k+ parts

-

2,048

$75.077

$71.323

$67.569

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 7,425 parts In-Stock

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7,425

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Argo Parts USA

USA . 5,265 parts In-Stock

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5,265

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Lixinc

USA . 3,205 parts In-Stock

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3,205

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

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300

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Elevate your projects with the UCD3138128APFC by Texas Instruments, a top-tier manufacturer known for excellence in the field of Other Function uPs, uCs & Peripheral ICs. This versatile device, featuring a sleek package style and advanced technology, offers unmatched value and performance. With a wide range of applications from automotive to industrial settings, this product delivers reliability, efficiency, and innovation. Upgrade your designs today with the UCD3138128APFC and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology ensures easy installation and integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input, accommodating a range of applications without risking damage to the product.

Package Shape: SQUARE

Square package shape provides efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 80

Having 80 terminals allows for a high level of connectivity and functionality, enabling the product to support multiple input and output signals.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers compact dimensions and precise terminal spacing, enhancing overall product performance and reliability.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption, making the product energy-efficient and cost-effective.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand elevated thermal conditions, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for use in cold climates or industrial settings with temperature variations.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and overall terminal reliability, ensuring stable connections.

ADC Channels: YES

Analog-to-digital converter channels allow for accurate and precise measurement of analog signals, enhancing the product's versatility in data acquisition applications.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient soldering and connection, improving the product's reliability and ease of assembly.

Maximum Seated Height: 1.2 mm

Low maximum seated height enables a slim profile and compact design, contributing to space-saving and efficient integration within electronic devices.

Width: 12 mm

The width of 12mm offers a balance between compact size and terminal layout, ensuring easy handling and installation in various applications.

Maximum Clock Frequency: 2 MHz

A maximum clock frequency of 2 MHz supports fast data processing and communication, making the product suitable for applications requiring high-speed performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature allows for efficient soldering and rework processes, ensuring product durability and reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C meets industry standards for reliable solder joints, ensuring long-term product performance under thermal stress.

Length: 12 mm

With a length of 12mm, the product offers a compact form factor while accommodating the required number of terminals and functionalities.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product meets stringent temperature and performance requirements, ensuring reliable operation in automotive environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC type enhances the product's computational capabilities and processing speed, supporting advanced applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates secure soldering and mechanical stability, ensuring reliable electrical connections and long-term performance.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V ensures compatibility with common power sources and reduces the risk of electrical stress, enhancing product reliability.

Bus Compatibility: I2C; SPI; UART

Support for I2C, SPI, and UART bus interfaces allows for seamless communication with external devices and peripherals, expanding the product's connectivity options.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the product offers precise terminal spacing for high-density mounting, enabling compact designs and efficient PCB layouts.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product can withstand exposure to moderate humidity levels during storage and handling, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs UCD3138128APFC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

2 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UCD3138128APFC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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