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MSP430F67621AIPZR

Texas Instruments

MSP430F67621AIPZR by Texas Instruments

MSP430F67621AIPZR by Texas Instruments is a 100-terminal microprocessor circuit with 4096 bytes of RAM. It operates b/w -40 to 85°C, compatible with I2C, SPI, and UART buses. This CMOS technology chip has a low profile package style suitable for industrial applications.

Median Price

$4.709

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,435 parts In-Stock

1+ parts

$4.709

100+ parts

$3.839

1k+ parts

$2.559

10k+ parts

-

8,435

$4.709

$3.839

$2.559

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,512 parts In-Stock

1+ parts

$4.474

100+ parts

-

1k+ parts

-

10k+ parts

-

1,512

$4.474

-

-

-

Vyrian

USA . 7,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,567

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,841 parts In-Stock

1+ parts

$4.238

100+ parts

-

1k+ parts

-

10k+ parts

-

2,841

$4.238

-

-

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AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$18.590

100+ parts

-

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-

10k+ parts

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198

$18.590

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-

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Corohmni

South Africa . 2,899 parts In-Stock

1+ parts

$21.445

100+ parts

-

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-

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2,899

$21.445

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Microchip USA

USA . 1,403 parts In-Stock

1+ parts

$22.680

100+ parts

$22.540

1k+ parts

$22.470

10k+ parts

$22.400

1,403

$22.680

$22.540

$22.470

$22.400

Parana Technologies

USA . 158 parts In-Stock

1+ parts

$65.250

100+ parts

-

1k+ parts

-

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158

$65.250

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-

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DigiPath Technology Company

USA . 133 parts In-Stock

1+ parts

$71.849

100+ parts

$66.101

1k+ parts

-

10k+ parts

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133

$71.849

$66.101

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IDEA Electronic Components Group

UK . 2,135 parts In-Stock

1+ parts

$73.315

100+ parts

$69.649

1k+ parts

$65.984

10k+ parts

-

2,135

$73.315

$69.649

$65.984

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ChromeModa Solutions

Germany . 107 parts In-Stock

1+ parts

$73.315

100+ parts

$60.118

1k+ parts

-

10k+ parts

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107

$73.315

$60.118

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Overview

Looking to enhance your electronic designs with top-notch quality and reliability? Look no further than the MSP430F67621AIPZR by Texas Instruments. With a reputation for excellence in the industry, this versatile microprocessor circuit offers a wide range of applications, from IoT devices to consumer electronics. Experience the benefits of cutting-edge technology and seamless performance with this powerhouse CPU. Upgrade your products today and stay ahead of the competition with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly processes.

Maximum Supply Voltage: 3.6 V

Supporting a maximum supply voltage of 3.6V provides flexibility in power requirements for different applications.

Package Shape: SQUARE

The square package shape helps optimize space utilization on the PCB.

No. of Terminals: 100

Having 100 terminals allows for multiple connections and interface possibilities with other components.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, expanding the range of sensors and inputs that can be interfaced.

RAM Bytes: 4096

With 4096 bytes of RAM, the product can handle a significant amount of data processing and storage efficiently.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the product's overall performance.

Bus Compatibility: I2C; SPI; UART

Supporting multiple bus interfaces such as I2C, SPI, and UART enhances the product's versatility in communication protocols.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67621AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

4

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67621AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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