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LC898123F40XC-VH

Onsemi

LC898123F40XC-VH by Onsemi

LC898123F40XC-VH by Onsemi is a MICROPROCESSOR CIRCUIT with 35 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 2.6V to 3.3V, making it ideal for applications requiring high performance and low power consumption.

Median Price

$4.121

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 59,328 parts In-Stock

1+ parts

-

100+ parts

$3.400

1k+ parts

$3.040

10k+ parts

$2.860

59,328

-

$3.400

$3.040

$2.860

Farnell

UK . 59,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.121

59,328

-

-

-

$4.121

Verical

USA . 47,328 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

$3.800

10k+ parts

$3.575

47,328

-

$4.250

$3.800

$3.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 375 parts In-Stock

1+ parts

$3.591

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$3.591

-

-

-

Flip Electronics

USA . 1,460,000 parts In-Stock

1+ parts

-

100+ parts

-

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1,460,000

-

-

-

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Vyrian

USA . 7,932 parts In-Stock

1+ parts

-

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7,932

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 532 parts In-Stock

1+ parts

$3.402

100+ parts

-

1k+ parts

-

10k+ parts

-

532

$3.402

-

-

-

Corohmni

South Africa . 117 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

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117

$3.780

-

-

-

AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$20.850

100+ parts

-

1k+ parts

-

10k+ parts

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346

$20.850

-

-

-

Microchip USA

USA . 6,618 parts In-Stock

1+ parts

$24.363

100+ parts

-

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-

10k+ parts

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6,618

$24.363

-

-

-

Continental Prestige Electronics

USA . 59,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.260

10k+ parts

-

59,328

-

-

$3.260

-

Perfect Parts

USA . 38,656 parts In-Stock

1+ parts

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38,656

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Futuretech Components

Singapore . 8,000 parts In-Stock

1+ parts

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8,000

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-

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SupplyDigital Components

Austria . 6,095 parts In-Stock

1+ parts

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6,095

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-

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Problanco Electronics

Mexico . 5,246 parts In-Stock

1+ parts

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5,246

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-

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GreenTree Electronics

Israel . 3,757 parts In-Stock

1+ parts

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100+ parts

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3,757

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-

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-

Authorized Procurement Solutions

USA . 3,657 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,657

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-

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TANS Electronics

Latvia . 2,837 parts In-Stock

1+ parts

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2,837

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Kepictronics

USA . 2,350 parts In-Stock

1+ parts

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2,350

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Kulean Microsystems

USA . 2,146 parts In-Stock

1+ parts

-

100+ parts

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2,146

-

-

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UHIMA Technologies

Türkiye . 42 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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42

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-

Overview

Enhance your electronic devices with the cutting-edge LC898123F40XC-VH by Onsemi. As a reputable manufacturer known for top-quality products, Onsemi delivers exceptional performance and reliability. This product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for a wide range of applications. With a compact design and advanced technology, this IC offers tremendous value by providing efficiency, precision, and seamless integration. Upgrade your systems today with the LC898123F40XC-VH and experience the benefits of superior engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and cost-effective solution for the product.

Surface Mount: YES

Allows for easy and efficient mounting on a PCB, saving space and assembly time.

Maximum Supply Voltage: 3.3 V

Can handle higher voltage inputs, providing flexibility in different power supply scenarios.

Package Shape: RECTANGULAR

Facilitates easy integration into PCB layouts and designs.

Minimum Operating Temperature: -30 °C

Ensures reliable operation even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Offers good conductivity and protection against corrosion for the terminals.

Width: 2.3 mm

Compact size allows for space-efficient placement on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper reflow soldering process for reliable connections.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables the product to perform complex processing tasks efficiently.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity for stable operation.

Nominal Supply Voltage: 2.8 V

Ideal operating voltage for efficient power consumption and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LC898123F40XC-VH attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B35

JESD-609 Code:

e1

Length:

3.22 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

35

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.45 mm

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.3 mm

Peripheral IC Type:

Trade Compliance

LC898123F40XC-VH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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