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R3920-CFAB-E1T

Onsemi

R3920-CFAB-E1T by Onsemi

R3920-CFAB-E1T by Onsemi is a CMOS microprocessor circuit with 25 terminals in a rectangular chip carrier package. It operates at temperatures from 0 to 40°C, with a clock frequency of up to 4.218 MHz. Ideal for applications requiring low power consumption and fixed-point processing in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,501 parts In-Stock

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Digiode

USA . 1,132 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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Ampacity Inc.

Singapore . 829 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 1,071 parts In-Stock

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$15.180

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Authorized Procurement Solutions

USA . 7,750 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 5,321 parts In-Stock

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Kulean Microsystems

USA . 4,988 parts In-Stock

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Argo Parts USA

USA . 4,296 parts In-Stock

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TANS Electronics

Latvia . 3,892 parts In-Stock

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SupplyDigital Components

Austria . 2,976 parts In-Stock

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Continental Prestige Electronics

USA . 2,961 parts In-Stock

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Corphita

USA . 2,443 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 725 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 369 parts In-Stock

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Overview

Discover the innovative R3920-CFAB-E1T by Onsemi, a cutting-edge product in the category of Other Function uPs, uCs & Peripheral ICs. Manufactured with precision and expertise, this chip carrier package offers top-notch quality and reliability, making it an ideal choice for various applications. Experience the unparalleled value and benefits of this product, from its wide operating temperature range to its advanced CMOS technology. Unlock new possibilities and achieve superior performance with the R3920-CFAB-E1T - the perfect solution for your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for portable or industrial applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on printed circuit boards, saving time and effort during production.

Maximum Clock Frequency: 4.218 MHz

The high maximum clock frequency enables fast processing speeds and efficient operation of the microprocessor circuit, suitable for applications requiring quick data processing.

Technology: CMOS

The CMOS technology used in the peripheral IC ensures low power consumption, making the product energy-efficient and suitable for battery-powered devices.

Nominal Supply Voltage: 1.25 V

The low nominal supply voltage minimizes power consumption and heat generation, making the product suitable for applications where power efficiency is crucial.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs R3920-CFAB-E1T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

4.218 MHz

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBCC-B25

Length:

5.59 mm

No. of Terminals:

25

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Equivalence Code:

LGA25,3X8,27

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.781 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.686 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.18 mm

Peripheral IC Type:

Trade Compliance

R3920-CFAB-E1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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