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OTHER Other Function uPs,uCs & Peripheral ICs 371

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TMS320DM368ZCEF by Texas Instruments

TMS320DM368ZCEF

Texas Instruments

TMS320DM368ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating b/w 0-85 °C. It supports I2C, SPI, UART, USB buses and has a terminal pitch of 0.65 mm. Ideal for applications requiring low profile, fine pitch package style in CMOS technology.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCE by Texas Instruments

TMS320DM368ZCE

Texas Instruments

TMS320DM368ZCE by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses for various applications requiring low profile and fine pitch package style. The processor has a supply voltage range of 1.28-1.8V and features a grid array package with a terminal pitch of 0.65mm.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355ZCE270 by Texas Instruments

TMS320DM355ZCE270

Texas Instruments

TMS320DM355ZCE270 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.365V and RAM words of 32768, suitable for applications requiring high processing power in compact spaces like embedded systems and IoT devices.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUT7 by Texas Instruments

TMS320DM6467CZUT7

Texas Instruments

TMS320DM6467CZUT7 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 0-85°C, it has a supply voltage range of 1.14-3.3V and peak reflow temperature of 245°C. Ideal for applications requiring high processing power in compact designs.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CZUT by Texas Instruments

TMS320DM6467CZUT

Texas Instruments

TMS320DM6467CZUT by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and package style of grid array, fine pitch. Ideal for applications requiring high processing power in compact designs.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMX320DM365BZCE by Texas Instruments

TMX320DM365BZCE

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B338

13 mm

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUT1 by Texas Instruments

TMS320DM6467TZUT1

Texas Instruments

TMS320DM6467TZUT1 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85 °C. It has a max supply voltage of 1.365 V and is suitable for MICROPROCESSOR CIRCUIT applications due to its CMOS technology and fine pitch package style.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6433ZDU4 by Texas Instruments

TMS320DM6433ZDU4

Texas Instruments

TMS320DM6433ZDU4 by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. Operating at 1.14-1.26V, it supports I2C, SPI, UART buses and CMOS technology. Ideal for applications requiring MICROPROCESSOR CIRCUIT in a compact GRID ARRAY package measuring 23x23mm with 376 terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; SPI; UART

FIXED POINT

S-PBGA-B376

e1

23 mm

3

376

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA376,22X22,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.2,1.8,3.3

Not Qualified

20480

2.48 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE135 by Texas Instruments

DM355SDZCE135

Texas Instruments

The Texas Instruments DM355SDZCE135 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE216 by Texas Instruments

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE270 by Texas Instruments

DM355SDZCE270

Texas Instruments

The Texas Instruments DM355SDZCE270 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile, fine pitch package styles in surface mount configurations.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355CZCE216 by Texas Instruments

TMS320DM355CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCE216 by Texas Instruments

TMS320DM355DZCE216

Texas Instruments

TMS320DM355DZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at 1.3V nominal voltage and supports I2C, SPI, UART, and USB buses. Ideal for applications requiring low profile, fine pitch package style in the temperature range of 0-85°C.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCE270 by Texas Instruments

TMS320DM355DZCE270

Texas Instruments

TMS320DM355DZCE270 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85 °C and supports I2C, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT has a package style of GRID ARRAY and is suitable for various applications requiring low profile and fine pitch components.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM355ZCE216 by Texas Instruments

TMX320DM355ZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B337

13 mm

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM355ZCE270 by Texas Instruments

TMX320DM355ZCE270

Texas Instruments

Texas Instruments TMX320DM355ZCE270 is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.365V and RAM words of 32768, suitable for MICROPROCESSOR CIRCUIT applications in various industries.

32

FIXED POINT

S-PBGA-B337

13 mm

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6441AZWT by Texas Instruments

TMS320DM6441AZWT

Texas Instruments

TMS320DM6441AZWT by Texas Instruments is a 32-bit microprocessor with 16384 RAM words, operating at temperatures from 0 to 85°C. It features a package style of grid array, low profile, fine pitch and supports bus compatibility with Ethernet, I2C, SPI, UART, and USB. Ideal for applications requiring high-performance processing in compact spaces.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

HTCM400/EAE,122 by NXP Semiconductors

HTCM400/EAE,122

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: OTHER; No. of Terminals: 27; Maximum Supply Current: 100 mA; Maximum Operating Temperature: 85 Cel; Package Body Material: PLASTIC/EPOXY;

27

85 Cel

-25 Cel

PLASTIC/EPOXY

MODULE,27LEAD,1

MICROELECTRONIC ASSEMBLY

5

Not Qualified

Other uPs/uCs/Peripheral ICs

100 mA

5 V

OTHER

TDA8002CG/C1,518 by NXP Semiconductors

TDA8002CG/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G32

e3

5 mm

3

32

85 Cel

-25 Cel

PLASTIC/EPOXY

LFQFP

QFP32,.28SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3/5

Not Qualified

1.6 mm

Other Microprocessor ICs

140 mA

6.5 V

3 V

3.3 V

YES

CMOS

OTHER

TIN

GULL WING

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

TDA8002CT/A/C1,512 by NXP Semiconductors

TDA8002CT/A/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G28

17.9 mm

28

85 Cel

-25 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

2.65 mm

6.5 V

3 V

3.3 V

YES

CMOS

OTHER

GULL WING

1.27 mm

DUAL

7.5 mm

MICROPROCESSOR CIRCUIT

TDA8002CT/B/C1,512 by NXP Semiconductors

TDA8002CT/B/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G28

17.9 mm

28

85 Cel

-25 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

2.65 mm

6.5 V

3 V

3.3 V

YES

CMOS

OTHER

GULL WING

1.27 mm

DUAL

7.5 mm

MICROPROCESSOR CIRCUIT

TDA8002CT/C/C1,512 by NXP Semiconductors

TDA8002CT/C/C1,512

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e4

17.9 mm

3

28

85 Cel

-25 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

2.65 mm

6.5 V

3 V

3.3 V

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

MICROPROCESSOR CIRCUIT

TDA8002CT/C/C1,518 by NXP Semiconductors

TDA8002CT/C/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e4

17.9 mm

3

28

85 Cel

-25 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

2.65 mm

6.5 V

3 V

3.3 V

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

MICROPROCESSOR CIRCUIT

TMS320DM6446AZWT by Texas Instruments

TMS320DM6446AZWT

Texas Instruments

TMS320DM6446AZWT by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16384 RAM words, and 48-bit external data bus width. Ideal for applications requiring MICROPROCESSOR CIRCUIT technology, such as I2C, SPI, UART, and USB bus compatibility in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6443AZWT by Texas Instruments

TMS320DM6443AZWT

Texas Instruments

TMS320DM6443AZWT by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for applications requiring MICROPROCESSOR CIRCUIT technology, such as Ethernet, I2C, SPI, UART, and USB interfaces in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM335ZCE135 by Texas Instruments

TMS320DM335ZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335ZCE270 by Texas Instruments

TMS320DM335ZCE270

Texas Instruments

TMS320DM335ZCE270 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses and has a supply voltage range of 1.235V to 1.365V. Ideal for applications requiring high-performance computing in compact spaces.

I2C; SPI; UART; USB

32

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.3 mm

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM368ZCEZ by Texas Instruments

DM368ZCEZ

Texas Instruments

The Texas Instruments DM368ZCEZ is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it suitable for various applications requiring low profile, fine pitch GRID ARRAY packages.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM6446ANB6C2127VC by Texas Instruments

DM6446ANB6C2127VC

Texas Instruments

DM6446ANB6C2127VC by Texas Instruments is a microprocessor circuit with a package style of grid array, low profile, fine pitch. It operates at a max supply voltage of 1.26V and has a min operating temperature of 0°C. This IC is commonly used in various applications requiring high-performance processing capabilities.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM6446AZWTKEDACOM by Texas Instruments

DM6446AZWTKEDACOM

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM6446GB6C0121MV by Texas Instruments

DM6446GB6C0121MV

Texas Instruments

DM6446GB6C0121MV by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C, with supply voltage range of 1.14-1.26 V. Ideal for applications requiring low profile and fine pitch technology.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM8147SCIS0 by Texas Instruments

DM8147SCIS0

Texas Instruments

The Texas Instruments DM8147SCIS0 is a MICROPROCESSOR CIRCUIT with 684 terminals in a GRID ARRAY package. It operates b/w 0-90 °C, with a supply voltage range of 3.14-3.47 V. Suitable for applications requiring ETHERNET, I2C, SPI, UART, USB compatibility at speeds up to 1000 rpm.

IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY

ETHERNET; I2C; SPI; UART; USB

48

S-PBGA-B684

e1

23 mm

4

684

90 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.06 mm

1000 rpm

3.47 V

3.14 V

3.3 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

23 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWT2 by Texas Instruments

OMAPL132EZWT2

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138BZWTRB by Texas Instruments

OMAPL138BZWTRB

Texas Instruments

OMAPL138BZWTRB by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.25-1.35V. This SQUARE package has 361 terminals and is ideal for applications requiring low profile, fine pitch ICs in surface mount configurations.

IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCE3 by Texas Instruments

OMAPL138EZCE3

Texas Instruments

OMAPL138EZCE3 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0-90 °C, suitable for applications requiring low power consumption and high processing speed like IoT devices and embedded systems.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

13 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCE4 by Texas Instruments

OMAPL138EZCE4

Texas Instruments

OMAPL138EZCE4 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0-90 °C, with a supply voltage range of 1.25-1.35 V. Ideal for applications requiring I2C, SPI, UART, or USB bus compatibility in a compact GRID ARRAY package style.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

13 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZWT3 by Texas Instruments

OMAPL138EZWT3

Texas Instruments

OMAPL138EZWT3 by Texas Instruments is a low-profile, fine-pitch microprocessor circuit with 361 terminals. It operates at a max clock frequency of 50 MHz and has a data bus width of 32. This versatile IC is compatible with I2C, SPI, UART, and USB buses, making it suitable for various applications requiring high-speed processing.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZWT4 by Texas Instruments

OMAPL138EZWT4

Texas Instruments

The Texas Instruments OMAPL138EZWT4 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0 to 90 °C, suitable for applications requiring I2C, SPI, UART, USB compatibility in a PLASTIC/EPOXY package style.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

SN3490586 by Texas Instruments

SN3490586

Texas Instruments

SN3490586 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.15-1.25 V, making it ideal for low-power applications requiring high performance.

IT ASLO OPERATES IN 1V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.25 V

1.15 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMSDM6446AZWT-COM by Texas Instruments

TMSDM6446AZWT-COM

Texas Instruments

TMSDM6446AZWT-COM by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C with supply voltage range of 1.14-1.26 V, suitable for applications requiring low profile and fine pitch components.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TNETV1647GSTZWT by Texas Instruments

TNETV1647GSTZWT

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

IT ASLO OPERATES IN 1V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.25 V

1.15 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TNETV6446AINZWT8 by Texas Instruments

TNETV6446AINZWT8

Texas Instruments

TNETV6446AINZWT8 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it suitable for various applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TNETV6446AINZWT by Texas Instruments

TNETV6446AINZWT

Texas Instruments

TNETV6446AINZWT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C with supply voltage range of 1.14-1.26 V, making it ideal for low profile applications requiring high processing power and fine pitch connections.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM365ZCES by Texas Instruments

DM365ZCES

Texas Instruments

DM365ZCES by Texas Instruments is a microprocessor circuit with a 32-bit external data bus width. It operates on a supply voltage range of 1.28V to 1.42V and has a max operating temperature of 85°C. This peripheral IC is suitable for applications requiring I2C, SPI, UART, and USB bus compatibility.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM365ZCEW by Texas Instruments

DM365ZCEW

Texas Instruments

The Texas Instruments DM365ZCEW is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it suitable for applications requiring low power consumption and high performance in various electronic devices. Its package style is GRID ARRAY, LOW PROFILE, FINE PITCH, ideal for compact designs that require surface mount technology.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM365ZCEZ by Texas Instruments

DM365ZCEZ

Texas Instruments

The Texas Instruments DM365ZCEZ is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, suitable for I2C, SPI, UART, and USB bus compatibility. It operates b/w 0-85 °C with a supply voltage range of 1.28-1.42 V. The package style is GRID ARRAY with 338 terminals in a SQUARE shape, making it ideal for various embedded applications.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCEZ by Texas Instruments

TMS320DM365ZCEZ

Texas Instruments

TMS320DM365ZCEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C, with supply voltage range of 1.28-1.42 V. Ideal for applications requiring I2C, SPI, UART, USB bus compatibility in a compact GRID ARRAY package style.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMSDM6467CCUT6TAN by Texas Instruments

TMSDM6467CCUT6TAN

Texas Instruments

TMSDM6467CCUT6TAN by Texas Instruments is a MICROPROCESSOR CIRCUIT with 529 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it ideal for high-performance computing applications.

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

3.3 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT