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OMAP3503DCUS72

Texas Instruments

OMAP3503DCUS72 by Texas Instruments

OMAP3503DCUS72 by Texas Instruments is a System on Chip with 423 terminals, operating at 0-90°C. It has a supply voltage range of 1.71-1.91V and uses CMOS technology. This IC is suitable for applications requiring low profile, fine pitch packages in various electronic devices.

Median Price

$44.438

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 537 parts In-Stock

1+ parts

-

100+ parts

$39.500

1k+ parts

$35.340

10k+ parts

$33.260

537

-

$39.500

$35.340

$33.260

DigiKey

USA . 537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

537

-

-

-

-

Verical

USA . 537 parts In-Stock

1+ parts

-

100+ parts

$49.375

1k+ parts

$44.175

10k+ parts

$41.575

537

-

$49.375

$44.175

$41.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,410 parts In-Stock

1+ parts

$41.696

100+ parts

-

1k+ parts

-

10k+ parts

-

2,410

$41.696

-

-

-

DigiKey Marketplace

USA . 537 parts In-Stock

1+ parts

$45.650

100+ parts

-

1k+ parts

-

10k+ parts

-

537

$45.650

-

-

-

Vyrian

USA . 2,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,918

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 90 parts In-Stock

1+ parts

$37.310

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$37.310

-

-

-

Corphita

USA . 3,082 parts In-Stock

1+ parts

$39.501

100+ parts

-

1k+ parts

-

10k+ parts

-

3,082

$39.501

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$42.348

100+ parts

$41.925

1k+ parts

$40.231

10k+ parts

-

1,000

$42.348

$41.925

$40.231

-

Parana Technologies

USA . 171 parts In-Stock

1+ parts

$66.447

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$66.447

-

-

-

DigiPath Technology Company

USA . 1,627 parts In-Stock

1+ parts

$73.167

100+ parts

$67.313

1k+ parts

-

10k+ parts

-

1,627

$73.167

$67.313

-

-

ChromeModa Solutions

Germany . 2,487 parts In-Stock

1+ parts

$74.660

100+ parts

$61.221

1k+ parts

-

10k+ parts

-

2,487

$74.660

$61.221

-

-

IDEA Electronic Components Group

UK . 1,993 parts In-Stock

1+ parts

$74.660

100+ parts

$70.927

1k+ parts

$67.194

10k+ parts

-

1,993

$74.660

$70.927

$67.194

-

Corohmni

South Africa . 3,154 parts In-Stock

1+ parts

$83.987

100+ parts

-

1k+ parts

-

10k+ parts

-

3,154

$83.987

-

-

-

Microchip USA

USA . 118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

118

-

-

-

-

Overview

Experience the cutting-edge technology of the OMAP3503DCUS72 by Texas Instruments, a leading manufacturer known for its superior quality and innovation. This versatile System on Chip offers endless possibilities in various applications within the Other Function uPs,uCs & Peripheral ICs category. With a low profile, fine pitch package style and a wide range of power supplies, this product provides exceptional value and performance to customers looking for reliable solutions. Trust Texas Instruments to deliver excellence with the OMAP3503DCUS72.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.91 V

Offers a safe operating range for the product, protecting it from potential damage.

Package Shape: SQUARE

Square shape helps in efficient use of space on the circuit board.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

Versatile power supply options for different applications and power requirements.

No. of Terminals: 423

Large number of terminals allow for connectivity with other components and peripherals.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Multiple package styles provide flexibility in design and installation options.

Minimum Supply Voltage: 1.71 V

Provides a lower limit for safe operation, ensuring stable performance.

Maximum Operating Temperature: 90 °C

High operating temperature range allows for use in various environments and conditions.

Minimum Operating Temperature: 0 °C

Low operating temperature ensures the product can function in cold conditions as well.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to connect the product to external components.

Maximum Seated Height: 1.4 mm

Low profile design helps in keeping the overall height of the product compact.

Width: 16 mm

Compact width size allows for space-efficient placement on the circuit board.

Length: 16 mm

Square shape and small length contribute to efficient use of space on the board.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions in a single chip reduces the need for external components, saving space and cost.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: BALL

Ball terminal form ensures reliable connections and easy soldering during the assembly process.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent performance in various operating conditions.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high density mounting on the circuit board, saving space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAP3503DCUS72 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B423

Length:

16 mm

No. of Terminals:

423

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.91 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3503DCUS72 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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