Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XCZU7EV-3FFVF1517E
Xilinx
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;
R-PBGA-B1517
e1
4
1517
100 Cel
0 Cel
PLASTIC/EPOXY
BGA
RECTANGULAR
GRID ARRAY
245
.927 V
.873 V
.9 V
YES
CMOS
OTHER
Tin/Silver/Copper (Sn/Ag/Cu)
BALL
BOTTOM
30
MICROPROCESSOR CIRCUIT
XCZU7EV-L2FBVB900E
The Xilinx XCZU7EV-L2FBVB900E is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0-110°C, with supply voltage ranging from 0.698-0.742 V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
R-PBGA-B900
900
110 Cel
.742 V
.698 V
.72 V
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
XCZU7EV-L2FFVF1517E
XCZU7EV-L2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C, with supply voltage range of 0.698-0.742 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in various industries.
XCZU9CG-1FFVB1156E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;
R-PBGA-B1156
1156
.876 V
.825 V
.85 V
XCZU9CG-1FFVC900E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;
XCZU9CG-L2FFVC900E
XCZU9EG-1FFVB1156E
XCZU9EG-1FFVB1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in surface mount configurations.
XCZU9EG-3FFVB1156E
XCZU9EG-3FFVB1156E by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 1156 terminals in a GRID ARRAY package. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. Ideal for applications requiring high-performance processing capabilities in various electronic devices.
XCZU9EG-3FFVC900E
The Xilinx XCZU9EG-3FFVC900E is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.873V to 0.927V. This versatile device is ideal for applications requiring high-performance processing capabilities.
XCZU9EG-L2FFVB1156E
LC898123F40XC-VH
Onsemi
LC898123F40XC-VH by Onsemi is a MICROPROCESSOR CIRCUIT with 35 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 2.6V to 3.3V, making it ideal for applications requiring high performance and low power consumption.
R-PBGA-B35
3.22 mm
1
35
85 Cel
-30 Cel
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
260
.45 mm
3.3 V
2.6 V
2.8 V
TIN SILVER COPPER
.4 mm
2.3 mm
AM4372BZDN60
Texas Instruments
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B491
17 mm
3
491
90 Cel
LFBGA
BGA491,25X25,25
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
1.3 mm
1.144 V
1.056 V
1.1 V
.65 mm
SYSTEM ON CHIP
AM4372BZDN80
AM4372BZDN80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.
1.326 V
1.21 V
1.26 V
MCIMX6Y0DVM05AA
NXP Semiconductors
MCIMX6Y0DVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.
S-PBGA-B289
14 mm
289
95 Cel
BGA289,17X17,32
1.32 mm
1.5 V
1.275 V
.8 mm
40
MCIMX6Y1DVK05AA
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B272
9 mm
272
BGA272,17X17,20
1.23 mm
.5 mm
SoC
MCIMX6Y1DVM05AA
MCIMX6Y1DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w 0-95°C, with supply voltage ranging from 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Y2DVM05AA
MCIMX6Y2DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating b/w 0-95°C, it supports a supply voltage range of 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Y7DVK05AA
MCIMX6Y7DVK05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.
MF3ICDH2101DUD/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED;
X-XUUC-N
70 Cel
-25 Cel
UNSPECIFIED
DIE
WAFER
UNCASED CHIP
Not Qualified
Other Microprocessor ICs
NO LEAD
UPPER
MF3ICDH4101DUD/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER;
MF3ICDH8101DUD/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
MF3MODH2101DA4/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; JESD-30 Code: X-PXMA-N;
X-PXMA-N
MICROELECTRONIC ASSEMBLY
MF3MODH2101DA8/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel; Package Body Material: PLASTIC/EPOXY;
MF3MODH4101DA8/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 70 Cel;
MF3MODH8101DA4/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
MF3MODH8101DA8/05
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Maximum Operating Temperature: 70 Cel; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
AM5716AABCD
AM5716AABCD by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, has a supply voltage range of 1.11-1.2V, and features a fine pitch grid array package style. Ideal for applications requiring high-performance computing in compact spaces.
S-PBGA-B760
23 mm
760
FBGA
BGA760,28X28,31
GRID ARRAY, FINE PITCH
250
2.96 mm
1.2 V
1.11 V
1.15 V
AM5718AABCX
AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.
1500 rpm
XCZU11EG-2FFVB1517E
XCZU11EG-2FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in compact designs.
40 mm
3.51 mm
1 mm
XCZU11EG-2FFVC1156E
35 mm
XCZU11EG-2FFVC1760E
XCZU11EG-2FFVC1760E by Xilinx is a CMOS microprocessor circuit with 1760 terminals in a grid array package. Operating b/w 0-100°C, it has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and advanced processing capabilities.
R-PBGA-B1760
42.5 mm
1760
3.71 mm
XCZU11EG-2FFVF1517E
XCZU11EG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, measuring 40x40 mm. Operating b/w 0-100°C, it requires a supply voltage of 0.825-0.876 V and can withstand peak reflow at 245°C for up to 30s.
XCZU15EG-2FFVB1156E
3.42 mm
XCZU15EG-2FFVC900E
31 mm
XCZU17EG-2FFVC1760E
XCZU17EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact form factors.
XCZU17EG-2FFVD1760E
XCZU17EG-2FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high processing power and advanced functionalities in compact designs.
XCZU17EG-2FFVE1924E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: RECTANGULAR;
R-PBGA-B1924
45 mm
1924
XCZU19EG-2FFVC1760E
XCZU19EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact designs.
XCZU19EG-2FFVD1760E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;
XCZU19EG-2FFVE1924E
XCZU19EG-2FFVE1924E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1924 terminals in a GRID ARRAY package style, with a max supply voltage of 0.876 V. Ideal for applications requiring high processing power and efficiency in environments up to 100°C.
XCZU2CG-2SBVA484E
XCZU2CG-2SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high performance and low power consumption in compact designs.
R-PBGA-B484
19 mm
484
2.61 mm
XCZU2CG-2SFVC784E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
S-PBGA-B784
784
3.32 mm
XCZU2EG-2SFVC784E
XCZU3CG-2SFVC784E
XCZU3EG-2SBVA484E
PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
PROGRAMMABLE SoC
XCZU3EG-2SFVA625E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;
R-PBGA-B625
21 mm
625
3.43 mm
XCZU3EG-2SFVC784E
XCZU4CG-2FBVB900E
XCZU4CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.
2.88 mm
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