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XCZU9EG-3FFVC900E

Xilinx

XCZU9EG-3FFVC900E by Xilinx

The Xilinx XCZU9EG-3FFVC900E is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.873V to 0.927V. This versatile device is ideal for applications requiring high-performance processing capabilities.

Median Price

$5,949.013

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 1,000 parts In-Stock

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Vyrian

USA . 8,423 parts In-Stock

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Ampacity Inc.

Singapore . 297 parts In-Stock

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Semicontronic

India . 1,378 parts In-Stock

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$9.750

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AZTECH Wire

Italy . 819 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

USA . 120 parts In-Stock

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Modulus Dynamics

Lithuania . 1,564 parts In-Stock

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MARBEL Systems

Belgium . 3,002 parts In-Stock

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Corohmni

South Africa . 672 parts In-Stock

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Texas Native Microelectronics

USA . 55 parts In-Stock

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Kenton Components

USA . 884 parts In-Stock

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Microchip USA

USA . 1,394 parts In-Stock

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Continental Prestige Electronics

USA . 4,205 parts In-Stock

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Argo Parts USA

USA . 1,706 parts In-Stock

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$5,889.523

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$5,830.032

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$5,770.542

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Netroflash

USA . 50 parts In-Stock

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Supply Digital

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Qasali Group International

UK . 38 parts In-Stock

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Overview

Elevate your projects to the next level with the XCZU9EG-3FFVC900E by Xilinx. Known for their top-notch quality and innovation, Xilinx delivers cutting-edge solutions in the category of Other Function uPs,uCs & Peripheral ICs. This versatile product offers unbeatable value and benefits, providing customers with superior performance and reliability. Whether you're working on advanced microprocessor circuits or intricate peripheral designs, the XCZU9EG-3FFVC900E is the perfect choice to bring your ideas to life. Experience the Xilinx advantage today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability, making this product a good choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design, making it suitable for compact applications.

Maximum Supply Voltage: 0.927 V

With a high maximum supply voltage, this product can handle power fluctuations effectively, ensuring stable operation.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration into circuit designs, enhancing compatibility with various systems.

No. of Terminals: 900

A high number of terminals provide ample connectivity options, allowing for versatile and customizable configurations.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient signal routing and thermal management, enhancing overall performance.

Minimum Supply Voltage: 0.873 V

The low minimum supply voltage requirement enables energy-efficient operation, making it ideal for power-sensitive applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in cold environments, expanding the range of applications for this product.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of Tin/Silver/Copper provides corrosion resistance and reliable electrical connections, ensuring long-term functionality.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance, offering convenience and ease of use.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature reduces the risk of damage during soldering processes, increasing product reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance enables robust soldering procedures, ensuring secure connections and stable performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities, making it suitable for complex computational tasks.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency and processing speed, making this product a cost-effective and high-performance solution.

Terminal Form: BALL

Ball terminal form provides reliable contact and solder joint strength, improving overall connectivity and durability.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage of 0.9 V ensures stable and consistent power delivery, maximizing the product's performance efficiency.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product is suitable for a wide range of operating environments, including those with varying humidity levels.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU9EG-3FFVC900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU9EG-3FFVC900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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