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OTHER Other Function uPs,uCs & Peripheral ICs 371

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MFRC53001T/0FE,518 by NXP Semiconductors

MFRC53001T/0FE,518

NXP Semiconductors

MFRC53001T/0FE,518 by NXP Semiconductors is a microprocessor circuit with a 5V supply and operates b/w -25 °C to 85 °C. It features a compact rectangular package with 32 terminals and supports surface mount technology. Ideal for various peripheral applications, it ensures efficient performance in constrained spaces.

R-PDSO-G32

3

32

85 Cel

-25 Cel

PLASTIC/EPOXY

SOP

SOP32,.4

RECTANGULAR

SMALL OUTLINE

250

5

Not Qualified

Other Microprocessor ICs

40 mA

5 V

YES

OTHER

GULL WING

1.27 mm

DUAL

MICROPROCESSOR CIRCUIT

TDA8026ET/C2,518 by NXP Semiconductors

TDA8026ET/C2,518

NXP Semiconductors

TDA8026ET/C2,518 by NXP Semiconductors is a microprocessor circuit with a 3.3V supply and operates b/w -25 °C to 85 °C. It features a fine pitch grid array package with 64 terminals and supports surface mount technology. Ideal for various embedded applications, it ensures reliable performance in compact designs.

S-PBGA-B64

e1

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

MICROPROCESSOR CIRCUIT

TDA8026ET/C2,551 by NXP Semiconductors

TDA8026ET/C2,551

NXP Semiconductors

NXP Semiconductors TDA8026ET/C2,551 is a MICROPROCESSOR CIRCUIT with 64 terminals and 3.3V supply voltage. It operates b/w -25 to 85°C, suitable for various applications requiring a fine pitch GRID ARRAY package style. With a peak reflow temp of 260°C, it's ideal for SMT assembly in electronics manufacturing.

S-PBGA-B64

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

BALL

.8 mm

BOTTOM

MICROPROCESSOR CIRCUIT

TDA8026ET/C2,557 by NXP Semiconductors

TDA8026ET/C2,557

NXP Semiconductors

TDA8026ET/C2,557 by NXP Semiconductors is a microprocessor circuit in a square grid array package. It operates at 3.3V with a max current of 260mA and supports temperatures from -25 °C to 85 °C. Ideal for compact electronic applications requiring efficient processing.

S-PBGA-B64

2

64

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

260

3.3

Not Qualified

Other Microprocessor ICs

260 mA

3.3 V

YES

OTHER

BALL

.8 mm

BOTTOM

MICROPROCESSOR CIRCUIT

MF0ICU1001W/S7DL,0 by NXP Semiconductors

MF0ICU1001W/S7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified;

70 Cel

-25 Cel

DIE OR CHIP

Not Qualified

Other Microprocessor ICs

OTHER

MICROPROCESSOR CIRCUIT

MF0ICU1001W/U7DL,0 by NXP Semiconductors

MF0ICU1001W/U7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel; Package Equivalence Code: DIE OR CHIP;

70 Cel

-25 Cel

DIE OR CHIP

Not Qualified

Other Microprocessor ICs

OTHER

MICROPROCESSOR CIRCUIT

MF0ICU1101W/U7DL,0 by NXP Semiconductors

MF0ICU1101W/U7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified;

70 Cel

-25 Cel

DIE OR CHIP

Not Qualified

Other Microprocessor ICs

OTHER

MICROPROCESSOR CIRCUIT

MF0ICU1101W/S7DL,0 by NXP Semiconductors

MF0ICU1101W/S7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel; Package Equivalence Code: DIE OR CHIP;

70 Cel

-25 Cel

DIE OR CHIP

Not Qualified

Other Microprocessor ICs

OTHER

MICROPROCESSOR CIRCUIT

TDA8035HN/C1,157 by NXP Semiconductors

TDA8035HN/C1,157

NXP Semiconductors

NXP Semiconductors TDA8035HN/C1,157 is a CMOS microprocessor circuit with 32 terminals. It operates b/w -25 to 85 °C and requires 2.7-5.5 V supply voltage. This chip carrier is ideal for applications needing very thin profile peripheral ICs in surface-mount technology.

S-PQCC-N32

5 mm

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Microprocessor ICs

220 mA

5.5 V

2.7 V

3.3 V

YES

CMOS

OTHER

NO LEAD

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

MFRC52301HN1,151 by NXP Semiconductors

MFRC52301HN1,151

NXP Semiconductors

MFRC52301HN1,151 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3/3.3V with a max temp of 85 °C and features 32 terminals. Ideal for RFID applications, it supports surface mount technology for compact designs.

S-PQCC-N32

e4

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

260

3/3.3

Not Qualified

Other Microprocessor ICs

10 mA

YES

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

MICROPROCESSOR CIRCUIT

MFRC52301HN1,157 by NXP Semiconductors

MFRC52301HN1,157

NXP Semiconductors

MFRC52301HN1,157 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3/3.3V with a max temp of 85 °C and features 32 terminals. Ideal for RFID applications, it supports surface mount technology for compact designs.

S-PQCC-N32

e4

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

260

3/3.3

Not Qualified

Other Microprocessor ICs

10 mA

YES

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

MICROPROCESSOR CIRCUIT

MFRC52201HN1,118 by NXP Semiconductors

MFRC52201HN1,118

NXP Semiconductors

The NXP Semiconductors MFRC52201HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE CHIP CARRIER package. It operates at -25 to 85 °C and requires 3/3.3V power supply. Ideal for applications requiring contactless communication such as RFID systems and access control devices.

S-PQCC-N32

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

260

3/3.3

Not Qualified

Other Microprocessor ICs

100 mA

YES

OTHER

NO LEAD

.5 mm

QUAD

30

MICROPROCESSOR CIRCUIT

MFRC52202HN1,118 by NXP Semiconductors

MFRC52202HN1,118

NXP Semiconductors

The NXP Semiconductors MFRC52202HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals and operates at 3/3.3V. It comes in a PLASTIC/EPOXY square chip carrier package style suitable for surface mount applications. With an operating temperature range of -25 to 85°C, it is ideal for various embedded systems requiring low power consumption.

S-PQCC-N32

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

260

3/3.3

Not Qualified

Other Microprocessor ICs

100 mA

YES

OTHER

NO LEAD

.5 mm

QUAD

30

MICROPROCESSOR CIRCUIT

MFRC63102HN,118 by NXP Semiconductors

MFRC63102HN,118

NXP Semiconductors

MFRC63102HN,118 by NXP Semiconductors is a microprocessor circuit designed for surface mount applications. It operates at 5V with a max supply current of 20mA and withstands temperatures from -25 °C to 85 °C. Ideal for RFID and NFC solutions, it features a compact chip carrier design.

S-PQCC-N32

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

260

5

Not Qualified

Other Microprocessor ICs

20 mA

5 V

YES

OTHER

NO LEAD

.5 mm

QUAD

30

MICROPROCESSOR CIRCUIT

MFRC63102HN,551 by NXP Semiconductors

MFRC63102HN,551

NXP Semiconductors

MFRC63102HN,551 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for RFID applications, it offers reliable performance in compact designs.

S-PQCC-N32

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

5

Not Qualified

Other Microprocessor ICs

20 mA

5 V

YES

OTHER

NO LEAD

.5 mm

QUAD

MICROPROCESSOR CIRCUIT

MFRC63102HN,557 by NXP Semiconductors

MFRC63102HN,557

NXP Semiconductors

MFRC63102HN,557 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for RFID applications, it offers reliable performance in compact designs.

S-PQCC-N32

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

5

Not Qualified

Other Microprocessor ICs

20 mA

5 V

YES

OTHER

NO LEAD

.5 mm

QUAD

MICROPROCESSOR CIRCUIT

MFRC63102HN,518 by NXP Semiconductors

MFRC63102HN,518

NXP Semiconductors

MFRC63102HN,518 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for various peripheral applications, it features surface mount technology.

S-PQCC-N32

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

5

Not Qualified

Other Microprocessor ICs

20 mA

5 V

YES

OTHER

NO LEAD

.5 mm

QUAD

MICROPROCESSOR CIRCUIT

SLRC61002HN,157 by NXP Semiconductors

SLRC61002HN,157

NXP Semiconductors

SLRC61002HN,157 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring reliable performance in harsh environments.

S-PQCC-N32

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

260

3.3/5

Not Qualified

Other Microprocessor ICs

20 mA

YES

OTHER

NO LEAD

.5 mm

QUAD

30

MICROPROCESSOR CIRCUIT

SLRC61002HN,557 by NXP Semiconductors

SLRC61002HN,557

NXP Semiconductors

SLRC61002HN,557 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring efficient processing in tight spaces.

S-PQCC-N32

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

3.3/5

Not Qualified

Other Microprocessor ICs

20 mA

YES

OTHER

NO LEAD

.5 mm

QUAD

MICROPROCESSOR CIRCUIT

SLRC61002HN,551 by NXP Semiconductors

SLRC61002HN,551

NXP Semiconductors

SLRC61002HN,551 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring reliable performance in harsh environments.

S-PQCC-N32

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

3.3/5

Not Qualified

Other Microprocessor ICs

20 mA

YES

OTHER

NO LEAD

.5 mm

QUAD

MICROPROCESSOR CIRCUIT

SLRC61002HN,518 by NXP Semiconductors

SLRC61002HN,518

NXP Semiconductors

SLRC61002HN,518 by NXP Semiconductors is a versatile microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring efficient power management and surface mount design.

S-PQCC-N32

32

85 Cel

-25 Cel

PLASTIC/EPOXY

QCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER

3.3/5

Not Qualified

Other Microprocessor ICs

20 mA

YES

OTHER

NO LEAD

.5 mm

QUAD

MICROPROCESSOR CIRCUIT

PR601HL/C1,557 by NXP Semiconductors

PR601HL/C1,557

NXP Semiconductors

PR601HL/C1,557 by NXP Semiconductors is a microprocessor circuit in a square flatpack with 100 gull-wing terminals. It operates b/w -25 °C and 70 °C and supports power supplies of 3.3V and 5V. Ideal for various embedded applications, it features surface mount technology for efficient integration.

S-PQFP-G100

100

70 Cel

-25 Cel

PLASTIC/EPOXY

QFP

QFP100,.63SQ,20

SQUARE

FLATPACK

3.3,5

Not Qualified

Other Microprocessor ICs

YES

OTHER

GULL WING

.5 mm

QUAD

MICROPROCESSOR CIRCUIT

PN7120A0EV/C10801E by NXP Semiconductors

PN7120A0EV/C10801E

NXP Semiconductors

NXP Semiconductors' PN7120A0EV/C10801E is a 49-terminal IC with 1.8V supply voltage, operating b/w -30°C to 85°C. It features a grid array package style, ball terminal form, and tin silver copper finish. Ideal for applications requiring fine pitch surface mount technology in plastic/epoxy packages.

S-PBGA-B49

e1

3

49

85 Cel

-30 Cel

PLASTIC/EPOXY

FBGA

BGA49,7X7,20

SQUARE

GRID ARRAY, FINE PITCH

260

1.8

Not Qualified

Other uPs/uCs/Peripheral ICs

1.8 V

YES

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

TMS320DM335CZCE216 by Texas Instruments

TMS320DM335CZCE216

Texas Instruments

TMS320DM335CZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3-3.3V, it has a peak reflow temp of 260°C and operates b/w 0-85°C. Ideal for applications requiring a low-profile, fine-pitch grid array package style.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335DZCE135 by Texas Instruments

TMS320DM335DZCE135

Texas Instruments

TMS320DM335DZCE135 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low power consumption and high processing capabilities.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335DZCE216 by Texas Instruments

TMS320DM335DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6441BZWT by Texas Instruments

TMS320DM6441BZWT

Texas Instruments

TMS320DM6441BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words, operating at -40 to 85°C. It supports Ethernet, I2C, SPI, UART, and USB buses for various applications like multimedia systems and industrial automation due to its low profile grid array package.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B316

e1

16 mm

3

316

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.05/1.2,1.8,3.3

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6443BZWT by Texas Instruments

TMS320DM6443BZWT

Texas Instruments

TMS320DM6443BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. It operates at 1.14-1.26 V, suitable for MICROPROCESSOR CIRCUIT applications like ETHERNET, I2C, SPI, UART, and USB interfaces. The package style is GRID ARRAY with low profile and fine pitch design for compact setups.

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B316

e1

16 mm

3

316

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCE48 by Texas Instruments

TMS320DM368ZCE48

Texas Instruments

TMS320DM368ZCE48 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for applications requiring low power consumption and high performance in compact designs.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUT4 by Texas Instruments

TMS320DM6467CCUT4

Texas Instruments

TMS320DM6467CCUT4 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring a MICROPROCESSOR CIRCUIT in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTV by Texas Instruments

TMS320DM6467CCUTV

Texas Instruments

TMS320DM6467CCUTV by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports various bus compatibilities like I2C, PCI, SPI, UART, and USB. Ideal for applications requiring a high-performance microprocessor circuit in a compact square package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUT by Texas Instruments

TMS320DM6467CCUT

Texas Instruments

TMS320DM6467CCUT by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring a fixed-point format and external data bus width of 16 bits.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CGUTA6 by Texas Instruments

TMS320DM6467CGUTA6

Texas Instruments

TMS320DM6467CGUTA6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and uses CMOS technology. Ideal for applications requiring MICROPROCESSOR CIRCUIT in a PLASTIC/EPOXY package style with 529 terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e0

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

220

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN LEAD

BALL

.8 mm

BOTTOM

20

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUT1 by Texas Instruments

TMS320DM6467TCUT1

Texas Instruments

TMS320DM6467TCUT1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It has a supply voltage range of 1.235-1.365 V and supports Ethernet, I2C, SPI, UART, USB buses. Ideal for applications requiring high-speed processing in compact devices.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUT9 by Texas Instruments

TMS320DM6467TCUT9

Texas Instruments

TMS320DM6467TCUT9 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It features 8192 RAM words, 48-bit external data bus width, and supports Ethernet, I2C, SPI, UART & USB. Ideal for applications requiring high-speed processing in a compact form factor.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUT9 by Texas Instruments

TMS320DM6467TZUT9

Texas Instruments

TMS320DM6467TZUT9 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3V, it has a max supply voltage of 1.365V and supports power supplies of 1.8/3.3V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring high performance in a compact form factor, with a package style of GRID ARRAY and FINE PITCH.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

CC3000MODR by Texas Instruments

CC3000MODR

Texas Instruments

CC3000MODR by Texas Instruments is a surface-mount microprocessor circuit with 46 terminals. It operates b/w -20°C to 70°C, with a supply voltage range of 1.8V to 3.6V and max current draw of 275mA. Ideal for IoT devices, wearables, and smart home applications due to its compact size and low power consumption.

SEATED HGT-NOM

R-XXMA-N46

16.3 mm

46

70 Cel

-20 Cel

UNSPECIFIED

LGA46(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.6

Not Qualified

2 mm

Serial IO/Communication Controllers

275 mA

3.6 V

1.8 V

2.7 V

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

13.5 mm

MICROPROCESSOR CIRCUIT

CC3000MOD by Texas Instruments

CC3000MOD

Texas Instruments

CC3000MOD by Texas Instruments is a surface mount microprocessor circuit with 46 terminals. It operates b/w -20°C to 70°C, with a supply voltage range of 1.8V to 3.6V and max current draw of 275mA. Ideal for IoT applications requiring low power consumption and compact design.

SEATED HGT-NOM

R-XXMA-N46

16.3 mm

46

70 Cel

-20 Cel

UNSPECIFIED

LGA46(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.6

Not Qualified

2 mm

Serial IO/Communication Controllers

275 mA

3.6 V

1.8 V

2.7 V

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

13.5 mm

MICROPROCESSOR CIRCUIT

LM8330TME/NOPB by Texas Instruments

LM8330TME/NOPB

Texas Instruments

LM8330TME/NOPB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 128-bit Address Bus Width. It operates b/w -30 to 85 °C, with supply voltage range of 1.62V to 1.98V. Ideal for applications requiring low power consumption and compact design due to its very thin profile and fine pitch package style.

128

S-PBGA-B25

e1

2.01 mm

1

20

20

25

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

BGA25,5X5,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

.03 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.01 mm

MICROPROCESSOR CIRCUIT

LM8330TMX/NOPB by Texas Instruments

LM8330TMX/NOPB

Texas Instruments

LM8330TMX/NOPB by Texas Instruments is a CMOS MICROPROCESSOR CIRCUIT with 128-bit Address Bus Width. It operates b/w -30 to 85 °C, with Supply Voltage ranging from 1.62V to 1.98V. Ideal for applications requiring low power consumption and compact design in electronics industry.

128

S-PBGA-B25

e1

2.01 mm

1

20

20

25

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

BGA25,5X5,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

.03 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.01 mm

MICROPROCESSOR CIRCUIT

XCC3000MOD by Texas Instruments

XCC3000MOD

Texas Instruments

XCC3000MOD by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -20°C to 70°C, with supply voltage ranging from 1.8V to 3.6V. This RECTANGULAR package has 46 terminals and is ideal for IoT applications due to its compact size and low power consumption.

SEATED HGT-NOM

R-XXMA-N46

16.3 mm

46

70 Cel

-20 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.6 V

1.8 V

2.7 V

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

13.5 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTA6 by Texas Instruments

TMS320DM6467CCUTA6

Texas Instruments

TMS320DM6467CCUTA6 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating b/w 0-85°C. It features a 16-bit external data bus width and supports I2C, PCI, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring fixed-point format processing in various industries.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTA by Texas Instruments

TMS320DM6467CCUTA

Texas Instruments

TMS320DM6467CCUTA by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates b/w 0-85°C, supports I2C, PCI, SPI, UART, USB buses and has a supply voltage range of 1.14-1.26V. Ideal for applications requiring high processing power in compact designs.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTV6 by Texas Instruments

TMS320DM6467CCUTV6

Texas Instruments

TMS320DM6467CCUTV6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It has a package style of grid array and fine pitch, with a terminal finish of Sn/Ag/Cu. Ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCEF by Texas Instruments

TMS320DM369ZCEF

Texas Instruments

TMS320DM369ZCEF by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. It operates at temperatures from -40 to 85 °C and supports Ethernet, I2C, SPI, UART, and USB buses. This low-profile IC in a square package is ideal for applications requiring high-speed data processing.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCE by Texas Instruments

TMS320DM369ZCE

Texas Instruments

TMS320DM369ZCE by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating b/w -40 to 85°C. It features 32768 RAM words, 0.65mm terminal pitch, and supports Ethernet, I2C, SPI, UART & USB buses. Ideal for applications requiring low profile grid array packages in CMOS technology.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

M82710-14 by Mindspeed Technologies

M82710-14

Mindspeed Technologies

Mindspeed Technologies' M82710-14 is a CMOS microprocessor circuit with 484 terminals in a grid array package. It operates b/w -25°C to 110°C, suitable for various applications requiring high-performance processing capabilities in compact form factors. The surface-mountable rectangular package makes it ideal for space-constrained designs.

R-PBGA-B484

484

110 Cel

-25 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

TNETX15VEPGE by Texas Instruments

TNETX15VEPGE

Texas Instruments

TNETX15VEPGE by Texas Instruments is a MICROPROCESSOR CIRCUIT with 144 terminals, operating at 3-5V. It features a FLATPACK package style, 0.5mm terminal pitch, and CMOS technology. Ideal for applications requiring low profile and fine pitch components in the temperature range of 0-95°C.

ALSO REQUIRES 5V SUPPLY

S-PQFP-G144

20 mm

144

95 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

NOT SPECIFIED

3.3,5

Not Qualified

1.6 mm

Other Microprocessor ICs

3.6 V

3 V

3.3 V

YES

CMOS

OTHER

GULL WING

.5 mm

QUAD

NOT SPECIFIED

20 mm

MICROPROCESSOR CIRCUIT