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MCIMX6S5EVM10AD

NXP Semiconductors

MCIMX6S5EVM10AD by NXP Semiconductors

MCIMX6S5EVM10AD by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a low profile grid array package. It operates b/w -20 to 105 °C and has a supply voltage range of 1.35V to 1.5V. Ideal for applications requiring high performance and compact design.

Median Price

$47.780

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Verical

USA . 293 parts In-Stock

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$28.631

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Chip1Stop

Japan . 293 parts In-Stock

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$43.700

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$33.900

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Mouser Electronics

USA . 7 parts In-Stock

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$37.420

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DigiKey

USA . 43 parts In-Stock

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$61.380

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$44.677

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Flip Electronics (Authorized)

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Avnet

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Digiode

USA . 1,900 parts In-Stock

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Chip Stock

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Vyrian

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Cyclops Electronics Ltd

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Anansix

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Nova Conductors

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Ampacity Inc.

Singapore . 294 parts In-Stock

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Corohmni

South Africa . 922 parts In-Stock

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Corphita

USA . 4,047 parts In-Stock

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iodParts Technologies Inc.

India . 16,800 parts In-Stock

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

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A-Z Elektronik GmbH

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Netroflash

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Overview

Discover the power and versatility of the MCIMX6S5EVM10AD by NXP Semiconductors, a cutting-edge solution in the world of Other Function uPs, uCs & Peripheral ICs. With a focus on innovation and quality, NXP Semiconductors delivers a product that exceeds expectations. This versatile device opens up a world of possibilities in various applications, offering customers unparalleled value and performance. Explore the endless benefits and advantages that the MCIMX6S5EVM10AD brings to the table, setting a new standard for excellence in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good protection for the integrated circuits inside, making the product durable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic devices, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.5 V

Operating within a maximum supply voltage of 1.5V ensures safe and efficient power consumption, making the product more reliable.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board, maximizing component density and minimizing overall size of the product.

No. of Terminals: 624

624 terminals provide a high level of connectivity options, enabling the product to interface with a wide range of other devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for precise alignment during assembly, ensuring a high level of accuracy and reliability in the final product.

Minimum Supply Voltage: 1.35 V

Having a low minimum supply voltage of 1.35V allows for efficient power consumption and extended battery life, making the product energy-efficient.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the product can withstand higher temperature environments without compromising performance.

Minimum Operating Temperature: -20 °C

A low minimum operating temperature of -20°C ensures that the product can function reliably even in colder environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides excellent conductivity, ensuring a strong and stable connection between the product and other components.

Terminal Position: BOTTOM

Bottom terminal position allows for easier installation and maintenance of the product, reducing the risk of damage during use.

Maximum Seated Height: 1.6 mm

With a low maximum seated height of 1.6mm, the product can be installed in compact spaces without compromising on performance or functionality.

Width: 21 mm

A width of 21mm allows for efficient placement on a circuit board, optimizing use of available space and improving overall design flexibility.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time of 40 seconds at peak reflow temperature ensures proper soldering and bonding during assembly, resulting in a reliable final product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high temperature soldering processes without damage, ensuring a secure and durable joint.

Length: 21 mm

A length of 21mm allows for compact and space-efficient design, making the product suitable for use in small electronic devices.

Peripheral IC Type: SoC

Being a System-on-Chip (SoC) peripheral IC type, the product integrates multiple functions into a single chip, reducing complexity and cost while improving performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

Having a ball terminal form allows for easy connection to other components, ensuring a secure and stable interface for efficient data transfer and communication.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8mm, the product offers high-density packaging, enabling more compact and efficient design of electronic devices.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during storage or handling, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S5EVM10AD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6S5EVM10AD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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