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LC898124EP3XC-MH

Onsemi

LC898124EP3XC-MH by Onsemi

LC898124EP3XC-MH by Onsemi is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -30 to 85 °C, with supply voltage range of 2.6V to 3.3V. This IC is ideal for applications requiring very thin profile and fine pitch package style in electronics design.

Median Price

$4.250

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,900 parts In-Stock

1+ parts

$6.460

100+ parts

$4.180

1k+ parts

$3.770

10k+ parts

-

3,900

$6.460

$4.180

$3.770

-

Rochester

USA . 265,000 parts In-Stock

1+ parts

-

100+ parts

$3.400

1k+ parts

$3.040

10k+ parts

$2.860

265,000

-

$3.400

$3.040

$2.860

Verical

USA . 264,000 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

$3.800

10k+ parts

$3.575

264,000

-

$4.250

$3.800

$3.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 343 parts In-Stock

1+ parts

$3.591

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$3.591

-

-

-

Vyrian

USA . 981 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

-

981

$3.780

-

-

-

Flip Electronics

USA . 269,677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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269,677

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,865 parts In-Stock

1+ parts

$3.402

100+ parts

-

1k+ parts

-

10k+ parts

-

1,865

$3.402

-

-

-

Corohmni

South Africa . 448 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$3.780

-

-

-

Microchip USA

USA . 1,255 parts In-Stock

1+ parts

$30.495

100+ parts

-

1k+ parts

-

10k+ parts

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1,255

$30.495

-

-

-

Kepictronics

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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28,000

-

-

-

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SupplyDigital Components

Austria . 7,945 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,945

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-

-

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,000

-

-

-

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TANS Electronics

Latvia . 4,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,753

-

-

-

-

Kulean Microsystems

USA . 4,727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,727

-

-

-

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Problanco Electronics

Mexico . 1,457 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,457

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-

-

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UHIMA Technologies

Türkiye . 824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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824

-

-

-

-

Overview

Unleash the power of advanced technology with the LC898124EP3XC-MH by Onsemi. Designed for versatility and reliability, this cutting-edge peripheral IC offers unparalleled performance in a compact package. Whether you're looking to enhance your microprocessor circuits or boost the functionality of your uPs and uCs, this product delivers the quality and precision that Onsemi is renowned for. With a wide operating temperature range and low supply voltage requirements, the LC898124EP3XC-MH is the perfect solution for a variety of applications. Elevate your projects to the next level with this innovative component and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to heat and moisture, making this product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto a PCB, saving space and reducing production costs.

Maximum Supply Voltage: 3.3 V

Operating at a maximum supply voltage of 3.3V provides flexibility and compatibility with a wide range of power sources.

Minimum Supply Voltage: 2.6 V

The low minimum supply voltage requirement of 2.6V ensures efficiency and power savings in operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can perform reliably in harsh environmental conditions.

Minimum Operating Temperature: -30 °C

Operating at a minimum temperature of -30 °C allows for use in cold environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of this product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LC898124EP3XC-MH attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B27

JESD-609 Code:

e1

Length:

3.89 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

27

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA27,3X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.33 mm

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.3 mm

Peripheral IC Type:

Trade Compliance

LC898124EP3XC-MH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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