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MCIMX286DVM4C

NXP Semiconductors

MCIMX286DVM4C by NXP Semiconductors

MCIMX286DVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35V to 1.55V. This low-profile, fine-pitch IC with 289 terminals is ideal for various applications requiring high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

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Vyrian

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Digiode

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Anansix

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Nova Conductors

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Ampacity Inc.

Singapore . 320 parts In-Stock

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AZTECH Wire

Italy . 678 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Corohmni

South Africa . 604 parts In-Stock

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Microchip USA

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Aztec Data Supply Inc.

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Corphita

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UNI Independent Distributors

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Unlock the power of cutting-edge technology with the MCIMX286DVM4C by NXP Semiconductors. This high-quality System on Chip offers unparalleled performance and reliability, making it a top choice for a wide range of applications. From smart home devices to automotive systems, this product delivers exceptional value and benefits to customers looking for innovative solutions. Trust NXP Semiconductors to provide the best in class products that drive efficiency and excellence in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the product on a circuit board, saving time and effort during production.

Maximum Supply Voltage: 1.55 V

The maximum supply voltage of 1.55 V ensures stable and reliable operation of the product within safe voltage limits.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, maximizing the layout options for other components.

No. of Terminals: 289

The high number of terminals provides extensive connectivity options, allowing for versatile usage in various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures high density integration and effective heat dissipation for optimized performance.

Minimum Supply Voltage: 1.35 V

The minimum supply voltage of 1.35 V allows for flexibility in power requirements and energy efficiency, reducing overall power consumption.

Maximum Operating Temperature: 70°C

The high maximum operating temperature of 70°C ensures the product can withstand elevated temperatures in various operating environments without compromising performance.

Minimum Operating Temperature: -20°C

The low minimum operating temperature of -20°C enables reliable operation even in cold conditions, making the product suitable for a wide range of temperature environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and assembly, allowing for efficient installation and connectivity with other components.

Maximum Seated Height: 1.37 mm

The low maximum seated height of 1.37 mm enables a compact form factor, ideal for space-constrained applications and slim device designs.

Width: 14 mm

The 14 mm width provides a balance between compact size and sufficient surface area for component placement, allowing for efficient board layout.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures efficient and reliable soldering during manufacturing processes, enhancing product quality.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for high-temperature soldering, ensuring strong and durable connections between the product and the PCB.

Length: 14 mm

The 14 mm length complements the product's width and seated height, contributing to a well-balanced and space-efficient package size.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates the product is designed for standard operating conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: SYSTEM ON CHIP

The system on chip peripheral IC type offers integrated functionality and reduced external components, simplifying system design and enhancing overall performance.

Technology: CMOS

The CMOS technology ensures low power consumption, high-speed operation, and compatibility with various digital systems, making the product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and facilitates easier assembly during the manufacturing process, enhancing overall product quality and longevity.

Nominal Supply Voltage: 1.45 V

The nominal supply voltage of 1.45 V represents the typical operating voltage, ensuring consistent and stable performance under standard operating conditions.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for compact layout and high-density integration, enabling efficient connectivity and optimized board design.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the product can withstand moderate exposure to moisture during transportation and storage, ensuring product reliability and longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX286DVM4C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.37 mm

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX286DVM4C Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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