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XCZU11EG-3FFVC1760E

Xilinx

XCZU11EG-3FFVC1760E by Xilinx

XCZU11EG-3FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in various electronic devices.

Median Price

$9,724.848

Lifecycle Status

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1k+

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VNN

France . 758 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

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Ampacity Inc.

Singapore . 1,060 parts In-Stock

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AZTECH Wire

Italy . 629 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Semicontronic

India . 1,314 parts In-Stock

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$32.980

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One Stop Electronics

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Corohmni

South Africa . 672 parts In-Stock

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MARBEL Systems

Belgium . 455 parts In-Stock

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Texas Native Microelectronics

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Modulus Dynamics

Lithuania . 1,043 parts In-Stock

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Kenton Components

USA . 40 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

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Supply Digital

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Argo Parts USA

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Qasali Group International

UK . 24 parts In-Stock

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$166.339

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Overview

Experience the cutting-edge innovation of the XCZU11EG-3FFVC1760E by Xilinx, a leading manufacturer in the field of Other Function uPs,uCs & Peripheral ICs. This high-quality product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From microprocessor circuits to advanced technology solutions, this versatile device provides exceptional value and benefits to customers seeking top-notch functionality and efficiency. Upgrade your projects with the XCZU11EG-3FFVC1760E and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards.

Maximum Supply Voltage: 0.927 V

The high maximum supply voltage ensures reliable performance under different operating conditions.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard mounting techniques and layouts.

No. of Terminals: 1760

Having a large number of terminals allows for increased connectivity and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient heat dissipation and mechanical stability.

Minimum Supply Voltage: 0.873 V

The low minimum supply voltage ensures energy efficiency and reliable operation.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple finishes ensures good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connection to the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature helps prevent damage to the product during manufacturing.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and reliability of connections.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type enables advanced computing capabilities and processing power.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form provides reliable connections and ease of soldering.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage ensures stable and consistent operation of the product.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates moderate sensitivity to moisture, which is acceptable for most manufacturing environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-3FFVC1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-3FFVC1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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