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XCZU4CG-2FBVB900E

Xilinx

XCZU4CG-2FBVB900E by Xilinx

XCZU4CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.

Median Price

$1,905.879

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VNN

France . 488 parts In-Stock

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Modulus Dynamics

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Overview

Unlock the power of innovation with the XCZU4CG-2FBVB900E by Xilinx. As a leader in the industry, Xilinx ensures top-quality products that deliver outstanding performance and reliability. The XCZU4CG-2FBVB900E falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for a wide range of applications. Experience seamless integration, enhanced efficiency, and unprecedented capabilities with this cutting-edge technology. Elevate your projects to new heights with the XCZU4CG-2FBVB900E and embrace endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product.

Surface Mount: YES

Easy installation and space-saving design.

Maximum Supply Voltage: 0.876 V

Can handle high voltage inputs effectively.

Package Shape: RECTANGULAR

Sleek and modern design for easy integration.

No. of Terminals: 900

Allows for versatile connectivity options.

Package Style (Meter): GRID ARRAY

Efficient packaging for high density circuitry.

Minimum Supply Voltage: 0.825 V

Can operate with low power requirements.

Maximum Operating Temperature: 100 °C

Suitable for a wide range of operating environments.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Facilitates easy connection to other components.

Maximum Seated Height: 2.88 mm

Low profile design for compact installations.

Width: 31 mm

Optimal size for fitting in various devices.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for efficient soldering.

Peak Reflow Temperature °C: 245

Can handle high temperature soldering processes.

Length: 31 mm

Balanced dimensions for easy placement in circuits.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Advanced processing capabilities for enhanced performance.

Technology: CMOS

Efficient and low power consumption technology.

Terminal Form: BALL

Facilitates reliable soldering connections.

Nominal Supply Voltage: 0.85 V

Stable voltage supply for consistent performance.

Terminal Pitch: 1 mm

Allows for compact layout of terminals for space efficiency.

Moisture Sensitivity Level (MSL): 4

Designed to withstand moderate moisture exposure.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4CG-2FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.88 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

31 mm

Peripheral IC Type:

Trade Compliance

XCZU4CG-2FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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