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OTHER Other Function uPs,uCs & Peripheral ICs 371

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TMSDM6467CCUT7TAN by Texas Instruments

TMSDM6467CCUT7TAN

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE;

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

3.3 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMSDM6467CCUTV6TAN by Texas Instruments

TMSDM6467CCUTV6TAN

Texas Instruments

TMSDM6467CCUTV6TAN by Texas Instruments is a MICROPROCESSOR CIRCUIT with 529 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it ideal for high-performance computing applications.

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

3.3 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

VCBU65WMCE30 by Texas Instruments

VCBU65WMCE30

Texas Instruments

VCBU65WMCE30 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C and supports I2C, SPI, UART, USB bus compatibility. The package style is GRID ARRAY with 338 terminals in a SQUARE shape measuring 13mm x 13mm.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

VCBU68WMCE30 by Texas Instruments

VCBU68WMCE30

Texas Instruments

VCBU68WMCE30 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 338 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for low-power applications requiring high processing capabilities. The PLASTIC/EPOXY body material and BALL terminal form ensure durability and reliability in various electronic devices.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

VCBUP7CCUT6 by Texas Instruments

VCBUP7CCUT6

Texas Instruments

VCBUP7CCUT6 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it suitable for various applications requiring high performance in a compact GRID ARRAY package style.

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

3.3 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

VCBUP7CT7 by Texas Instruments

VCBUP7CT7

Texas Instruments

VCBUP7CT7 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 529 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it suitable for various applications requiring high performance and reliability in compact designs.

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

3.3 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

VCBUP7TC6 by Texas Instruments

VCBUP7TC6

Texas Instruments

VCBUP7TC6 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 529 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it ideal for low-power applications requiring high processing capabilities.

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

3.3 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

VS3673UNION by Texas Instruments

VS3673UNION

Texas Instruments

VS3673UNION by Texas Instruments is a 338-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 1.28-1.42V. Suitable for I2C, SPI, UART, and USB bus compatibility applications due to its low profile grid array package style.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

VS3674UNION by Texas Instruments

VS3674UNION

Texas Instruments

VS3674UNION by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 338 terminals in a GRID ARRAY package style, suitable for applications requiring low profile and fine pitch components. With a supply voltage range of 1.28V to 1.42V and operating temperature from 0°C to 85°C, it offers versatility in various electronic designs.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SZCE135 by Texas Instruments

DM355SZCE135

Texas Instruments

The Texas Instruments DM355SZCE135 is a 32-bit microprocessor with 337 terminals and 32768 RAM words. Operating b/w 0-85°C, it has a supply voltage range of 1.235-3.3V and peak reflow temperature of 260°C. Ideal for applications requiring a low-profile, fine-pitch grid array package in CMOS technology.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SZCE270 by Texas Instruments

DM355SZCE270

Texas Instruments

Texas Instruments DM355SZCE270 is a 32-bit microprocessor with 337 terminals. Operating b/w 0-85°C, it has a max supply voltage of 1.365V and RAM words of 32768. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467ZUT7 by Texas Instruments

TMS320DM6467ZUT7

Texas Instruments

TMS320DM6467ZUT7 by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. Operating at 1.14-1.26 V, it has a max temp of 85°C and package style of grid array, fine pitch. Ideal for applications requiring high processing power in compact spaces like embedded systems and IoT devices.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

32768

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

OMAP3503DCUS72 by Texas Instruments

OMAP3503DCUS72

Texas Instruments

OMAP3503DCUS72 by Texas Instruments is a System on Chip with 423 terminals, operating at 0-90°C. It has a supply voltage range of 1.71-1.91V and uses CMOS technology. This IC is suitable for applications requiring low profile, fine pitch packages in various electronic devices.

S-PBGA-B423

16 mm

423

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.1,1.2,1.8,1.8/3

Not Qualified

1.4 mm

Graphics Processors

1.91 V

1.71 V

1.8 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

16 mm

SYSTEM ON CHIP

OMAP3515DCBC by Texas Instruments

OMAP3515DCBC

Texas Instruments

OMAP3515DCBC by Texas Instruments is a System on Chip with 515 terminals, operating at 0-90°C. It features supply voltages of 1.1V, 1.8V, and 3.3V for various applications in Other Function uPs,uCs & Peripheral ICs. The package style is grid array with a terminal pitch of 0.5mm, making it suitable for compact electronic devices.

S-PBGA-B515

e1

12 mm

3

515

90 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

BGA515,21X21,25

SQUARE

GRID ARRAY

260

1.1,1.8,3.3

Not Qualified

.9 mm

Graphics Processors

1.89 V

1.71 V

1.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

12 mm

SYSTEM ON CHIP

OMAP3515DCUS by Texas Instruments

OMAP3515DCUS

Texas Instruments

OMAP3515DCUS by Texas Instruments is a System on Chip with 423 terminals, operating at 0-90°C. It features supply voltages of 1.1V, 1.8V, and 3.3V for various applications in Other Function uPs,uCs & Peripheral ICs requiring a compact GRID ARRAY package style with 0.65mm terminal pitch.

S-PBGA-B423

16 mm

423

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY

NOT SPECIFIED

1.1,1.8,3.3

Not Qualified

1.4 mm

Graphics Processors

1.89 V

1.71 V

1.8 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

16 mm

SYSTEM ON CHIP

MCIMX6S5DVM10AD by NXP Semiconductors

MCIMX6S5DVM10AD

NXP Semiconductors

MCIMX6S5DVM10AD by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates on a supply voltage range of 1.35V to 1.5V and has a max operating temperature of 95°C. This IC is commonly used in applications requiring high-performance computing and advanced connectivity capabilities.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6S5EVM10AD by NXP Semiconductors

MCIMX6S5EVM10AD

NXP Semiconductors

MCIMX6S5EVM10AD by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a low profile grid array package. It operates b/w -20 to 105 °C and has a supply voltage range of 1.35V to 1.5V. Ideal for applications requiring high performance and compact design.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6S8DVM10AD by NXP Semiconductors

MCIMX6S8DVM10AD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U5DVM10AD by NXP Semiconductors

MCIMX6U5DVM10AD

NXP Semiconductors

MCIMX6U5DVM10AD by NXP Semiconductors is a System on Chip with 624 terminals, operating at 0-95°C. It features a low profile grid array package style, 0.8mm terminal pitch, and tin silver copper finish. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U8DVM10AD by NXP Semiconductors

MCIMX6U8DVM10AD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8MM1DVTLZAA by NXP Semiconductors

MIMX8MM1DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM1DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM2DVTLZAA by NXP Semiconductors

MIMX8MM2DVTLZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM3DVTLZAA by NXP Semiconductors

MIMX8MM3DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM3DVTLZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM4DVTLZAA by NXP Semiconductors

MIMX8MM4DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM4DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM5DVTLZAA by NXP Semiconductors

MIMX8MM5DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM5DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN1DVTJZAA by NXP Semiconductors

MIMX8MN1DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN1DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN2DVTJZAA by NXP Semiconductors

MIMX8MN2DVTJZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN3DVTJZAA by NXP Semiconductors

MIMX8MN3DVTJZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN4DVTJZAA by NXP Semiconductors

MIMX8MN4DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN4DVTJZAA is a SoC with 486 terminals in a low profile, fine pitch grid array package. It operates b/w 0-95°C with supply voltage range of 0.95-1.05 V. Ideal for applications requiring high performance and compact design in various electronic devices.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN5DVTJZAA by NXP Semiconductors

MIMX8MN5DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN5DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN6DVTJZCA by NXP Semiconductors

MIMX8MN6DVTJZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

14 mm

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

14 mm

SoC

MIMX8MN6DVTJZDA by NXP Semiconductors

MIMX8MN6DVTJZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

14 mm

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

14 mm

SoC

DLPC2607ZVB by Texas Instruments

DLPC2607ZVB

Texas Instruments

DLPC2607ZVB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 176 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high performance and low power consumption.

S-PBGA-B176

e1

3

176

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

AM4376BZDN100 by Texas Instruments

AM4376BZDN100

Texas Instruments

AM4376BZDN100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, has 491 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.272-1.378 V. Ideal for applications requiring low profile, fine pitch ICs in surface mount packages.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4376BZDN80 by Texas Instruments

AM4376BZDN80

Texas Instruments

AM4376BZDN80 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326V. Ideal for applications requiring high performance and compact design.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDN100 by Texas Instruments

AM4378BZDN100

Texas Instruments

AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDN80 by Texas Instruments

AM4378BZDN80

Texas Instruments

AM4378BZDN80 by Texas Instruments is a CMOS system-on-chip with a max supply voltage of 1.326V and a min operating temperature of 0°C. It is used in applications requiring low-profile, fine-pitch grid array packages with 491 terminals.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

CC3000MODT by Texas Instruments

CC3000MODT

Texas Instruments

CC3000MODT by Texas Instruments is a surface-mount microprocessor circuit with 46 terminals. It operates b/w -20°C to 70°C, with a supply voltage range of 2.7V to 4.8V. This CMOS technology-based IC is ideal for applications requiring low power consumption and compact design.

SEATED HGT-NOM

R-XQMA-N46

16.3 mm

46

70 Cel

-20 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

4.8 V

2.7 V

3.6 V

YES

CMOS

OTHER

NO LEAD

QUAD

13.5 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMS2 by Texas Instruments

66AK2L06XCMS2

Texas Instruments

The Texas Instruments 66AK2L06XCMS2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.1V. Ideal for applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMS by Texas Instruments

66AK2L06XCMS

Texas Instruments

The Texas Instruments 66AK2L06XCMS is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.95-1.1 V. This IC, in GRID ARRAY package style, is ideal for applications requiring high processing power in compact designs.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

DLPC3439ZEZ by Texas Instruments

DLPC3439ZEZ

Texas Instruments

DLPC3439ZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 201 terminals in a GRID ARRAY package style, suitable for applications requiring low power consumption and operating temperatures b/w -30 to 85 °C. The IC operates at supply voltages ranging from 1.045V to 1.155V, making it ideal for compact electronic devices.

S-PBGA-B201

13 mm

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

13 mm

MICROPROCESSOR CIRCUIT

DLPC410ZYR by Texas Instruments

DLPC410ZYR

Texas Instruments

DLPC410ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

3 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROPROCESSOR CIRCUIT

DLPC910ZYR by Texas Instruments

DLPC910ZYR

Texas Instruments

DLPC910ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring I2C and USB bus compatibility in a compact 27x27mm grid array package.

I2C; USB

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

3 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

DLPC3438CZEZ by Texas Instruments

DLPC3438CZEZ

Texas Instruments

DLPC3438CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage ranging from 1.045V to 1.155V. Ideal for applications requiring high performance and low power consumption.

S-PBGA-B201

e1

13 mm

3

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DLPC3439CZEZ by Texas Instruments

DLPC3439CZEZ

Texas Instruments

DLPC3439CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 1.045V to 1.155V, making it ideal for applications requiring high performance and low power consumption.

S-PBGA-B201

e1

13 mm

3

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

MCIMX6DP5EYM1AA by NXP Semiconductors

MCIMX6DP5EYM1AA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP5EYM1AA by NXP Semiconductors

MCIMX6QP5EYM1AA

NXP Semiconductors

MCIMX6QP5EYM1AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates b/w -20°C to 105°C, with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

XCZU9EG-1FFVC900E by Xilinx

XCZU9EG-1FFVC900E

Xilinx

XCZU9EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it requires a supply voltage of 0.825-0.876 V. Ideal for applications requiring high-performance processing capabilities.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT