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LC898129DP1XHTBG

Onsemi

LC898129DP1XHTBG by Onsemi

LC898129DP1XHTBG by Onsemi is a MICROPROCESSOR CIRCUIT with 40 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 2.7-3.3 V, supporting I2C and SPI bus compatibility. Ideal for applications requiring low-profile, fine-pitch ICs like smart sensors or IoT devices.

Median Price

$3.400

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,190 parts In-Stock

1+ parts

-

100+ parts

$3.400

1k+ parts

$3.040

10k+ parts

$2.860

4,190

-

$3.400

$3.040

$2.860

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 347 parts In-Stock

1+ parts

$3.591

100+ parts

-

1k+ parts

-

10k+ parts

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347

$3.591

-

-

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Vyrian

USA . 123 parts In-Stock

1+ parts

$3.780

100+ parts

-

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123

$3.780

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Flip Electronics

USA . 64,000 parts In-Stock

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64,000

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 716 parts In-Stock

1+ parts

$3.402

100+ parts

-

1k+ parts

-

10k+ parts

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716

$3.402

-

-

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Corohmni

South Africa . 232 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

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10k+ parts

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232

$3.780

-

-

-

Problanco Electronics

Mexico . 8,169 parts In-Stock

1+ parts

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8,169

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TANS Electronics

Latvia . 6,764 parts In-Stock

1+ parts

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6,764

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Kulean Microsystems

USA . 4,380 parts In-Stock

1+ parts

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4,380

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SupplyDigital Components

Austria . 2,781 parts In-Stock

1+ parts

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2,781

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UHIMA Technologies

Türkiye . 915 parts In-Stock

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915

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Overview

Unleash the power of cutting-edge technology with the LC898129DP1XHTBG by Onsemi. Known for top-quality manufacturing, Onsemi brings you a versatile solution in the category of Other Function uPs,uCs & Peripheral ICs. This product offers unparalleled value and benefits, making it ideal for a wide range of applications. Experience seamless performance, reliability, and innovation like never before with the LC898129DP1XHTBG. Elevate your projects to new heights with this exceptional offering from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.3 V

Can safely operate at a relatively high supply voltage, providing flexibility in power requirements.

Minimum Supply Voltage: 2.7 V

Can operate at a low supply voltage, suitable for applications where power consumption needs to be minimized.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -30 °C

Capable of operating in very low temperatures, suitable for outdoor or harsh environments.

Terminal Finish: TIN SILVER

Provides good conductivity and corrosion resistance, ensuring reliable connections.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly process, ensuring proper soldering of the IC.

Bus Compatibility: I2C, SPI

Supports popular communication protocols, allowing for easy integration with other devices in the system.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LC898129DP1XHTBG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

Bus Compatibility:

I2C, SPI

Maximum Clock Frequency:

1 MHz

JESD-30 Code:

R-PBGA-B40

JESD-609 Code:

e2

Length:

4.15 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA40,4X10,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.35 mm

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

LC898129DP1XHTBG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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