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XCZU9EG-3FFVB1156E

Xilinx

XCZU9EG-3FFVB1156E by Xilinx

XCZU9EG-3FFVB1156E by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 1156 terminals in a GRID ARRAY package. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. Ideal for applications requiring high-performance processing capabilities in various electronic devices.

Median Price

$6,721.768

Lifecycle Status

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 745 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 585 parts In-Stock

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Semicontronic

India . 962 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 133 parts In-Stock

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MARBEL Systems

Belgium . 83 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 242 parts In-Stock

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Qasali Group International

UK . 67 parts In-Stock

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Microchip USA

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Argo Parts USA

USA . 4,485 parts In-Stock

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$6,587.332

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Continental Prestige Electronics

USA . 3,761 parts In-Stock

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Netroflash

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Supply Digital

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Overview

Experience the next level of performance with the XCZU9EG-3FFVB1156E by Xilinx. As a leader in the industry, Xilinx delivers top-quality products that push boundaries and open up new possibilities. This versatile microprocessor circuit is perfect for a wide range of applications, providing unmatched reliability and efficiency. With its advanced technology and innovative design, the XCZU9EG-3FFVB1156E offers exceptional value and benefits to customers looking for cutting-edge solutions. Upgrade your projects today and unlock the full potential of your creations with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for compact and portable devices.

Surface Mount: YES

Being surface mountable enables easy and efficient assembly of the product on circuit boards, saving space and improving the overall design aesthetics.

Maximum Supply Voltage: 0.927 V

The high maximum supply voltage of 0.927 V allows for reliable and stable operation of the product, ensuring consistent performance in a variety of applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration of the product into existing systems, making it a versatile choice for different projects.

No. of Terminals: 1156

With a large number of terminals, the product offers enhanced connectivity options, allowing for more complex and advanced circuit configurations.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient heat dissipation and improved electrical performance, making the product suitable for high-demanding applications.

Minimum Supply Voltage: 0.873 V

The low minimum supply voltage of 0.873 V ensures energy efficiency and helps in reducing power consumption, making the product environmentally friendly.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, the product can withstand harsh environmental conditions and operate reliably in demanding industrial settings.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the product can function in a wide range of temperature conditions, providing flexibility for various applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper for terminal finish enhances the product's conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the PCB layout and improves signal integrity, contributing to the overall efficiency and effectiveness of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent thermal stress on the product during assembly, ensuring long-term functionality and durability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C enables reliable soldering of the product onto PCBs, ensuring secure connections and stable performance under challenging conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit peripheral IC type, the product offers powerful computing capabilities and advanced features, making it suitable for complex applications that require high-speed processing.

Technology: CMOS

Utilizing CMOS technology enhances the product's energy efficiency, low power consumption, and high noise immunity, making it a reliable and cost-effective choice for various digital applications.

Terminal Form: BALL

The ball terminal form simplifies the assembly process and enhances the product's reliability and robustness, ensuring stable electrical connections in demanding operating conditions.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage of 0.9 V strikes a balance between performance and energy efficiency, making the product suitable for a wide range of applications that require optimized power consumption.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the product is designed to withstand a moderate level of moisture exposure during storage and assembly, ensuring long-term reliability and performance in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU9EG-3FFVB1156E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU9EG-3FFVB1156E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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