Loading...

TMS320DM369ZCE

Texas Instruments

TMS320DM369ZCE by Texas Instruments

TMS320DM369ZCE by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating b/w -40 to 85°C. It features 32768 RAM words, 0.65mm terminal pitch, and supports Ethernet, I2C, SPI, UART & USB buses. Ideal for applications requiring low profile grid array packages in CMOS technology.

Median Price

$29.624

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,570 parts In-Stock

1+ parts

$29.624

100+ parts

$26.332

1k+ parts

$19.362

10k+ parts

-

3,570

$29.624

$26.332

$19.362

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,527 parts In-Stock

1+ parts

$28.143

100+ parts

-

1k+ parts

-

10k+ parts

-

2,527

$28.143

-

-

-

Vyrian

USA . 6,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,887

-

-

-

-

Bristol Electronics

USA . 2,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 486 parts In-Stock

1+ parts

$19.150

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$19.150

-

-

-

Corphita

USA . 856 parts In-Stock

1+ parts

$26.662

100+ parts

-

1k+ parts

-

10k+ parts

-

856

$26.662

-

-

-

Parana Technologies

USA . 2,104 parts In-Stock

1+ parts

$32.869

100+ parts

-

1k+ parts

$113.847

10k+ parts

-

2,104

$32.869

-

$113.847

-

DigiPath Technology Company

USA . 425 parts In-Stock

1+ parts

$36.192

100+ parts

-

1k+ parts

-

10k+ parts

-

425

$36.192

-

-

-

ChromeModa Solutions

Germany . 1,871 parts In-Stock

1+ parts

$36.931

100+ parts

$30.283

1k+ parts

-

10k+ parts

-

1,871

$36.931

$30.283

-

-

IDEA Electronic Components Group

UK . 668 parts In-Stock

1+ parts

$36.931

100+ parts

$35.084

1k+ parts

$33.238

10k+ parts

-

668

$36.931

$35.084

$33.238

-

Corohmni

South Africa . 907 parts In-Stock

1+ parts

$41.821

100+ parts

-

1k+ parts

-

10k+ parts

-

907

$41.821

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$43.164

100+ parts

$39.279

1k+ parts

$35.394

10k+ parts

-

2,500

$43.164

$39.279

$35.394

-

Microchip USA

USA . 1,655 parts In-Stock

1+ parts

$71.074

100+ parts

-

1k+ parts

-

10k+ parts

-

1,655

$71.074

-

-

-

Kepictronics

USA . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

800

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the TMS320DM369ZCE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This versatile product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering a wide range of applications. Experience the value and benefits of this product through its efficient performance, high-speed processing, and seamless integration into various systems. Elevate your projects to new heights with the TMS320DM369ZCE, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable for use in various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

Saves space and allows for efficient layout of components on a PCB.

Bit Size: 32

Provides a high processing capability for handling complex tasks.

Power Supplies (V): 1.35,1.8,3.3

Offers flexibility in power options for different system requirements.

No. of Terminals: 338

Provides ample connectivity options for various peripherals and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact design while maintaining high performance.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in harsh conditions.

Minimum Operating Temperature: -40 °C

Allows for use in a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and corrosion-resistant connection.

Terminal Position: BOTTOM

Facilitates easy PCB layout and soldering.

Maximum Seated Height: 1.3 mm

Helps in designing slim and compact electronic devices.

RAM Words: 32768

Offers a good amount of memory for storage and processing.

Width: 13 mm

Compact size for space-efficient designs.

External Data Bus Width: 32

Allows for high-speed data transfer and efficient communication.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes.

Length: 13 mm

Compact size for space-efficient designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Provides advanced processing capabilities for various applications.

Technology: CMOS

Offers low power consumption and high noise immunity.

Terminal Form: BALL

Facilitates easy soldering and reliable connections.

Bus Compatibility: ETHERNET; I2C; SPI; UART; USB

Supports various communication protocols for flexibility in designs.

Terminal Pitch: 0.65 mm

Allows for fine-pitch mounting and space-saving on PCBs.

Format: FIXED POINT

Suitable for applications requiring fixed-point arithmetic operations.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, making it suitable for diverse environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM369ZCE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

ETHERNET; I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM369ZCE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20