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TMS320DM6467ZUT7

Texas Instruments

TMS320DM6467ZUT7 by Texas Instruments

TMS320DM6467ZUT7 by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. Operating at 1.14-1.26 V, it has a max temp of 85°C and package style of grid array, fine pitch. Ideal for applications requiring high processing power in compact spaces like embedded systems and IoT devices.

Median Price

$117.461

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 369 parts In-Stock

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-

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$104.410

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$93.420

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$87.930

369

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$93.420

$87.930

Verical

USA . 332 parts In-Stock

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$130.512

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$116.775

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$109.912

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$116.775

$109.912

DigiKey

USA . 329 parts In-Stock

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Digiode

USA . 334 parts In-Stock

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$110.210

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DigiKey Marketplace

USA . 769 parts In-Stock

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$120.650

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Vyrian

USA . 2,846 parts In-Stock

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Connector Distribution Corp

USA . 10 parts In-Stock

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Right Parts Inc.

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LWI Electronics Inc

India . 6 parts In-Stock

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Parana Technologies

USA . 703 parts In-Stock

1+ parts

$33.757

100+ parts

-

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$133.024

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703

$33.757

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$133.024

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DigiPath Technology Company

USA . 1,508 parts In-Stock

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$37.170

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$37.170

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ChromeModa Solutions

Germany . 5,641 parts In-Stock

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$37.929

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$31.102

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$37.929

$31.102

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IDEA Electronic Components Group

UK . 352 parts In-Stock

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$37.929

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$36.033

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$34.136

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$37.929

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$34.136

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Corohmni

South Africa . 1,854 parts In-Stock

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$68.263

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Corphita

USA . 3,914 parts In-Stock

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$104.409

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$104.409

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Microchip USA

USA . 418 parts In-Stock

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$125.420

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$122.080

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$120.410

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$118.730

418

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$122.080

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$118.730

A-Z Elektronik GmbH

Germany . 6,756 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,274 parts In-Stock

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GreenTree Electronics

Israel . 900 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Overview

Experience unparalleled performance and reliability with the TMS320DM6467ZUT7 by Texas Instruments, a leading manufacturer known for top-notch quality. This cutting-edge microprocessor circuit is perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. With its advanced technology and versatile features, this product offers exceptional value and benefits to customers looking for high-speed processing, efficient power management, and seamless integration. Upgrade your projects with the TMS320DM6467ZUT7 and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring reliable performance over time.

Surface Mount: YES

Surface mounting allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.26 V

The product can operate efficiently within this voltage range, offering stability and performance under varying power conditions.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board, enabling compact and organized designs.

Bit Size: 32

A 32-bit architecture provides high processing capabilities, allowing for complex operations and calculations to be performed quickly and effectively.

Power Supplies (V): 1.2, 1.8, 3.3

The product supports multiple voltage options, giving flexibility in power requirements for different applications.

No. of Terminals: 529

The large number of terminals allows for multiple connections and interfaces, enhancing the product's versatility for various connectivity needs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design enable precise placement on a circuit board, enhancing reliability and signal integrity.

Minimum Supply Voltage: 1.14 V

Even at low supply voltages, the product can maintain functionality, ensuring consistent performance under varying power conditions.

Maximum Operating Temperature: 85 °C

The product can operate effectively at high temperatures, making it suitable for demanding industrial or automotive applications.

Minimum Operating Temperature: 0 °C

The product can operate in cold environments without compromising performance, providing reliability in a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

The use of multiple finish materials on the terminals enhances conductivity and corrosion resistance, ensuring stable connections over time.

Terminal Position: BOTTOM

Bottom terminal positioning allows for easy soldering and connection to the circuit board, simplifying assembly processes.

Maximum Seated Height: 3.3 mm

The low seated height of the product minimizes space requirements on the circuit board, enabling compact and efficient design layouts.

RAM Words: 32768

With a large RAM capacity, the product can store and process a significant amount of data, facilitating complex operations and multitasking.

Width: 19 mm

The compact width of the product allows for space-efficient placement on a circuit board, enabling dense and organized electronic designs.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for a sufficient duration, ensuring reliable soldering and assembly processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance of the product enables safe and effective soldering processes, contributing to overall product reliability.

Length: 19 mm

The compact length of the product allows for space-efficient placement on a circuit board, enabling streamlined and organized electronic layouts.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities, enabling advanced functions and features to be implemented.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making the product energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminals offer reliable connections and easy soldering, ensuring robust electrical interfaces for the product.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures consistent and stable power delivery to the product, promoting reliable and efficient operation.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for precise connections and compact layout designs, enhancing the product's overall performance and reliability.

Format: FIXED POINT

The fixed-point format enables accurate and efficient arithmetic operations, ensuring precise calculations and data processing capabilities.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates a moderate level of sensitivity to moisture, requiring standard handling and storage practices to maintain product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467ZUT7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467ZUT7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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