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MSP430F6749IPZR

Texas Instruments

MSP430F6749IPZR by Texas Instruments

MSP430F6749IPZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 100 terminals, operating at up to 25 MHz. It has a supply voltage range of 1.8V to 3.6V and is ideal for industrial applications requiring I2C, SPI, and UART bus compatibility. The package style is FLATPACK with low profile and fine pitch design, suitable for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,467 parts In-Stock

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3,467

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Vyrian

USA . 2,530 parts In-Stock

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2,530

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$8.296

100+ parts

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614

$8.296

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One Stop Electronics

USA . 1,209 parts In-Stock

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$21.000

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1,209

$21.000

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Parana Technologies

USA . 1,752 parts In-Stock

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$24.965

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$25.665

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1,752

$24.965

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$25.665

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DigiPath Technology Company

USA . 63 parts In-Stock

1+ parts

$27.490

100+ parts

$25.291

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63

$27.490

$25.291

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IDEA Electronic Components Group

UK . 2,162 parts In-Stock

1+ parts

$28.051

100+ parts

$26.648

1k+ parts

$25.246

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2,162

$28.051

$26.648

$25.246

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ChromeModa Solutions

Germany . 394 parts In-Stock

1+ parts

$28.051

100+ parts

$23.002

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394

$28.051

$23.002

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Corohmni

South Africa . 5,080 parts In-Stock

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$29.839

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$29.839

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Component Stockers USA

USA . 378 parts In-Stock

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$99.990

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378

$99.990

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Microchip USA

USA . 4,618 parts In-Stock

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Corphita

USA . 2,242 parts In-Stock

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Overview

Unlock the full potential of your projects with the Texas Instruments MSP430F6749IPZR. Crafted with precision and quality in mind, this innovative microprocessor circuit offers unparalleled performance in a compact package. Whether you're designing IoT devices, wearable tech, or industrial applications, this IC is your go-to solution. With a wide operating temperature range and versatile bus compatibility, the MSP430F6749IPZR delivers reliability and efficiency like no other. Trust Texas Instruments to elevate your designs and bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface-mountable allows for easier and more efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input options, accommodating a wider range of power sources.

Package Shape: SQUARE

The square shape of the package provides a compact and space-efficient design, making it ideal for applications with limited space.

No. of Terminals: 100

With a large number of terminals, this product can support complex circuit connections and functionalities, making it versatile for various applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers a sleek and modern design, while also ensuring efficient heat dissipation and signal reliability.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for energy-efficient operation, reducing power consumption and overall operating costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in a variety of settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for use in cold environments or applications where temperature fluctuations are common.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable electrical connections.

Terminal Position: QUAD

The quad terminal position layout allows for easier PCB routing and efficient signal flow, enhancing overall circuit performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height contributes to a compact and slim profile, ideal for applications where space constraints are a concern.

Width: 14 mm

With a moderate width, this product strikes a balance between compactness and functionality, making it versatile for a wide range of applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast data processing and efficient operation, making this product suitable for applications requiring high-speed performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and precise soldering during assembly, contributing to a reliable and robust final product.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the heat of soldering processes, ensuring secure and lasting connections.

Length: 14 mm

The moderate length of the product contributes to a well-balanced size and form factor, suitable for various PCB layouts and enclosure designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade performance, this product is built to withstand rugged environments and demanding applications, ensuring reliability and longevity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type, this product offers advanced processing capabilities and versatile functionality for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, high speed, and noise immunity, making this product efficient and reliable for various electronics applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable performance in the field.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage provides a stable and common power input, ensuring compatibility with a wide range of power sources and devices.

Bus Compatibility: I2C; SPI; UART

Supporting I2C, SPI, and UART bus compatibility, this product can easily interface with a variety of communication protocols, enhancing its interoperability and connectivity.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5 mm, this product offers precise and compact PCB layouts, optimizing space usage and signal integrity for high-performance applications.

Moisture Sensitivity Level (MSL): 3

Having a MSL of 3 indicates that this product has a moderate sensitivity to moisture, making it suitable for use in a variety of environments with controlled humidity levels.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6749IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6749IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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