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TCI6638K2KDAAW24

Texas Instruments

TCI6638K2KDAAW24 by Texas Instruments

TCI6638K2KDAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and has a peak reflow temperature of 245°C. This IC is ideal for applications requiring high processing power in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,414 parts In-Stock

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8,414

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Digiode

USA . 3,062 parts In-Stock

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3,062

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$5.005

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668

$5.005

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One Stop Electronics

USA . 1,465 parts In-Stock

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$12.000

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1,465

$12.000

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Corohmni

South Africa . 4,881 parts In-Stock

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$51.053

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4,881

$51.053

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Parana Technologies

USA . 1,284 parts In-Stock

1+ parts

$71.806

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1,284

$71.806

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DigiPath Technology Company

USA . 98 parts In-Stock

1+ parts

$79.067

100+ parts

$72.742

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98

$79.067

$72.742

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ChromeModa Solutions

Germany . 5,255 parts In-Stock

1+ parts

$80.681

100+ parts

$66.158

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5,255

$80.681

$66.158

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

1+ parts

$80.681

100+ parts

$76.647

1k+ parts

$72.613

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1,305

$80.681

$76.647

$72.613

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Corphita

USA . 4,004 parts In-Stock

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4,004

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Overview

Enhance your electronic designs with the TCI6638K2KDAAW24 by Texas Instruments, a premium quality microprocessor circuit that offers unparalleled performance and reliability. Texas Instruments, a renowned manufacturer in the industry, ensures top-notch quality and precision engineering in all their products. This versatile device is ideal for a wide range of applications, providing exceptional value and versatility for your projects. Upgrade your systems with the TCI6638K2KDAAW24 and experience cutting-edge technology at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the components inside, making the product resistant to physical damage.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

Enables the product to operate at a higher voltage level, offering flexibility in power supply options.

Package Shape: SQUARE

Allows for compact and space-efficient design, ideal for applications where size constraints are a concern.

No. of Terminals: 1517

Offers a wide range of connectivity options, allowing for multiple input/output configurations in the product.

Package Style (Meter): GRID ARRAY

Provides a structured and organized layout of terminals, facilitating easier connections and troubleshooting.

Minimum Supply Voltage: 0.95 V

Allows for operation at lower voltage levels, leading to energy efficiency and potentially longer battery life.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

Terminal Position: BOTTOM

Facilitates easy and secure attachment to the circuit board, ensuring stable and reliable connections.

Maximum Seated Height: 3.75 mm

Enables a low-profile design, making the product suitable for compact devices or applications with height restrictions.

Width: 40 mm

Provides a balanced size that offers a good compromise between space efficiency and component placement flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering and reflow processes, ensuring reliable and consistent performance of the product.

Peak Reflow Temperature °C: 245

Withstands high reflow temperatures, ensuring the product is resilient to manufacturing processes without compromising functionality.

Length: 40 mm

Maintains a square form factor, contributing to a symmetrical and aesthetically pleasing appearance of the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced processing capabilities, enhancing the product's functionality and performance in complex applications.

Technology: CMOS

Utilizes low power consumption, enabling energy-efficient operation and reducing heat generation in the product.

Terminal Form: BALL

Provides reliable and secure connections, ensuring stable electrical contact between the product and external components.

Nominal Supply Voltage: 1 V

Specifies the standard operating voltage level, ensuring compatibility with a wide range of power sources.

Terminal Pitch: 1 mm

Offers precise spacing between terminals, simplifying assembly and reducing the risk of short circuits or connectivity issues.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection against moisture, making the product suitable for environments with varying humidity levels.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6638K2KDAAW24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6638K2KDAAW24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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