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OTHER Other Function uPs,uCs & Peripheral ICs 371

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX7D3DVK10SC by NXP Semiconductors

MCIMX7D3DVK10SC

NXP Semiconductors

MCIMX7D3DVK10SC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage ranging from 1.045-1.25 V. With 488 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SC by NXP Semiconductors

MCIMX7D3EVK10SC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D7DVM10SC by NXP Semiconductors

MCIMX7D7DVM10SC

NXP Semiconductors

MCIMX7D7DVM10SC by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating b/w 0-95°C. It has a supply voltage range of 1.045-1.25 V and uses BALL terminal form. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

S-PBGA-B541

19 mm

3

541

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,30

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

XCZU11EG-1FFVB1517E by Xilinx

XCZU11EG-1FFVB1517E

Xilinx

XCZU11EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVC1156E by Xilinx

XCZU11EG-1FFVC1156E

Xilinx

XCZU11EG-1FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it's ideal for applications requiring low power consumption and high performance.

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVC1760E by Xilinx

XCZU11EG-1FFVC1760E

Xilinx

XCZU11EG-1FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for applications requiring Other Function uPs,uCs & Peripheral ICs with supply voltage range of 0.825-0.876 V.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVF1517E by Xilinx

XCZU11EG-1FFVF1517E

Xilinx

XCZU11EG-1FFVF1517E by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. This grid array package is ideal for various applications requiring high-performance processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-3FFVB1517E by Xilinx

XCZU11EG-3FFVB1517E

Xilinx

XCZU11EG-3FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-3FFVC1156E by Xilinx

XCZU11EG-3FFVC1156E

Xilinx

XCZU11EG-3FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-3FFVC1760E by Xilinx

XCZU11EG-3FFVC1760E

Xilinx

XCZU11EG-3FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in various electronic devices.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-L2FFVC1156E by Xilinx

XCZU11EG-L2FFVC1156E

Xilinx

The Xilinx XCZU11EG-L2FFVC1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0-110°C, with supply voltage range of 0.698-0.742 V. Ideal for applications requiring high-performance processing in compact form factors.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1156

e1

4

1156

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-L2FFVC1760E by Xilinx

XCZU11EG-L2FFVC1760E

Xilinx

XCZU11EG-L2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w 0-110 °C and has a supply voltage range of 0.698-0.742 V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-L2FFVF1517E by Xilinx

XCZU11EG-L2FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-1FFVB1156E by Xilinx

XCZU15EG-1FFVB1156E

Xilinx

XCZU15EG-1FFVB1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it's ideal for applications requiring high performance and low power consumption.

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-1FFVC900E by Xilinx

XCZU15EG-1FFVC900E

Xilinx

XCZU15EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-3FFVB1156E by Xilinx

XCZU15EG-3FFVB1156E

Xilinx

XCZU15EG-3FFVB1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0 to 100 °C, it's ideal for applications requiring low power consumption and high performance.

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-L2FFVB1156E by Xilinx

XCZU15EG-L2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1156

e1

4

1156

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVB1517E by Xilinx

XCZU17EG-1FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVC1760E by Xilinx

XCZU17EG-1FFVC1760E

Xilinx

XCZU17EG-1FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVD1760E by Xilinx

XCZU17EG-1FFVD1760E

Xilinx

XCZU17EG-1FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-3FFVB1517E by Xilinx

XCZU17EG-3FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-L2FFVC1760E by Xilinx

XCZU17EG-L2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVB1517E by Xilinx

XCZU19EG-1FFVB1517E

Xilinx

XCZU19EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVC1760E by Xilinx

XCZU19EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVD1760E by Xilinx

XCZU19EG-1FFVD1760E

Xilinx

XCZU19EG-1FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, suitable for applications requiring high performance at temperatures ranging from 0 to 100 °C.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVB1517E by Xilinx

XCZU19EG-3FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVC1760E by Xilinx

XCZU19EG-3FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVD1760E by Xilinx

XCZU19EG-3FFVD1760E

Xilinx

XCZU19EG-3FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVE1924E by Xilinx

XCZU19EG-3FFVE1924E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1924

e1

4

1924

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L2FFVB1517E by Xilinx

XCZU19EG-L2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L2FFVC1760E by Xilinx

XCZU19EG-L2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L2FFVD1760E by Xilinx

XCZU19EG-L2FFVD1760E

Xilinx

Xilinx XCZU19EG-L2FFVD1760E is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in GRID ARRAY package style. Operating b/w 0-110 °C, it's ideal for high-performance computing applications.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SBVA484E by Xilinx

XCZU2CG-1SBVA484E

Xilinx

XCZU2CG-1SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for various applications requiring high-performance processing in a compact form factor.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SFVA625E by Xilinx

XCZU2CG-1SFVA625E

Xilinx

XCZU2CG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package with 625 terminals is ideal for various applications requiring high-performance processing capabilities.

R-PBGA-B625

e1

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SFVC784E by Xilinx

XCZU2CG-1SFVC784E

Xilinx

XCZU2CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-L2SFVA625E by Xilinx

XCZU2CG-L2SFVA625E

Xilinx

XCZU2CG-L2SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with 625 terminals in a GRID ARRAY package. It operates b/w 0-110 °C with supply voltage range of 0.698-0.742 V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B625

e1

4

625

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SBVA484E by Xilinx

XCZU2EG-1SBVA484E

Xilinx

XCZU2EG-1SBVA484E by Xilinx is a CMOS PROGRAMMABLE SoC with 484 BALL terminals. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing in compact form factors.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU2EG-1SFVA625E by Xilinx

XCZU2EG-1SFVA625E

Xilinx

XCZU2EG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 625 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for applications requiring low power consumption and high performance in various electronic devices.

R-PBGA-B625

e1

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SFVC784E by Xilinx

XCZU2EG-1SFVC784E

Xilinx

XCZU2EG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. Ideal for applications requiring high-performance computing in compact form factors.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-3SBVA484E by Xilinx

XCZU2EG-3SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-L2SFVC784E by Xilinx

XCZU2EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SBVA484E by Xilinx

XCZU3CG-1SBVA484E

Xilinx

XCZU3CG-1SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 0.825-0.876 V supply voltage range. Suitable for applications requiring high-performance processing in a compact form factor.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVA625E by Xilinx

XCZU3CG-1SFVA625E

Xilinx

XCZU3CG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. With 625 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

R-PBGA-B625

e1

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVC784E by Xilinx

XCZU3CG-1SFVC784E

Xilinx

XCZU3CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L2SBVA484E by Xilinx

XCZU3CG-L2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L2SFVA625E by Xilinx

XCZU3CG-L2SFVA625E

Xilinx

XCZU3CG-L2SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C and has 625 terminals in a GRID ARRAY package style. Suitable for applications requiring high performance uPs/uCs & Peripheral ICs in various industries.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B625

e1

4

625

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-1SBVA484E by Xilinx

XCZU3EG-1SBVA484E

Xilinx

The Xilinx XCZU3EG-1SBVA484E is a programmable SoC with CMOS technology. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3EG-1SFVA625E by Xilinx

XCZU3EG-1SFVA625E

Xilinx

XCZU3EG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 625 terminals in a GRID ARRAY package style. With supply voltage range of 0.825-0.876 V, it's ideal for applications requiring high-performance computing in various industries.

R-PBGA-B625

e1

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT