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MSP430F67621AIPN

Texas Instruments

MSP430F67621AIPN by Texas Instruments

MSP430F67621AIPN by Texas Instruments is an 80-terminal microprocessor circuit with 4096 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications. With a supply voltage range of 1.8-3.6V, this CMOS technology-based IC is suitable for low-profile designs requiring ADC channels and a compact form factor.

Median Price

$6.517

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,082 parts In-Stock

1+ parts

$6.517

100+ parts

$5.313

1k+ parts

$3.542

10k+ parts

-

3,082

$6.517

$5.313

$3.542

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,852 parts In-Stock

1+ parts

$6.191

100+ parts

-

1k+ parts

-

10k+ parts

-

4,852

$6.191

-

-

-

Vyrian

USA . 7,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,263

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,645 parts In-Stock

1+ parts

$5.865

100+ parts

-

1k+ parts

-

10k+ parts

-

4,645

$5.865

-

-

-

AZTECH Wire

Italy . 913 parts In-Stock

1+ parts

$13.800

100+ parts

-

1k+ parts

-

10k+ parts

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913

$13.800

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-

-

Microchip USA

USA . 2,710 parts In-Stock

1+ parts

$17.830

100+ parts

$17.580

1k+ parts

$17.450

10k+ parts

$17.320

2,710

$17.830

$17.580

$17.450

$17.320

Corohmni

South Africa . 3,218 parts In-Stock

1+ parts

$29.437

100+ parts

-

1k+ parts

-

10k+ parts

-

3,218

$29.437

-

-

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Parana Technologies

USA . 683 parts In-Stock

1+ parts

$66.101

100+ parts

-

1k+ parts

-

10k+ parts

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683

$66.101

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-

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DigiPath Technology Company

USA . 2,357 parts In-Stock

1+ parts

$72.786

100+ parts

$66.963

1k+ parts

-

10k+ parts

-

2,357

$72.786

$66.963

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ChromeModa Solutions

Germany . 6,476 parts In-Stock

1+ parts

$74.271

100+ parts

$60.902

1k+ parts

-

10k+ parts

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6,476

$74.271

$60.902

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IDEA Electronic Components Group

UK . 981 parts In-Stock

1+ parts

$74.271

100+ parts

$70.557

1k+ parts

$66.844

10k+ parts

-

981

$74.271

$70.557

$66.844

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QUARKTWIN TECHNOLOGY LTD

USA . 29,407 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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29,407

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F67621AIPN. Designed for a wide range of applications, this versatile microprocessor circuit offers unmatched quality and reliability. With advanced features like ADC channels and a low profile package style, this product delivers exceptional performance in industrial environments. Experience seamless integration with I2C, SPI, and UART bus compatibility, providing endless possibilities for your projects. Elevate your designs with the MSP430 family and discover the value it brings to your innovations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the product, ensuring a long lifespan.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power input, making the product suitable for a variety of applications.

Package Shape: SQUARE

Square package shape facilitates easy mounting and integration into circuit designs.

No. of Terminals: 80

Large number of terminals provide versatility in connecting to other components, enhancing the functionality of the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style ensures efficient use of space on circuit boards and enables high-density designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for power efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures product reliability in various environmental conditions.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making the product suitable for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable performance even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides good conductivity and corrosion resistance, ensuring stable connections.

ADC Channels: YES

Presence of ADC channels enables analog-to-digital conversion, expanding the product's capabilities for sensor interfacing and data processing.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connectivity during installation.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for compact design and streamlined product aesthetics.

RAM Words: 4

4 RAM words provide sufficient memory capacity for processing data and executing instructions efficiently.

Width: 12 mm

Compact 12 mm width enables easy integration into tight spaces and small electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering without overheating the product.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and component bonding during assembly.

Length: 12 mm

12 mm length complements the compact width of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures product resilience in harsh operating environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit peripherals enhance the product's processing capabilities and expand its functionality.

RAM Bytes: 4096

4096 RAM bytes provide ample memory space for storing and accessing data during operation.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable electrical connections.

Nominal Supply Voltage: 3.3 V

Stable 3.3V nominal supply voltage ensures consistent and reliable operation of the product.

Bus Compatibility: I2C; SPI; UART

Compatibility with I2C, SPI, and UART bus interfaces enables seamless communication with other devices, enhancing connectivity options.

Terminal Pitch: 0.5 mm

Fine 0.5mm terminal pitch allows for precise soldering and compact layout design on circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product can withstand moderate exposure to moisture during storage or operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67621AIPN attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

4

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MSP430F67621AIPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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