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XCZU11EG-L2FFVC1760E

Xilinx

XCZU11EG-L2FFVC1760E by Xilinx

XCZU11EG-L2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w 0-110 °C and has a supply voltage range of 0.698-0.742 V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.

Median Price

$7,991.982

Lifecycle Status

Suppliers In-Stock

5

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1k+

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Nova Conductors

Japan . 96 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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VNN

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AZTECH Wire

Italy . 461 parts In-Stock

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$11.165

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One Stop Electronics

USA . 1,199 parts In-Stock

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Ampacity Inc.

Singapore . 1,484 parts In-Stock

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Semicontronic

India . 1,025 parts In-Stock

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$19.500

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$19.400

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MARBEL Systems

Belgium . 1,238 parts In-Stock

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Texas Native Microelectronics

USA . 50 parts In-Stock

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Kenton Components

USA . 755 parts In-Stock

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$31.366

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Aztec Data Supply Inc.

USA . 4,154 parts In-Stock

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$50.720

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Qasali Group International

UK . 928 parts In-Stock

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Corohmni

South Africa . 1,139 parts In-Stock

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Modulus Dynamics

Lithuania . 1,152 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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$7,832.143

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$7,518.857

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Argo Parts USA

USA . 3,475 parts In-Stock

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$7,991.982

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$7,912.063

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$7,832.143

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$7,752.223

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$7,752.223

Continental Prestige Electronics

USA . 2,631 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Vigor

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Corphita

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Overview

Upgrade your electronic projects with the XCZU11EG-L2FFVC1760E by Xilinx, a top-quality microprocessor circuit that promises exceptional performance and reliability. Manufactured by Xilinx, a trusted industry leader, this product offers endless possibilities for innovative designs in various applications. With its advanced technology and versatile package style, this powerful component ensures seamless integration and optimal functionality. Elevate your creations with the XCZU11EG-L2FFVC1760E and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making it a reliable choice.

Surface Mount: YES

The surface mount design makes it easy to integrate into PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.742 V

With a high maximum supply voltage, this product can handle fluctuations in power without compromising performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, optimizing the layout of the system.

No. of Terminals: 1760

The large number of terminals ensures compatibility with various connections, offering versatility in application.

Package Style (Meter): GRID ARRAY

The grid array package style provides stability and secure connections, enhancing the overall reliability of the product.

Minimum Supply Voltage: 0.698 V

The low minimum supply voltage allows for energy-efficient operation and extends the overall lifespan of the product.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring consistent performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation even in colder environments, making it suitable for a wide range of applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish provides corrosion resistance and ensures strong connections, enhancing the longevity of the product.

Terminal Position: BOTTOM

The bottom terminal position simplifies the assembly process and ensures secure placement on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

This short peak reflow time minimizes the risk of damage to the product during assembly, ensuring a high-quality end result.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for efficient soldering, resulting in durable connections that withstand temperature fluctuations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The peripheral IC type enhances the functionality of the product, offering advanced features and capabilities.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making it an efficient and reliable choice for various applications.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and ensures secure connections, enhancing the overall reliability of the product.

Nominal Supply Voltage: 0.72 V

The nominal supply voltage ensures consistent and stable power delivery, optimizing the performance of the product.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 indicates that this product can withstand moderate exposure to moisture, making it suitable for a variety of environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-L2FFVC1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-L2FFVC1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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