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TCI6636K2HDAAWA24

Texas Instruments

TCI6636K2HDAAWA24 by Texas Instruments

TCI6636K2HDAAWA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at 0.95-1.05 V, has 1517 terminals in a GRID ARRAY package style, and measures 40mm x 40mm. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,914 parts In-Stock

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7,914

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Digiode

USA . 1,803 parts In-Stock

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1,803

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Distributors (Availability)

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AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$18.633

100+ parts

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520

$18.633

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One Stop Electronics

USA . 382 parts In-Stock

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$33.000

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382

$33.000

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Parana Technologies

USA . 681 parts In-Stock

1+ parts

$54.636

100+ parts

$5,073.801

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$49.173

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681

$54.636

$5,073.801

$49.173

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DigiPath Technology Company

USA . 73 parts In-Stock

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$60.161

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73

$60.161

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IDEA Electronic Components Group

UK . 1,106 parts In-Stock

1+ parts

$61.389

100+ parts

$58.320

1k+ parts

$55.250

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1,106

$61.389

$58.320

$55.250

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ChromeModa Solutions

Germany . 298 parts In-Stock

1+ parts

$61.389

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$50.339

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298

$61.389

$50.339

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Corohmni

South Africa . 90 parts In-Stock

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$72.302

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90

$72.302

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Corphita

USA . 828 parts In-Stock

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828

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Overview

Unleash the power of cutting-edge technology with the TCI6636K2HDAAWA24 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This versatile microprocessor circuit is perfect for a wide range of applications, providing seamless performance and efficiency. Say goodbye to limitations and hello to endless possibilities with this innovative solution. Upgrade your projects today with the TCI6636K2HDAAWA24 and experience the unparalleled value it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good electrical insulation and is cost-effective, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.05 V

Can operate efficiently within a specified voltage range, ensuring reliable performance.

Package Shape: SQUARE

Square shape allows for uniform and compact design, optimizing space usage in electronic devices.

No. of Terminals: 1517

Large number of terminals provide flexibility for connecting to various components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers high I/O density and improved thermal performance, enhancing overall functionality.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage requirement enables energy-efficient operation, reducing power consumption.

Terminal Finish: TIN SILVER COPPER

This terminal finish combination enhances conductivity and solderability, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing, simplifying the assembly process.

Maximum Seated Height: 3.75 mm

Low seated height allows for compact and slim device design, ideal for space-constrained applications.

Width: 40 mm

Optimal width dimension provides balance between compactness and component density, making it suitable for various form factors.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow process within a specific time frame, avoiding damage to the components.

Peak Reflow Temperature °C: 245

High peak reflow temperature capability ensures reliable and durable solder joints during assembly.

Length: 40 mm

Square shape with consistent length and width dimensions provides uniformity and ease of integration in PCB layouts.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit enhances the product's processing capabilities, enabling advanced functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, providing efficient and reliable operation.

Terminal Form: BALL

Ball terminal form simplifies the installation process and enhances electrical performance, ensuring secure connections.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation of the product within specified parameters.

Terminal Pitch: 1 mm

Narrow terminal pitch allows for high-density mounting, maximizing PCB real estate and component placement.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates moderate sensitivity to moisture, necessitating proper handling and storage to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6636K2HDAAWA24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6636K2HDAAWA24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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